Abstract: A method of manufacturing a nitride semiconductor device includes: forming, on or above a p-type nitride semiconductor tunnel junction layer, a first n-type nitride semiconductor layer that forms a tunnel junction with the p-type nitride semiconductor tunnel junction layer, the first n-type nitride semiconductor layer having a first impurity concentration and a first thickness; forming, on or above the first n-type nitride semiconductor layer, in a nitrogen atmosphere, a second n-type nitride semiconductor layer having a second n-type impurity concentration less than the first n-type impurity concentration and a second thickness; and forming, on or above the second n-type nitride semiconductor layer, in a hydrogen atmosphere, a third n-type nitride semiconductor layer having a third n-type impurity concentration less than the first n-type impurity concentration and a third thickness.

Abstract: A light-emitting device includes: a first light-emitting element portion including: an n-side nitride semiconductor layer, a first light-emitting layer disposed on the n-side nitride semiconductor layer, and a first p-side nitride semiconductor layer disposed on the first light-emitting layer; a second light-emitting element portion including: a second light-emitting layer disposed on the n-side nitride semiconductor layer, and a second p-side nitride semiconductor layer disposed on the second light-emitting layer; an n-side electrode connected to the n-side nitride semiconductor layer; a first p-side electrode disposed on the first p-side nitride semiconductor layer via an upper n-type semiconductor layer disposed on the first p-side semiconductor layer; and a second p-side electrode connected to the second p-side nitride semiconductor layer. A composition of the second light-emitting layer is different from a composition of the first light-emitting layer.

Abstract: A light-emitting element includes: a semiconductor stack including: a first light-emitting unit comprising nitride semiconductors including a first n-side semiconductor layer, a first p-side semiconductor layer, and a first active layer disposed between the first n-side semiconductor layer and the first p-side semiconductor layer, a second light-emitting unit comprising nitride semiconductors including a second n-side semiconductor layer, a second p-side semiconductor layer, and a second active layer disposed between the second n-side semiconductor layer and the second p-side semiconductor layer, and a tunnel junction layer disposed between the first p-side semiconductor layer and the second n-side semiconductor layer; an n-side electrode electrically connected to the first n-side semiconductor layer; and a p-side electrode electrically connected to the second p-side semiconductor layer.

Abstract: A light-emitting device includes: a first light-emitting element portion including: an n-side nitride semiconductor layer, a first light-emitting layer disposed on the n-side nitride semiconductor layer, and a first p-side nitride semiconductor layer disposed on the first light-emitting layer; a second light-emitting element portion including: a second light-emitting layer disposed on the n-side nitride semiconductor layer, and a second p-side nitride semiconductor layer disposed on the second light-emitting layer; an n-side electrode connected to the n-side nitride semiconductor layer; a first p-side electrode disposed on the first p-side nitride semiconductor layer via an upper n-type semiconductor layer disposed on the first p-side semiconductor layer; and a second p-side electrode connected to the second p-side nitride semiconductor layer. A composition of the second light-emitting layer is different from a composition of the first light-emitting layer.

Abstract: A light-emitting device includes: a first light-emitting element portion including: an n-side nitride semiconductor layer, a first light-emitting layer over the n-side nitride semiconductor layer, and a first p-side nitride semiconductor layer over the first light-emitting layer; a second light-emitting element portion including: a second light-emitting layer over the n-side nitride semiconductor layer, and a second p-side nitride semiconductor layer over the second light-emitting layer; an n-side electrode connected to the n-side nitride semiconductor layer; a first p-side electrode disposed over the first p-side nitride semiconductor layer via an upper n-type semiconductor layer; and a second p-side electrode connected to the second p-side nitride semiconductor layer. The first p-side nitride semiconductor layer and the upper n-type semiconductor layer form a tunnel junction.

Abstract: A light-emitting device includes: a first light-emitting element portion including: an n-side nitride semiconductor layer, a first light-emitting layer over the n-side nitride semiconductor layer, and a first p-side nitride semiconductor layer over the first light-emitting layer; a second light-emitting element portion including: a second light-emitting layer over the n-side nitride semiconductor layer, and a second p-side nitride semiconductor layer over the second light-emitting layer; an n-side electrode connected to the n-side nitride semiconductor layer; a first p-side electrode disposed over the first p-side nitride semiconductor layer via an upper n-type semiconductor layer; and a second p-side electrode connected to the second p-side nitride semiconductor layer. The first p-side nitride semiconductor layer and the upper n-type semiconductor layer form a tunnel junction.

Abstract: A method of manufacturing a light-emitting device includes: growing a layered structure on a substrate, the layered structure comprising an n-side nitride semiconductor layer, a first light-emitting layer, and a first p-side nitride semiconductor layer; growing an upper n-type semiconductor layer over the first p-side nitride semiconductor layer; forming a protective film over the upper n-type semiconductor layer, the protective film containing an element that functions as an n-type impurity for the upper n-type semiconductor layer; heating at least the upper n-type semiconductor layer and the protective film; at least partially removing the protective film to expose a surface of the upper n-type semiconductor layer; and forming a first p-side electrode on the exposed surface of the upper n-type semiconductor layer.

Abstract: A method of manufacturing a nitride semiconductor device includes: forming, on or above a p-type nitride semiconductor tunnel junction layer, a first n-type nitride semiconductor layer that forms a tunnel junction with the p-type nitride semiconductor tunnel junction layer, the first n-type nitride semiconductor layer having a first impurity concentration and a first thickness; forming, on or above the first n-type nitride semiconductor layer, in a nitrogen atmosphere, a second n-type nitride semiconductor layer having a second n-type impurity concentration less than the first n-type impurity concentration and a second thickness; and forming, on or above the second n-type nitride semiconductor layer, in a hydrogen atmosphere, a third n-type nitride semiconductor layer having a third n-type impurity concentration less than the first n-type impurity concentration and a third thickness.

Abstract: A light emitting element includes: a first conductivity type semiconductor layer; a second conductivity type semiconductor layer disposed over the first conductivity type semiconductor layer; a first electrode and a second electrode disposed over the second conductivity type semiconductor layer and spaced apart from each other; and a light emitting layer disposed over the second conductivity type semiconductor layer and, in a top view, positioned between the first electrode and the second electrode.

Abstract: A method of manufacturing a light-emitting device includes: growing a layered structure on a substrate, the layered structure comprising an n-side nitride semiconductor layer, a first light-emitting layer, and a first p-side nitride semiconductor layer; growing an upper n-type semiconductor layer over the first p-side nitride semiconductor layer; forming a protective film over the upper n-type semiconductor layer, the protective film containing an element that functions as an n-type impurity for the upper n-type semiconductor layer; heating at least the upper n-type semiconductor layer and the protective film; at least partially removing the protective film to expose a surface of the upper n-type semiconductor layer; and forming a first p-side electrode on the exposed surface of the upper n-type semiconductor layer.

Abstract: A light emitting element includes: a first conductivity type semiconductor layer; a second conductivity type semiconductor layer disposed over the first conductivity type semiconductor layer; a first electrode and a second electrode disposed over the second conductivity type semiconductor layer and spaced apart from each other; and a light emitting layer disposed over the second conductivity type semiconductor layer and, in a top view, positioned between the first electrode and the second electrode.