Patents by Inventor Toshihiko Matsukura

Toshihiko Matsukura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230107893
    Abstract: An object of the present disclosure is to provide a cosmetic material having excellent feeling of use. The present invention relates to a cosmetic material comprising a host body consisting of a polymer compound having a host group and a guest body consisting of a polymer compound having a guest group, or a host-guest body consisting of a polymer compound having a host group and a guest group, wherein, at least one of the polymer compound having the host group or the polymer compound having the guest group, or the polymer compound having the host group and the guest group has a siloxane bond.
    Type: Application
    Filed: February 25, 2021
    Publication date: April 6, 2023
    Applicant: Shiseido Company, Ltd.
    Inventors: Toshihiko MATSUKURA, Nozomi OGUCHI
  • Publication number: 20230100274
    Abstract: An object of the present invention is to provide a resin material which contains a polymer compound having a host group and/or guest group and exhibits excellent solubility. The present invention relates to a resin material comprising a host body consisting of a polymer compound having a host group and a guest body consisting of a polymer compound having a guest group, or a host-guest body consisting of a polymer compound having a host group and a guest group, wherein, at least one of the polymer compound having the host group or the polymer compound having the guest group, or the polymer compound having the host group and the guest group, has a siloxane bond.
    Type: Application
    Filed: February 25, 2021
    Publication date: March 30, 2023
    Applicants: Shiseido Company, Ltd., Osaka University
    Inventors: Toshihiko MATSUKURA, Nozomi OGUCHI, Yoshinori TAKASHIMA, Akira HARADA, Motofumi OSAKI
  • Publication number: 20230050910
    Abstract: An objective of the invention is to provide a water-in-oil emulsion skin cosmetic having the property wherein contact with moisture, such as water or perspiration, increases the ultraviolet protection effects over those immediately after application, and also having an excellent feeling in use. The present invention relates to a water-in-oil emulsion skin cosmetic comprising (A) (a-1) a copolymer having silanol groups, and oxypropylene groups (PO) or oxyethylene groups (EO), and/or (a-2) a silylated peptide; and (B) an ultraviolet protectant.
    Type: Application
    Filed: December 24, 2020
    Publication date: February 16, 2023
    Applicant: Shiseido Company, Ltd.
    Inventors: Kei UJIMOTO, Takumi KURASHIMA, Momoka KOJIRI, Keita NISHIDA, Toshihiko MATSUKURA
  • Patent number: 9343196
    Abstract: Provided is a resin composition with high dielectric insulation properties that has a dielectric constant of at least 20, a dielectric tangent of 0.1 or less, outstanding insulation properties (at least 1012 ?·cm), and for use in electrical power, communication devices, and the like. A resin composition with high dielectric insulation properties comprises a constituent (A), which is 100 parts by mass of a polymer material that acts as a dispersion medium for constituent (B), and a constituent (B), which is 100-3000 parts by mass of a perovskite complex oxide powder comprising secondary particles formed by the mutual bonding of primary particles through sintering and represented by the formula: ABO3.
    Type: Grant
    Filed: January 24, 2013
    Date of Patent: May 17, 2016
    Assignee: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
    Inventors: Toshihiko Matsukura, Hiroyoshi Iijima, Masanari Shimakawa
  • Publication number: 20140296387
    Abstract: Provided is a resin composition with high dielectric insulation properties that has a dielectric constant of at least 20, a dielectric tangent of 0.1 or less, outstanding insulation properties (at least 1012 ?·cm), and for use in electrical power, communication devices, and the like. A resin composition with high dielectric insulation properties comprises a constituent (A), which is 100 parts by mass of a polymer material that acts as a dispersion medium for constituent (B), and a constituent (B), which is 100-3000 parts by mass of a perovskite complex oxide powder comprising secondary particles formed by the mutual bonding of primary particles through sintering and represented by the formula: ABO3.
    Type: Application
    Filed: January 24, 2013
    Publication date: October 2, 2014
    Inventors: Toshihiko Matsukura, Hiroyoshi Iijima, Masanari Shimakawa
  • Patent number: 8835540
    Abstract: A silicone rubber composition contains: (A) 100 parts by weight of a dimethylpolysiloxane sequestered at both ends of the molecular chain thereof by a dimethylvinylsiloxy group; (B) 5 to 100 parts by weight of a dry silica, treated by a vinyl group-containing organosilicon compound and having a specific surface area of 50 m2/g or more; (C) 5 to 100 parts by weight of a copolymer of dimethylsiloxane and methylhydrogen siloxane; (D) platinum or a platinum compound as a curing agent in an amount of 1 to 1,000 ppm as platinum atom to the total amount of component (A) and component (C); and (E) triazole or a derivative of triazole, in an amount of 1 to 10,000 ppm to the total amount of (A) component and (C) component.
    Type: Grant
    Filed: September 28, 2011
    Date of Patent: September 16, 2014
    Assignee: Momentive Performance Materials Japan LLC
    Inventors: Toshihiko Matsukura, Hiroyoshi lijima
  • Publication number: 20130225735
    Abstract: Provided is a silicone rubber composition to form a high voltage insulation cured material, having tracking resistance, providing a low tension set and an excellent mechanical strength such as tensile strength, and having a good tracking resistance.
    Type: Application
    Filed: September 28, 2011
    Publication date: August 29, 2013
    Inventors: Toshihiko Matsukura, Hiroyoshi Iijima