Abstract: A forming sheet for forming an article such as a housing for an electronic device having a shieldability against electromagnetic interference. It is made by laminating a conductive laminated sheet to a thermoplastic synthetic resin sheet through a hot melt adhesive layer. The conductive laminated sheet is formed by subjecting to heat shrinkage a substrate comprising a metallic film and a heat-shrinkable synthetic resin film laminated together through a discontinuous bonding layer. The conductive layer is less liable to crack due to stress applied during forming.

Abstract: Laminates comprising a film of heat-shrinkable synthetic resin and a metallic foil or metallized plastic film laminated to the resin film through a bonding layer which comprises a discontinuous layer of a synthetic resin which flows at a temperature for heat shrinkage and an adhesive layer which maintains its adhesive strength at that temperature. Upon heat shrinkage, the metallic foil or metallized plastic film will wrinkle at the portions in contact with the synthetic resin which is not highly adhesive at the temperature for heat shrinkage. The heat-shrunk laminate can be formed into a casing or container such as an electromagnetic interference shield, a packaging material, and decorative material.

Abstract: In a method and a system for simulating a distributed system, a target system is divided into asynchronously operative processes so that the simulation of said asynchronously operative, distributed system may be comprehended with the changes in the data structures by using (1) a whole structure table indicating what certain of the said divided processes can provide for other processes, (2) a system structure table representing certain of said processes with a Petri net model, and (3) a data structure table storing the data structures of input and output processing data.

Abstract: A packaging sheet for containing foodstuff is proposed which comprises a substrate of synthetic resin and a metallic film layer laminated to the substrate through an adhesive layer and a resin layer having a lower bond strength than the adhesive layer. Food packaging containers using the packaging sheet as a lid and self-standing pouches using the packaging sheet as their side sheets are also proposed. Before such a container or pouch containing food is put into a microwave oven for cooking, the metallic film layer or layers can be removed easily from the substrate.

Abstract: An improved lid for heat-sealing a container is proposed which comprises a substrate and an outer peel layer laminated to the substrate through two adhesive layers, one of which has a weaker adhesion strength than the other. The substrate has a base sheet and is formed with such a discontinuous cut outlining an opening that a tear starting from the end of one cut will be received by the front end of a cut next to the cut, and a partial opening will be formed in the substrate.

Abstract: Laminates comprising a film of heat-shrinkable synthetic resin and a metallic foil laminated to the resin film through a bonding layer which comprises a discontinuous layer of a synthetic resin which flows at a temperature for heat shrinkage and an adhesive layer which maintains its adhesive strength at that temperature. Upon heat shrinkage, the metallic foil will wrinkle at the portions in contact with the synthetic resin which is not highly adhesive at the temperature for heat shrinkage. The heat-shrunk laminate can be formed into a casing or container such as an electromagentic interference shield, a packaging material, and decorative material.

Abstract: A packaging sheet for containing foodstuff is proposed which comprises a substrate of synthetic resin and a metallic film layer laminated to the substrate through an adhesive layer and a resin layer having a lower bond strength than the adhesive layer. Food packaging containers using the packaging sheet as a lid and self-standing pouches using the packaging sheet as their side sheets are also proposed. Before such a container or pouch containing food is put into a microwave oven for cooking, the metallic film layer or layers can be removed easily from the substrate.