Patents by Inventor Toshihiko Otsuki

Toshihiko Otsuki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polishing agent, polishing method, and liquid additive for polishing
    Patent number: 11713404
    Abstract: The present invention relates to a polishing agent including: a water-soluble polymer including a copolymer of a monomer (A) which includes at least one member selected from the group consisting of an unsaturated dicarboxylic acid, a derivative thereof, and salts of the unsaturated dicarboxylic acid and the derivative thereof and a monomer (B) other than the monomer (A), comprising an ethylenic double bond and no acidic group; a cerium oxide particle; and water, in which the polishing agent has a pH of 4 to 9.
    Type: Grant
    Filed: May 12, 2021
    Date of Patent: August 1, 2023
    Assignee: AGC INC.
    Inventor: Toshihiko Otsuki
  • POLISHING AGENT, POLISHING METHOD, AND LIQUID ADDITIVE FOR POLISHING
    Publication number: 20210261824
    Abstract: The present invention relates to a polishing agent including: a water-soluble polymer including a copolymer of a monomer (A) which includes at least one member selected from the group consisting of an unsaturated dicarboxylic acid, a derivative thereof, and salts of the unsaturated dicarboxylic acid and the derivative thereof and a monomer (B) other than the monomer (A), comprising an ethylenic double bond and no acidic group; a cerium oxide particle; and water, in which the polishing agent has a pH of 4 to 9.
    Type: Application
    Filed: May 12, 2021
    Publication date: August 26, 2021
    Applicant: AGC INC.
    Inventor: Toshihiko Otsuki
  • Polishing agent, polishing method, and liquid additive for polishing
    Patent number: 11041096
    Abstract: The present invention relates to a polishing agent including: a water-soluble polymer including a copolymer of a monomer (A) which includes at least one member selected from the group consisting of an unsaturated dicarboxylic acid, a derivative thereof, and salts of the unsaturated dicarboxylic acid and the derivative thereof and a monomer (B) other than the monomer (A), comprising an ethylenic double bond and no acidic group; a cerium oxide particle; and water, in which the polishing agent has a pH of 4 to 9.
    Type: Grant
    Filed: November 2, 2018
    Date of Patent: June 22, 2021
    Assignee: AGC INC.
    Inventor: Toshihiko Otsuki
  • POLISHING AGENT, POLISHING METHOD, AND LIQUID ADDITIVE FOR POLISHING
    Publication number: 20190136089
    Abstract: The present invention relates to a polishing agent including: a water-soluble polymer including a copolymer of a monomer (A) which includes at least one member selected from the group consisting of an unsaturated dicarboxylic acid, a derivative thereof, and salts of the unsaturated dicarboxylic acid and the derivative thereof and a monomer (B) other than the monomer (A), comprising an ethylenic double bond and no acidic group; a cerium oxide particle; and water, in which the polishing agent has a pH of 4 to 9.
    Type: Application
    Filed: November 2, 2018
    Publication date: May 9, 2019
    Applicant: AGC INC
    Inventor: Toshihiko OTSUKI
  • Polishing agent, polishing method and method for manufacturing semiconductor integrated circuit device
    Patent number: 9803107
    Abstract: The present invention relates to a polishing agent including: cerium oxide particles; a water-soluble polyamine; potassium hydroxide; at least one selected from an organic acid and a salt thereof; and water, in which the polishing agent has a pH of 10 or more, a polishing method using the polishing agent, and a method for manufacturing a semiconductor integrated circuit device.
    Type: Grant
    Filed: February 10, 2016
    Date of Patent: October 31, 2017
    Assignee: ASAHI GLASS COMPANY, LIMITED
    Inventors: Masaru Suzuki, Toshihiko Otsuki
  • Polishing agent, polishing method and additive liquid for polishing
    Patent number: 9481812
    Abstract: A polishing agent includes a particle of a metal oxide, a water-soluble polyamide, an organic acid and water. The water-soluble polyamide has a tertiary amino group and/or an oxyalkylene chain in a molecule thereof. The polishing agent has a pH of 7 or less.
    Type: Grant
    Filed: July 24, 2015
    Date of Patent: November 1, 2016
    Assignee: ASAHI GLASS COMPANY, LIMITED
    Inventors: Iori Yoshida, Nobuyuki Takagi, Masaru Suzuki, Toshihiko Otsuki