Abstract: A keyboard device and a magnetic shield forming method are provided. The keyboard device includes: a plurality of displacement members (detected portions, conductors) arranged in a scale direction and displaced according to an operation of a player; and a substrate having a coil which generates a magnetic field for detecting displacement of the plurality of displacement members. The substrate includes a plurality of the coils provided respectively for the plurality of displacement members, and a magnetic shield partitioning the plurality of coils and formed by a conductive pattern of the substrate.

Abstract: A keyboard device and a key depression information detecting method are provided. The keyboard device includes: a coil generating a magnetic field; a displacement member having an outer surface and displaced at a position facing the coil during key depression; and a conductor provided on the displacement member. The conductor includes: a facing portion covering the outer surface of the displacement member to face the coil during key depression; and a front surface portion connected to the facing portion and covering an outer surface of the displacement member which is directed to a front side in a displacement direction of the displacement member.

Abstract: Electrode pads respectively have a probe region permitting probe contact and a non-probe region. In each of the electrode pads arranged zigzag in two or more rows, a lead interconnect for connecting another electrode pad with an internal circuit is not placed directly under the probe region but placed directly under the non-probe region.

Abstract: Electrode pads respectively have a probe region permitting probe contact and a non-probe region. In each of the electrode pads arranged zigzag in two or more rows, a lead interconnect for connecting another electrode pad with an internal circuit is not placed directly under the probe region but placed directly under the non-probe region.

Abstract: Electrode pads respectively have a probe region permitting probe contact and a non-probe region. In each of the electrode pads arranged zigzag in two or more rows, a lead interconnect for connecting another electrode pad with an internal circuit is not placed directly under the probe region but placed directly under the non-probe region.

Abstract: In a semiconductor device, a pad metal has at least a portion located immediately under a probe region, and the portion is divided into a plurality of narrow metal layers each arranged in parallel with a traveling direction of a probe. Thus, it is possible to enhance surface flatness of the pad metal and to prevent a characteristic of a semiconductor device from deteriorating without complication in processing and increase in chip size.

Abstract: Electrode pads respectively have a probe region permitting probe contact and a non-probe region. In each of the electrode pads arranged zigzag in two or more rows, a lead interconnect for connecting another electrode pad with an internal circuit is not placed directly under the probe region but placed directly under the non-probe region.

Abstract: In a semiconductor device, a pad metal has at least a portion located immediately under a probe region, and the portion is divided into a plurality of narrow metal layers each arranged in parallel with a traveling direction of a probe. Thus, it is possible to enhance surface flatness of the pad metal and to prevent a characteristic of a semiconductor device from deteriorating without complication in processing and increase in chip size.

Abstract: Electrode pads respectively have a probe region permitting probe contact and a non-probe region. In each of the electrode pads arranged zigzag in two or more rows, a lead interconnect for connecting another electrode pad with an internal circuit is not placed directly under the probe region but placed directly under the non-probe region.

Abstract: In a semiconductor device, a pad metal has at least a portion located immediately under a probe region, and the portion is divided into a plurality of narrow metal layers each arranged in parallel with a traveling direction of a probe. Thus, it is possible to enhance surface flatness of the pad metal and to prevent a characteristic of a semiconductor device from deteriorating without complication in processing and increase in chip size.

Abstract: Circuits under electrode terminals and a nonconductor layer of the electrode terminals in semiconductor devices are prevented from being damaged during a test, such as a burn-in test, on the semiconductor devices formed on a wafer. Alignment patterns provided on the semiconductor wafer have detector electrode terminals and conductor electrode terminals. A detector electrode terminal surrounds a conductor electrode terminal separated by a gap from the detector electrode terminals and a portion of the surrounding detector electrode terminal is open.

Abstract: Circuits under electrode terminals and a nonconductor layer of the electrode terminals in semiconductor devices are prevented from being damaged during a test, such as a burn-in test, on the semiconductor devices formed on a wafer. Alignment patterns provided on the semiconductor wafer have detector electrode terminals and conductor electrode terminals. A detector electrode terminal surrounds a conductor electrode terminal separated by a gap from the detector electrode terminals and a portion of the surrounding detector electrode terminal is open.

Abstract: A slide arm for a work implement is provided, which is simply structured to obtain improved assembling precision thereby ensuring smooth operation. To this end, the slide arm is such that a plurality of tubular structural bodies (i.e., outer and inner tubes), each of which is formed by bending a one-piece plate into a shape having a substantially triangular cross-section and circular vertex portions, are telescoped one within the other with sliding members (i.e., plain bearing units and slide block pieces) interposed between them at the vertex portions and such that a sliding mechanism is disposed for sliding the tubular structural bodies.

Abstract: A slide arm for a work implement is provided, which is simply structured to obtain improved assembling precision thereby ensuring smooth operation. To this end, the slide arm is such that a plurality of tubular structural bodies (i.e., outer and inner tubes), each of which is formed by bending a one-piece plate into a shape having a substantially triangular cross-section and circular vertex portions, are telescoped one within the other with sliding members (i.e., plain bearing units and slide block pieces) interposed between them at the vertex portions and such that a sliding mechanism is disposed for sliding the tubular structural bodies.