Patents by Inventor Toshihiko Sato
Toshihiko Sato has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8047042Abstract: The present invention is a press forging method by which porosities in a raw material are removed and mechanical properties such as ductility and toughness of a steel product are at a required level in a case that a steel ingot is treated as a raw material in press forging. A cylindrical steel ingot (a so-called “round billet”) is set onto a die as a raw material, and, a forging process is applied to the steel ingot so that buckling of the steel is not generated during the forging process and that a reduction ratio and a forging ratio are more than predetermined values, respectively.Type: GrantFiled: November 28, 2007Date of Patent: November 1, 2011Assignee: Topy Kogyo Kabushiki KaishaInventors: Toshihiko Sato, Yugo Takeuchi, Yasuo Yoshida, Noboru Kakizawa, Takehiro Osugi, Takanori Yoshikawa
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Publication number: 20110171780Abstract: Of three chips (2A), (2B), and (2C) mounted on a main surface of a package substrate (1) in a multi-chip module (MCM), a chip (2A) with a DRAM formed thereon and a chip (2B) with a flash memory formed thereon are electrically connected to wiring lines (5) of the package substrate (1) through Au bumps (4), and a gap formed between main surfaces (lower surfaces) of the chips (2A), (2B) and a main surface of the package substrate (1) is filled with an under-fill resin (6). A chip (2C) with a high-speed microprocessor formed thereon is mounted over the two chips (2A) and (2B) and is electrically connected to bonding pads (9) of the package substrate (1) through Au wires (8).Type: ApplicationFiled: March 22, 2011Publication date: July 14, 2011Inventors: Yoshiyuki Kado, Takahiro Naito, Toshihiko Sato, Hikaru Ikegami, Takafumi Kikuchi
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Publication number: 20110168544Abstract: [Object]To provide a manufacturing method of an optical filter having favorable film quality by removing a foreign substance adhered onto a surface of a substrate by cleaning before a thin film is formed. [Solution] By performing a cleaning step P1 for cleaning a substrate S by means of a solution including water, a pre-treatment step P3 for plasma-treating a surface of the substrate S cleaned in the cleaning step P1 by plasma of an oxygen gas, and a thin film formation step (P4, P5) for forming the thin film on the surface of the substrate S plasma-treated in the pre-treatment step P3, the foreign substance adhered onto the surface of the substrate can be effectively removed. In the pre-treatment step P3, only the oxygen gas is introduced to an area where the plasma is generated, and a flow rate of the oxygen gas to be introduced is greater than a flow rate of the oxygen gas introduced in the thin film formation step.Type: ApplicationFiled: September 14, 2009Publication date: July 14, 2011Applicant: Shincron Co., LTDInventors: Ichiro Shiono, Toshihiko Sato, Yasuhisa Togashi, Yousong Jiang, Takuya Sugawara
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Publication number: 20110130244Abstract: A toroidal continuously variable transmission of the present invention comprises: input side disks (1a, 1b) and output side disks (6) being supported concentric with each other such that the disks can rotate freely; a trunnion (9) that comprises end sections (36) on both ends on which tilt shafts (13) that are concentric with each other are provided, and a support beam section (15) that extends between both end sections (36), the trunnion (9) being capable of pivotally displacing around the tilt shafts (13); a thrust rolling bearing (17); and a power roller (8) that is supported to the inside surface of the trunnion (9) by way of the thrust rolling bearing (17) such that it rotates freely; wherein the support beam section (15) comprises an inside surface having a cylindrical convex surface (14); the thrust rolling bearing (17) comprises an outer race (18a) having an outside surface with a concave section (19a) that fits with the cylindrical convex surface (14) of the support beam section (15), and a pluralityType: ApplicationFiled: November 24, 2010Publication date: June 2, 2011Applicant: NSK LTD.Inventors: Hiroki Nishii, Toshihiko Sato, Eiji Inoue, Toshiro Toyoda, Hiroyasu Yoshioka, Yuji Shimomura, Shin Yamamoto
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Patent number: 7859095Abstract: Of three chips (2A), (2B), and (2C) mounted on a main surface of a package substrate (1) in a multi-chip module (MCM), a chip (2A) with a DRAM formed thereon and a chip (2B) with a flash memory formed thereon are electrically connected to wiring lines (5) of the package substrate (1) through Au bumps (4), and a gap formed between main surfaces (lower surfaces) of the chips (2A), (2B) and a main surface of the package substrate (1) is filled with an under-fill resin (6). A chip (2C) with a high-speed microprocessor formed thereon is mounted over the two chips (2A) and (2B) and is electrically connected to bonding pads (9) of the package substrate (1) through Au wires (8).Type: GrantFiled: April 7, 2009Date of Patent: December 28, 2010Assignee: Renesas Electronics CorporationInventors: Yoshiyuki Kado, Takahiro Naito, Toshihiko Sato, Hikaru Ikegami, Takafumi Kikuchi
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Publication number: 20100015760Abstract: Of three chips (2A), (2B), and (2C) mounted on a main surface of a package substrate (1) in a multi-chip module (MCM), a chip (2A) with a DRAM formed thereon and a chip (2B) with a flash memory formed thereon are electrically connected to wiring lines (5) of the package substrate (1) through Au bumps (4), and a gap formed between main surfaces (lower surfaces) of the chips (2A), (2B) and a main surface of the package substrate (1) is filled with an under-fill resin (6). A chip (2C) with a high-speed microprocessor formed thereon is mounted over the two chips (2A) and (2B) and is electrically connected to bonding pads (9) of the package substrate (1) through Au wires (8).Type: ApplicationFiled: September 23, 2009Publication date: January 21, 2010Inventors: Yoshiyuki KADO, Takahiro Naito, Toshihiko Sato, Hikaru Ikegami, Takafumi Kikuchi
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Patent number: 7627319Abstract: The invention relates to a mobile terminal that intends to increase channel capacity and transmission quality properly within the confines of costs. The invention provides a mobile terminal including measuring section measuring a downstream transmission loss using a pilot signal transmitted from each radio base station; and selecting section comparing transmitting power of a pilot signal corresponding to the lowest measured transmission loss with transmitting power of pilot signals for each of which a difference between a corresponding measured transmission loss and a lowest measured transmission loss is smaller than a prescribed value, and selecting, as an origination destination or handover destination, a radio base station that transmits a pilot signal having a lowest transmitting power among those pilot signals, if a difference between the lowest measured transmission loss and a second lowest measured transmission loss is not larger than or equal to a prescribed value.Type: GrantFiled: October 27, 2004Date of Patent: December 1, 2009Assignee: Fujitsu LimitedInventor: Toshihiko Sato
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Publication number: 20090194421Abstract: An electrolytic gas composite fuel generation apparatus is disclosed having a mixing tank in which a liquid organic compound, such as an alkane, alcohols or ether, is stored so that a gaseous fossil fuel is continuously mixed with an electrolytic gas that is supplied as bubbles, an electrolytic gas supply device for supplying bubbles of electrolytic gas, and a fossil fuel supply device for supplying gaseous fossil fuel as bubbles. The fuel generation apparatus also includes an electrolytic gas composite fuel discharge device for discharging an electrolytic gas composite fuel that is produced by continuously mixing the electrolytic gas with the gaseous fossil fuel, an elevating portion capable of ascending and descending within the mixing tank, and a controller. The present invention further discloses a method for continuously mixing an electrolytic gas, generated by water electrolysis employing a basic electrolyte, with gaseous fossil fuel, and generating an electrolytic gas composite fuel.Type: ApplicationFiled: January 19, 2009Publication date: August 6, 2009Inventors: Toshigoro Sato, Toshihiko Sato, Nobuo Takayama
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Publication number: 20090189268Abstract: Of three chips (2A), (2B), and (2C) mounted on a main surface of a package substrate (1) in a multi-chip module (MCM), a chip (2A) with a DRAM formed thereon and a chip (2B) with a flash memory formed thereon are electrically connected to wiring lines (5) of the package substrate (1) through Au bumps (4), and a gap formed between main surfaces (lower surfaces) of the chips (2A), (2B) and a main surface of the package substrate (1) is filled with an under-fill resin (6). A chip (2C) with a high-speed microprocessor formed thereon is mounted over the two chips (2A) and (2B) and is electrically connected to bonding pads (9) of the package substrate (1) through Au wires (8).Type: ApplicationFiled: April 7, 2009Publication date: July 30, 2009Inventors: Yoshiyuki KADO, Takahiro Naito, Hikaru Ikegami, Takafumi Kikuchi, Toshihiko Sato
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Publication number: 20090166191Abstract: Disclosed is an apparatus for generating a water electrolytic gas, wherein an electrolyte inlet is formed in the bottom of an electrolytic cell for generation of a water electrolytic gas, and an outlet is formed in the top thereof for the extraction of a mixture of an electrolyte and a generated gas. In the electrolytic cell, an anode and a cathode are provided, and an alkali electrolyte spinning and passing portion are arranged between these electrodes. With this arrangement, water electrolysis is performed, and a mixture of the electrolyte and a water electrolytic gas is extracted from the upper end of the electrolytic cell and transferred to a water electrolytic gas/electrolyte separation cell. A gas-liquid separation process extracts only the water electrolytic gas to the exterior, while the electrolyte is returned to the electrolytic cell by an electrolyte circulation device, to continue the performance of the electrolytic reaction.Type: ApplicationFiled: December 10, 2008Publication date: July 2, 2009Inventors: Toshigoro Sato, Toshihiko Sato, Nobuo Takayama
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Publication number: 20090165810Abstract: A hair material for a wig is preliminarily curled and then bound to a wig base to thereby orient the curled hair in a definite direction. A folded part (10c) of a hair material (10) is penetrated from one side of a filament (15) to the other side under a wig base (12) so that a first loop (17) is formed in the inner side of the folded part (10c). A curved part (10d) is inserted though the first loop (17) so that a second loop (19) is formed in the inner side of the curved part (10d). A part (10b) of the hair material is inserted through the second loop (19). Next, the hair material parts (10a, 10b) are pulled in directions opposite to each other and tied with the filament (15) to (20). Thus, the hair material (10) is bound to the filament (15).Type: ApplicationFiled: April 12, 2006Publication date: July 2, 2009Inventors: Yasuhisa Sotokawa, Katsuo Sugai, Yutaka Shirakashi, Toshihiko Sato, Akemi Irikura
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Patent number: 7531441Abstract: Of three chips (2A), (2B), and (2C) mounted on a main surface of a package substrate (1) in a multi-chip module (MCM), a chip (2A) with a DRAM formed thereon and a chip (2B) with a flash memory formed thereon are electrically connected to wiring lines (5) of the package substrate (1) through Au bumps (4), and a gap formed between main surfaces (lower surfaces) of the chips (2A), (2B) and a main surface of the package substrate (1) is filled with an under-fill resin (6). A chip (2C) with a high-speed microprocessor formed thereon is mounted over the two chips (2A) and (2B) and is electrically connected to bonding pads (9) of the package substrate (1) through Au wires (8).Type: GrantFiled: April 7, 2006Date of Patent: May 12, 2009Assignee: Renesas Technology Corp.Inventors: Yoshiyuki Kado, Takahiro Naito, Toshihiko Sato, Hikaru Ikegami, Takafumi Kikuchi
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Patent number: 7530748Abstract: A camera module is composed from a lens unit including at least one lens, a barrel provided with the lens and having a barrel opening, and a lens holder for holding the barrel; and an image pickup device portion provided under the lens unit and having an image pickup device housing space in which an image pickup device is hermetically provided. The barrel opening of the barrel has an annular edge which serves as a diaphragm, and the annular edge of the barrel opening has a lower annular corner portion which is located on the side of the lens, wherein the lower annular corner portion of the annular edge is formed so as to have a rounded cross-sectional shape and staining is formed on the lower annular corner portion.Type: GrantFiled: July 28, 2006Date of Patent: May 12, 2009Assignee: Mitsumi Electric Co., Ltd.Inventors: Hisashi Shibata, Toshihiko Sato
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Patent number: 7428111Abstract: A camera module has a lens unit and an image pickup portion. The lens unit has at least one lens and a lens holder for holding the lens. The image pickup portion, which is provided below the lens unit, has a substrate, an image pickup device mounted on the substrate, a housing space for housing the image pickup device therein in a hermetically sealed state, and a base provided above the substrate. The base has an opening for introducing light passing through the lens to the image pickup device, a support portion located around the opening, and a recessed groove located around the support portion for holding a resin adhesive for bonding. The image pickup portion also has a filter having a peripheral portion bonded to an upper surface of the support portion so as to cover the opening.Type: GrantFiled: July 28, 2006Date of Patent: September 23, 2008Assignee: Mitsumi Electric Co., Ltd.Inventors: Hisashi Shibata, Toshihiko Sato
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Publication number: 20080141752Abstract: The present invention is a press forging method by which porosities in a raw material are removed and mechanical properties such as ductility and toughness of a steel product are at a required level in a case that a steel ingot is treated as a raw material in press forging. A cylindrical steel ingot (a so-called “round billet”) is set onto a die as a raw material, and, a forging process is applied to the steel ingot so that buckling of the steel is not generated during the forging process and that a reduction ratio and a forging ratio are more than predetermined values, respectively.Type: ApplicationFiled: November 28, 2007Publication date: June 19, 2008Inventors: Toshihiko Sato, Yugo Takeuchi, Yasuo Yoshida, Noboru Kakizawa, Takehiro Osugi, Takanori Yoshikawa
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Publication number: 20070097549Abstract: A magnetic head assembly is provided. The magnetic head assembly has electrode pads of a slider that have a magnetoresistive element installed therein and electrode pads of a flexible printed circuit that connect the magnetoresistive element to an external circuit are bonded by solder. In one embodiment, an Au layer is formed on solder contact surfaces of the electrode pads of the slider and the flexible printed circuit, and an AuSn dispersion layer where Au atoms of the Au layer are dispersed is formed at least on the boundary between the solder contact surfaces of the electrode pads and the solder.Type: ApplicationFiled: October 27, 2006Publication date: May 3, 2007Applicant: ALPS ELECTRIC CO., LTDInventors: Ooki Yamaguchi, Takao Haino, Hideaki Abe, Toshihiko Sato
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Publication number: 20070053685Abstract: A camera module is composed from a lens unit including at least one lens, a barrel provided with the lens and having a barrel opening, and a lens holder for holding the barrel; and an image pickup device portion provided under the lens unit and having an image pickup device housing space in which an image pickup device is hermetically provided. The barrel opening of the barrel has an annular edge which serves as a diaphragm, and the annular edge of the barrel opening has a lower annular corner portion which is located on the side of the lens, wherein the lower annular corner portion of the annular edge is formed so as to have a rounded cross-sectional shape and staining is formed on the lower annular corner portion.Type: ApplicationFiled: July 28, 2006Publication date: March 8, 2007Inventors: Hisashi Shibata, Toshihiko Sato
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Publication number: 20070047109Abstract: A camera module has a lens unit and an image pickup portion. The lens unit has at least one lens and a lens holder for holding the at least one lens. The image pickup portion is provided below the lens unit. The image pickup portion has a substrate, an image pickup device mounted on the substrate, a housing space for housing the image pickup device therein in a hermetically sealed state, and a base provided above the substrate. The base has an opening for introducing light passing through the at least one lens to the image pickup device in the housing space, a support portion located around the opening, and a recessed groove located around the support portion for holding a resin adhesive for bonding. The image pickup portion also has a filter having a peripheral portion bonded to an upper surface of the support portion so as to cover the opening of the base.Type: ApplicationFiled: July 28, 2006Publication date: March 1, 2007Inventors: Hisashi Shibata, Toshihiko Sato
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Patent number: 7180806Abstract: A memory space of a memory cell array is divided into a plurality of submemory spaces. A refresh control circuit executes a control of performing refreshment of information to the submemory spaces that are in use at the time of the refreshment of the information and need the refreshment among the plurality of submemory spaces and executes a control of not performing the refreshment to the submemory spaces that are not in use and do not need the refreshment.Type: GrantFiled: February 25, 2004Date of Patent: February 20, 2007Assignee: Sony CorporationInventors: Shigeji Ikeda, Shinichi Fukuda, Isao Ohdaira, Toshihiko Sato
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Publication number: 20060221501Abstract: A slider includes electrode pads each of which is bonded to an electrode pad of a flexible printed circuit board through a solder ball. Surface cleaning is performed on the electrode pad of the slider in a vacuum atmosphere, and an Au surface protective film is formed on a new film surface of the same electrode pad. The entire surface of the same electrode pad is covered with the protective film. When the electrode pads of the slider and the flexible printed circuit board are bonded to each other by soldering, a solder ball is melted between the electrode pads, so that a solder fillet is formed in contact with the top surface of the electrode pad of the slider, side surfaces of the same electrode pad close to the flexible printed circuit board, and the top surface of the electrode pad of the flexible printed circuit board.Type: ApplicationFiled: March 23, 2006Publication date: October 5, 2006Inventors: Toshihiko Sato, Ooki Yamaguchi, Naruaki Oki, Masayuki Obana, Masayoshi Nakagawa