Patents by Inventor Toshihiko Sato

Toshihiko Sato has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8047042
    Abstract: The present invention is a press forging method by which porosities in a raw material are removed and mechanical properties such as ductility and toughness of a steel product are at a required level in a case that a steel ingot is treated as a raw material in press forging. A cylindrical steel ingot (a so-called “round billet”) is set onto a die as a raw material, and, a forging process is applied to the steel ingot so that buckling of the steel is not generated during the forging process and that a reduction ratio and a forging ratio are more than predetermined values, respectively.
    Type: Grant
    Filed: November 28, 2007
    Date of Patent: November 1, 2011
    Assignee: Topy Kogyo Kabushiki Kaisha
    Inventors: Toshihiko Sato, Yugo Takeuchi, Yasuo Yoshida, Noboru Kakizawa, Takehiro Osugi, Takanori Yoshikawa
  • Publication number: 20110171780
    Abstract: Of three chips (2A), (2B), and (2C) mounted on a main surface of a package substrate (1) in a multi-chip module (MCM), a chip (2A) with a DRAM formed thereon and a chip (2B) with a flash memory formed thereon are electrically connected to wiring lines (5) of the package substrate (1) through Au bumps (4), and a gap formed between main surfaces (lower surfaces) of the chips (2A), (2B) and a main surface of the package substrate (1) is filled with an under-fill resin (6). A chip (2C) with a high-speed microprocessor formed thereon is mounted over the two chips (2A) and (2B) and is electrically connected to bonding pads (9) of the package substrate (1) through Au wires (8).
    Type: Application
    Filed: March 22, 2011
    Publication date: July 14, 2011
    Inventors: Yoshiyuki Kado, Takahiro Naito, Toshihiko Sato, Hikaru Ikegami, Takafumi Kikuchi
  • Publication number: 20110168544
    Abstract: [Object]To provide a manufacturing method of an optical filter having favorable film quality by removing a foreign substance adhered onto a surface of a substrate by cleaning before a thin film is formed. [Solution] By performing a cleaning step P1 for cleaning a substrate S by means of a solution including water, a pre-treatment step P3 for plasma-treating a surface of the substrate S cleaned in the cleaning step P1 by plasma of an oxygen gas, and a thin film formation step (P4, P5) for forming the thin film on the surface of the substrate S plasma-treated in the pre-treatment step P3, the foreign substance adhered onto the surface of the substrate can be effectively removed. In the pre-treatment step P3, only the oxygen gas is introduced to an area where the plasma is generated, and a flow rate of the oxygen gas to be introduced is greater than a flow rate of the oxygen gas introduced in the thin film formation step.
    Type: Application
    Filed: September 14, 2009
    Publication date: July 14, 2011
    Applicant: Shincron Co., LTD
    Inventors: Ichiro Shiono, Toshihiko Sato, Yasuhisa Togashi, Yousong Jiang, Takuya Sugawara
  • Publication number: 20110130244
    Abstract: A toroidal continuously variable transmission of the present invention comprises: input side disks (1a, 1b) and output side disks (6) being supported concentric with each other such that the disks can rotate freely; a trunnion (9) that comprises end sections (36) on both ends on which tilt shafts (13) that are concentric with each other are provided, and a support beam section (15) that extends between both end sections (36), the trunnion (9) being capable of pivotally displacing around the tilt shafts (13); a thrust rolling bearing (17); and a power roller (8) that is supported to the inside surface of the trunnion (9) by way of the thrust rolling bearing (17) such that it rotates freely; wherein the support beam section (15) comprises an inside surface having a cylindrical convex surface (14); the thrust rolling bearing (17) comprises an outer race (18a) having an outside surface with a concave section (19a) that fits with the cylindrical convex surface (14) of the support beam section (15), and a plurality
    Type: Application
    Filed: November 24, 2010
    Publication date: June 2, 2011
    Applicant: NSK LTD.
    Inventors: Hiroki Nishii, Toshihiko Sato, Eiji Inoue, Toshiro Toyoda, Hiroyasu Yoshioka, Yuji Shimomura, Shin Yamamoto
  • Patent number: 7859095
    Abstract: Of three chips (2A), (2B), and (2C) mounted on a main surface of a package substrate (1) in a multi-chip module (MCM), a chip (2A) with a DRAM formed thereon and a chip (2B) with a flash memory formed thereon are electrically connected to wiring lines (5) of the package substrate (1) through Au bumps (4), and a gap formed between main surfaces (lower surfaces) of the chips (2A), (2B) and a main surface of the package substrate (1) is filled with an under-fill resin (6). A chip (2C) with a high-speed microprocessor formed thereon is mounted over the two chips (2A) and (2B) and is electrically connected to bonding pads (9) of the package substrate (1) through Au wires (8).
    Type: Grant
    Filed: April 7, 2009
    Date of Patent: December 28, 2010
    Assignee: Renesas Electronics Corporation
    Inventors: Yoshiyuki Kado, Takahiro Naito, Toshihiko Sato, Hikaru Ikegami, Takafumi Kikuchi
  • Publication number: 20100015760
    Abstract: Of three chips (2A), (2B), and (2C) mounted on a main surface of a package substrate (1) in a multi-chip module (MCM), a chip (2A) with a DRAM formed thereon and a chip (2B) with a flash memory formed thereon are electrically connected to wiring lines (5) of the package substrate (1) through Au bumps (4), and a gap formed between main surfaces (lower surfaces) of the chips (2A), (2B) and a main surface of the package substrate (1) is filled with an under-fill resin (6). A chip (2C) with a high-speed microprocessor formed thereon is mounted over the two chips (2A) and (2B) and is electrically connected to bonding pads (9) of the package substrate (1) through Au wires (8).
    Type: Application
    Filed: September 23, 2009
    Publication date: January 21, 2010
    Inventors: Yoshiyuki KADO, Takahiro Naito, Toshihiko Sato, Hikaru Ikegami, Takafumi Kikuchi
  • Patent number: 7627319
    Abstract: The invention relates to a mobile terminal that intends to increase channel capacity and transmission quality properly within the confines of costs. The invention provides a mobile terminal including measuring section measuring a downstream transmission loss using a pilot signal transmitted from each radio base station; and selecting section comparing transmitting power of a pilot signal corresponding to the lowest measured transmission loss with transmitting power of pilot signals for each of which a difference between a corresponding measured transmission loss and a lowest measured transmission loss is smaller than a prescribed value, and selecting, as an origination destination or handover destination, a radio base station that transmits a pilot signal having a lowest transmitting power among those pilot signals, if a difference between the lowest measured transmission loss and a second lowest measured transmission loss is not larger than or equal to a prescribed value.
    Type: Grant
    Filed: October 27, 2004
    Date of Patent: December 1, 2009
    Assignee: Fujitsu Limited
    Inventor: Toshihiko Sato
  • Publication number: 20090194421
    Abstract: An electrolytic gas composite fuel generation apparatus is disclosed having a mixing tank in which a liquid organic compound, such as an alkane, alcohols or ether, is stored so that a gaseous fossil fuel is continuously mixed with an electrolytic gas that is supplied as bubbles, an electrolytic gas supply device for supplying bubbles of electrolytic gas, and a fossil fuel supply device for supplying gaseous fossil fuel as bubbles. The fuel generation apparatus also includes an electrolytic gas composite fuel discharge device for discharging an electrolytic gas composite fuel that is produced by continuously mixing the electrolytic gas with the gaseous fossil fuel, an elevating portion capable of ascending and descending within the mixing tank, and a controller. The present invention further discloses a method for continuously mixing an electrolytic gas, generated by water electrolysis employing a basic electrolyte, with gaseous fossil fuel, and generating an electrolytic gas composite fuel.
    Type: Application
    Filed: January 19, 2009
    Publication date: August 6, 2009
    Inventors: Toshigoro Sato, Toshihiko Sato, Nobuo Takayama
  • Publication number: 20090189268
    Abstract: Of three chips (2A), (2B), and (2C) mounted on a main surface of a package substrate (1) in a multi-chip module (MCM), a chip (2A) with a DRAM formed thereon and a chip (2B) with a flash memory formed thereon are electrically connected to wiring lines (5) of the package substrate (1) through Au bumps (4), and a gap formed between main surfaces (lower surfaces) of the chips (2A), (2B) and a main surface of the package substrate (1) is filled with an under-fill resin (6). A chip (2C) with a high-speed microprocessor formed thereon is mounted over the two chips (2A) and (2B) and is electrically connected to bonding pads (9) of the package substrate (1) through Au wires (8).
    Type: Application
    Filed: April 7, 2009
    Publication date: July 30, 2009
    Inventors: Yoshiyuki KADO, Takahiro Naito, Hikaru Ikegami, Takafumi Kikuchi, Toshihiko Sato
  • Publication number: 20090166191
    Abstract: Disclosed is an apparatus for generating a water electrolytic gas, wherein an electrolyte inlet is formed in the bottom of an electrolytic cell for generation of a water electrolytic gas, and an outlet is formed in the top thereof for the extraction of a mixture of an electrolyte and a generated gas. In the electrolytic cell, an anode and a cathode are provided, and an alkali electrolyte spinning and passing portion are arranged between these electrodes. With this arrangement, water electrolysis is performed, and a mixture of the electrolyte and a water electrolytic gas is extracted from the upper end of the electrolytic cell and transferred to a water electrolytic gas/electrolyte separation cell. A gas-liquid separation process extracts only the water electrolytic gas to the exterior, while the electrolyte is returned to the electrolytic cell by an electrolyte circulation device, to continue the performance of the electrolytic reaction.
    Type: Application
    Filed: December 10, 2008
    Publication date: July 2, 2009
    Inventors: Toshigoro Sato, Toshihiko Sato, Nobuo Takayama
  • WIG
    Publication number: 20090165810
    Abstract: A hair material for a wig is preliminarily curled and then bound to a wig base to thereby orient the curled hair in a definite direction. A folded part (10c) of a hair material (10) is penetrated from one side of a filament (15) to the other side under a wig base (12) so that a first loop (17) is formed in the inner side of the folded part (10c). A curved part (10d) is inserted though the first loop (17) so that a second loop (19) is formed in the inner side of the curved part (10d). A part (10b) of the hair material is inserted through the second loop (19). Next, the hair material parts (10a, 10b) are pulled in directions opposite to each other and tied with the filament (15) to (20). Thus, the hair material (10) is bound to the filament (15).
    Type: Application
    Filed: April 12, 2006
    Publication date: July 2, 2009
    Inventors: Yasuhisa Sotokawa, Katsuo Sugai, Yutaka Shirakashi, Toshihiko Sato, Akemi Irikura
  • Patent number: 7531441
    Abstract: Of three chips (2A), (2B), and (2C) mounted on a main surface of a package substrate (1) in a multi-chip module (MCM), a chip (2A) with a DRAM formed thereon and a chip (2B) with a flash memory formed thereon are electrically connected to wiring lines (5) of the package substrate (1) through Au bumps (4), and a gap formed between main surfaces (lower surfaces) of the chips (2A), (2B) and a main surface of the package substrate (1) is filled with an under-fill resin (6). A chip (2C) with a high-speed microprocessor formed thereon is mounted over the two chips (2A) and (2B) and is electrically connected to bonding pads (9) of the package substrate (1) through Au wires (8).
    Type: Grant
    Filed: April 7, 2006
    Date of Patent: May 12, 2009
    Assignee: Renesas Technology Corp.
    Inventors: Yoshiyuki Kado, Takahiro Naito, Toshihiko Sato, Hikaru Ikegami, Takafumi Kikuchi
  • Patent number: 7530748
    Abstract: A camera module is composed from a lens unit including at least one lens, a barrel provided with the lens and having a barrel opening, and a lens holder for holding the barrel; and an image pickup device portion provided under the lens unit and having an image pickup device housing space in which an image pickup device is hermetically provided. The barrel opening of the barrel has an annular edge which serves as a diaphragm, and the annular edge of the barrel opening has a lower annular corner portion which is located on the side of the lens, wherein the lower annular corner portion of the annular edge is formed so as to have a rounded cross-sectional shape and staining is formed on the lower annular corner portion.
    Type: Grant
    Filed: July 28, 2006
    Date of Patent: May 12, 2009
    Assignee: Mitsumi Electric Co., Ltd.
    Inventors: Hisashi Shibata, Toshihiko Sato
  • Patent number: 7428111
    Abstract: A camera module has a lens unit and an image pickup portion. The lens unit has at least one lens and a lens holder for holding the lens. The image pickup portion, which is provided below the lens unit, has a substrate, an image pickup device mounted on the substrate, a housing space for housing the image pickup device therein in a hermetically sealed state, and a base provided above the substrate. The base has an opening for introducing light passing through the lens to the image pickup device, a support portion located around the opening, and a recessed groove located around the support portion for holding a resin adhesive for bonding. The image pickup portion also has a filter having a peripheral portion bonded to an upper surface of the support portion so as to cover the opening.
    Type: Grant
    Filed: July 28, 2006
    Date of Patent: September 23, 2008
    Assignee: Mitsumi Electric Co., Ltd.
    Inventors: Hisashi Shibata, Toshihiko Sato
  • Publication number: 20080141752
    Abstract: The present invention is a press forging method by which porosities in a raw material are removed and mechanical properties such as ductility and toughness of a steel product are at a required level in a case that a steel ingot is treated as a raw material in press forging. A cylindrical steel ingot (a so-called “round billet”) is set onto a die as a raw material, and, a forging process is applied to the steel ingot so that buckling of the steel is not generated during the forging process and that a reduction ratio and a forging ratio are more than predetermined values, respectively.
    Type: Application
    Filed: November 28, 2007
    Publication date: June 19, 2008
    Inventors: Toshihiko Sato, Yugo Takeuchi, Yasuo Yoshida, Noboru Kakizawa, Takehiro Osugi, Takanori Yoshikawa
  • Publication number: 20070097549
    Abstract: A magnetic head assembly is provided. The magnetic head assembly has electrode pads of a slider that have a magnetoresistive element installed therein and electrode pads of a flexible printed circuit that connect the magnetoresistive element to an external circuit are bonded by solder. In one embodiment, an Au layer is formed on solder contact surfaces of the electrode pads of the slider and the flexible printed circuit, and an AuSn dispersion layer where Au atoms of the Au layer are dispersed is formed at least on the boundary between the solder contact surfaces of the electrode pads and the solder.
    Type: Application
    Filed: October 27, 2006
    Publication date: May 3, 2007
    Applicant: ALPS ELECTRIC CO., LTD
    Inventors: Ooki Yamaguchi, Takao Haino, Hideaki Abe, Toshihiko Sato
  • Publication number: 20070053685
    Abstract: A camera module is composed from a lens unit including at least one lens, a barrel provided with the lens and having a barrel opening, and a lens holder for holding the barrel; and an image pickup device portion provided under the lens unit and having an image pickup device housing space in which an image pickup device is hermetically provided. The barrel opening of the barrel has an annular edge which serves as a diaphragm, and the annular edge of the barrel opening has a lower annular corner portion which is located on the side of the lens, wherein the lower annular corner portion of the annular edge is formed so as to have a rounded cross-sectional shape and staining is formed on the lower annular corner portion.
    Type: Application
    Filed: July 28, 2006
    Publication date: March 8, 2007
    Inventors: Hisashi Shibata, Toshihiko Sato
  • Publication number: 20070047109
    Abstract: A camera module has a lens unit and an image pickup portion. The lens unit has at least one lens and a lens holder for holding the at least one lens. The image pickup portion is provided below the lens unit. The image pickup portion has a substrate, an image pickup device mounted on the substrate, a housing space for housing the image pickup device therein in a hermetically sealed state, and a base provided above the substrate. The base has an opening for introducing light passing through the at least one lens to the image pickup device in the housing space, a support portion located around the opening, and a recessed groove located around the support portion for holding a resin adhesive for bonding. The image pickup portion also has a filter having a peripheral portion bonded to an upper surface of the support portion so as to cover the opening of the base.
    Type: Application
    Filed: July 28, 2006
    Publication date: March 1, 2007
    Inventors: Hisashi Shibata, Toshihiko Sato
  • Patent number: 7180806
    Abstract: A memory space of a memory cell array is divided into a plurality of submemory spaces. A refresh control circuit executes a control of performing refreshment of information to the submemory spaces that are in use at the time of the refreshment of the information and need the refreshment among the plurality of submemory spaces and executes a control of not performing the refreshment to the submemory spaces that are not in use and do not need the refreshment.
    Type: Grant
    Filed: February 25, 2004
    Date of Patent: February 20, 2007
    Assignee: Sony Corporation
    Inventors: Shigeji Ikeda, Shinichi Fukuda, Isao Ohdaira, Toshihiko Sato
  • Publication number: 20060221501
    Abstract: A slider includes electrode pads each of which is bonded to an electrode pad of a flexible printed circuit board through a solder ball. Surface cleaning is performed on the electrode pad of the slider in a vacuum atmosphere, and an Au surface protective film is formed on a new film surface of the same electrode pad. The entire surface of the same electrode pad is covered with the protective film. When the electrode pads of the slider and the flexible printed circuit board are bonded to each other by soldering, a solder ball is melted between the electrode pads, so that a solder fillet is formed in contact with the top surface of the electrode pad of the slider, side surfaces of the same electrode pad close to the flexible printed circuit board, and the top surface of the electrode pad of the flexible printed circuit board.
    Type: Application
    Filed: March 23, 2006
    Publication date: October 5, 2006
    Inventors: Toshihiko Sato, Ooki Yamaguchi, Naruaki Oki, Masayuki Obana, Masayoshi Nakagawa