Patents by Inventor Toshihiko Shimada

Toshihiko Shimada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230391664
    Abstract: The present invention provides a plating film that exhibits good adhesion to glass substrates. The present invention is a plating film comprising an oxide layer, an electroless plating film, and an electrolytic copper plating film in this order.
    Type: Application
    Filed: June 1, 2022
    Publication date: December 7, 2023
    Applicants: OKUNO CHEMICAL INDUSTRIES CO., LTD., PANASONIC HOLDINGS CORPORATION
    Inventors: Mayu Tsukuda, Toshimitsu Nagao, Junichi Katayama, Kazuya Shimada, Masahito Hayamizu, Toshihiko Sakata, Shuhei Fuku, Asuka Hirooka
  • Publication number: 20230389189
    Abstract: Method for forming a metal film includes forming an oxide layer on a to-be-treated surface of a to-be-treated object by bringing the to-be-treated surface into contact with a reaction solution containing fluorine and an oxide precursor, removing fluorine in the oxide layer, supporting a catalyst on the oxide layer by bringing the oxide layer into contact with a catalyst solution, and depositing a metal film on the oxide layer by bringing the oxide layer into contact with an electroless plating liquid.
    Type: Application
    Filed: June 2, 2023
    Publication date: November 30, 2023
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Kazuya SHIMADA, Masahito HAYAMIZU, Toshihiko SAKATA, Makoto CHAKUNO
  • Patent number: 11825608
    Abstract: A method for forming a metal film includes forming an oxide layer on a to-be-treated surface of a to-be-treated object by bringing the to-be-treated surface into contact with a reaction solution containing fluorine and an oxide precursor, removing fluorine in the oxide layer, supporting a catalyst on the oxide layer by bringing the oxide layer into contact with a catalyst solution, and depositing a metal film on the oxide layer by bringing the oxide layer into contact with an electroless plating liquid.
    Type: Grant
    Filed: December 24, 2020
    Date of Patent: November 21, 2023
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Kazuya Shimada, Masahito Hayamizu, Toshihiko Sakata, Makoto Chakuno
  • Patent number: 5585195
    Abstract: A metal insert at least partially embedded in a molded resin mass comprises a metal insert blank, and a substantial amount of nickel or nickel alloy granulations produced over a surface of the metal insert blank, and the size of the granulations is at most 1.0 .mu.m. The metal insert blank is treated by a first electrolytic plating process such that a substantial quantity of copper nuclei spreaded over the surface, and the copper nuclei are grown up as the nickel or nickel alloy granulations by a second electrolytic-plating process. The first electrolytic-plating process is controlled such that an average thickness of plating is from about 0.5 to about 1.0 .mu.m, and the second electrolytic-plating process is controlled such that an average thickness of plating is from about 0.5 to about 1.5 .mu.m.
    Type: Grant
    Filed: July 12, 1993
    Date of Patent: December 17, 1996
    Assignee: Shinko Electric Industries Company, Limited
    Inventor: Toshihiko Shimada
  • Patent number: 5384204
    Abstract: A tape useful for an automatic bonding process when manufacturing a high-frequency semiconductor device, the tape comprising an insulating flexible film, and circuit patterns consisting of copper or copper-alloy formed on the insulating film, each of the circuit patterns having inner and an outer lead portions. A tin or tin-lead plated film is formed on the pattern, and an intermediate plated film is formed on at least the outer lead portion as an underlayer. The intermediate plated film consists of a metal or metal alloy selected from nickel, cobalt, gold, silver, platinum, palladium, indium or rhodium.
    Type: Grant
    Filed: December 14, 1993
    Date of Patent: January 24, 1995
    Assignee: Shinko Electric Industries Co. Ltd.
    Inventors: Kazuhito Yumoto, Norio Wakabayashi, Masao Nakazawa, Shinichi Wakabayashi, Norio Wada, Fumio Kuraishi, Toshihiko Shimada
  • Patent number: 4894752
    Abstract: A lead frame for a semiconductor device includes a metal strip made of copper or copper alloy having a plurality of wire bonding areas to which metal wires are directly connected by a direct bonding method. The wire bonding areas are electroplated with a thin silver film or a palladium film, so that formation of a copper oxidized film on the wire bonding area is substantially prevented.
    Type: Grant
    Filed: July 14, 1988
    Date of Patent: January 16, 1990
    Assignee: Shinko Electric Industries, Co., Ltd.
    Inventors: Akihiko Murata, Toshihiko Shimada
  • Patent number: 4158754
    Abstract: A mounting apparatus for communication signals exchange equipment is described. The apparatus includes supporting poles, each of which is erected close to each of the components of the communication signals exchange equipment, and further includes frameworks which are assembled horizontally above said supporting poles and rigidly fixed to the top ends of said supporting poles. The supporting poles and frameworks are provided both for mechanically supporting said components and for distributing a large number of communication signals cables between one component and other components. The construction of both the supporting poles and frameworks is completed by the time said components are located at their desired positions.
    Type: Grant
    Filed: August 20, 1976
    Date of Patent: June 19, 1979
    Assignee: Fujitsu Limited
    Inventors: Jimpachi Yonezaki, Yoshihiro Takahashi, Toshihiko Shimada, Katsuo Okuyama