Abstract: The present invention provides a plating film that exhibits good adhesion to glass substrates. The present invention is a plating film comprising an oxide layer, an electroless plating film, and an electrolytic copper plating film in this order.

Abstract: A metal insert at least partially embedded in a molded resin mass comprises a metal insert blank, and a substantial amount of nickel or nickel alloy granulations produced over a surface of the metal insert blank, and the size of the granulations is at most 1.0 .mu.m. The metal insert blank is treated by a first electrolytic plating process such that a substantial quantity of copper nuclei spreaded over the surface, and the copper nuclei are grown up as the nickel or nickel alloy granulations by a second electrolytic-plating process. The first electrolytic-plating process is controlled such that an average thickness of plating is from about 0.5 to about 1.0 .mu.m, and the second electrolytic-plating process is controlled such that an average thickness of plating is from about 0.5 to about 1.5 .mu.m.

Abstract: A tape useful for an automatic bonding process when manufacturing a high-frequency semiconductor device, the tape comprising an insulating flexible film, and circuit patterns consisting of copper or copper-alloy formed on the insulating film, each of the circuit patterns having inner and an outer lead portions. A tin or tin-lead plated film is formed on the pattern, and an intermediate plated film is formed on at least the outer lead portion as an underlayer. The intermediate plated film consists of a metal or metal alloy selected from nickel, cobalt, gold, silver, platinum, palladium, indium or rhodium.

Abstract: A lead frame for a semiconductor device includes a metal strip made of copper or copper alloy having a plurality of wire bonding areas to which metal wires are directly connected by a direct bonding method. The wire bonding areas are electroplated with a thin silver film or a palladium film, so that formation of a copper oxidized film on the wire bonding area is substantially prevented.

Abstract: A mounting apparatus for communication signals exchange equipment is described. The apparatus includes supporting poles, each of which is erected close to each of the components of the communication signals exchange equipment, and further includes frameworks which are assembled horizontally above said supporting poles and rigidly fixed to the top ends of said supporting poles. The supporting poles and frameworks are provided both for mechanically supporting said components and for distributing a large number of communication signals cables between one component and other components. The construction of both the supporting poles and frameworks is completed by the time said components are located at their desired positions.