Patents by Inventor Toshihiko Toyama

Toshihiko Toyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wire bonding method
    Publication number: 20010042777
    Abstract: A wire bonding apparatus equipped with a chip heating assembly which is installed above a heater block that contains heaters so as to heat the chip portion of a device such as a semiconductor device, and a cooling pipe which is installed in the heater block so as to cool the heater block. The temperature of the bonding surface of the device is maintained by the chip heating assembly at a temperature that allows bonding to be executed while the heater block is cooled by cooling water or a cooling air draft that flows through the cooling pipe so that the temperature of the heater block is maintained at a low temperature that cause no softening of the resin substrate of the device.
    Type: Application
    Filed: July 25, 2001
    Publication date: November 22, 2001
    Applicant: KABUSHIKI KAISHA SHINKAWA
    Inventors: Ryuichi Kyomasu, Fumio Miyano, Toshihiko Toyama