Patents by Inventor Toshihiko Ueyama

Toshihiko Ueyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10062473
    Abstract: A silver-coated copper alloy powder, which has a low volume resistivity and excellent storage stability (reliability), is produced by coating a copper alloy powder, which has a chemical composition comprising 1 to 50 wt % of at least one of nickel and zinc and the balance being copper and unavoidable impurities (preferably a copper alloy powder wherein a particle diameter (D50 diameter) corresponding to 50% of accumulation in cumulative distribution of the copper alloy powder, which is measured by a laser diffraction particle size analyzer, is 0.1 to 15 ?m), with 7 to 50 wt % of a silver containing layer, preferably a layer of silver or an silver compound.
    Type: Grant
    Filed: January 15, 2013
    Date of Patent: August 28, 2018
    Assignee: Dowa Electronics Materials Co., Ltd.
    Inventors: Kenichi Inoue, Kozo Ogi, Atsushi Ebara, Yuto Hiyama, Takahiro Yamada, Toshihiko Ueyama
  • Publication number: 20180218814
    Abstract: An object is to provide a magnetic compound excellent in high frequency properties and excellent in mechanical strength, and its related items, using the polyarylene sulfide resin, and to provide a technique regarding the magnetic compound having a metal magnetic powder and a polyarylene sulfide resin, and satisfying both mechanical strength and high frequency properties.
    Type: Application
    Filed: June 1, 2016
    Publication date: August 2, 2018
    Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Takayuki YOSHIDA, Masahiro GOTOH, Toshihiko UEYAMA, Takuyuki BABA, Toru SUZUKI, Koji TANAKA
  • Patent number: 10008471
    Abstract: A bonded product is obtained by applying a silver paste containing silver nanoparticles having an average primary particle diameter of 1 to 200 nm, and performing firing. A diameter of a crystallite of the bonded product on a (111) plane of Ag when heated at 250° C. for 10 minutes in an inert atmosphere is 65 nm or larger.
    Type: Grant
    Filed: December 11, 2015
    Date of Patent: June 26, 2018
    Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Keiichi Endoh, Yutaka Hisaeda, Akihiro Miyazawa, Aiko Hirata, Toshihiko Ueyama
  • Publication number: 20180151279
    Abstract: A magnetic compound having a small dielectric loss and an antenna constituted by the magnetic compound and an electronic device incorporating the antenna are provided by a metal magnetic powder which is well dispersed in a resin having small dielectric loss, and a magnetic powder composite including: a metal magnetic powder; and one or more elements selected from carboxylic acid or its anhydride, aromatic carboxylic acid ester, and a derivative thereof, having a property that real part ?? permeability is 1.45 or more, tan ?? is 0.1 or less, tan ?? is 0.05 or less at a measuring frequency of 2 GHz, when a magnetic powder composite is prepared by adding 5 parts by mass of one or more elements selected from the carboxylic acid or its anhydride, the aromatic carboxylic acid ester, and the derivative thereof to 100 parts by mass of the metal magnetic powder.
    Type: Application
    Filed: June 1, 2016
    Publication date: May 31, 2018
    Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Toshihiko UEYAMA, Masahiro GOTOH, Takayuki YOSHIDA, Takuyuki BABA
  • Publication number: 20180033530
    Abstract: An object of the present invention is to provide a magnetic compound excellent in high-frequency property and excellent in mechanical strength and related materials thereof by using at least one of resins selected from syndiotactic polystyrene (SPS) resin and modified polyphenylene ether (m-PPE) resin, including at least one of resins selected from syndiotactic polystyrene (SPS) resin and modified polyphenylene ether (m-PPE) resin, wherein content of the resin is 21 mass % or more.
    Type: Application
    Filed: February 24, 2016
    Publication date: February 1, 2018
    Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Toshihiko UEYAMA, Masahiro GOTOH, Takayuki YOSHIDA, Takuyuki BABA
  • Patent number: 9679670
    Abstract: There is provided an aggregate of radioactive material removing particles in which two or more radioactive material removing particles having magnetic particles and a radioactive material adsorption component are assembled, wherein a pore volume in the aggregate is 0.5 mL/g or more and 5.0 mL/g or less, and the pore volume means a cumulative value obtained by a mercury press-in method.
    Type: Grant
    Filed: May 19, 2014
    Date of Patent: June 13, 2017
    Assignees: THE JIKEI UNIVERSITY, DOWA HOLDINGS CO., LTD.
    Inventors: Yoshihisa Namiki, Toshihiko Ueyama, Takayuki Yoshida
  • Patent number: 9673465
    Abstract: The present invention provides a catalyst in which a reaction initiation temperature at which self-heating function is exhibited is low and which is capable of suppressing carbon accumulation even when a reaction is repeated. The catalyst of the present invention includes a CeZr-based oxide, silicon, and a catalytically active metal, wherein the CeZr-based oxide satisfies CexZryO2 (x+y=1) and the silicon satisfies molar ratios of 0.02?Si/Zr and 0.01<Si/(Ce+Zr+Si)<0.2. When the catalyst is used, a reduction temperature for generating initial oxygen deficiency can be decreased. Depending on the catalytically active metal, a reduction activation treatment can be performed even at about 20° C. without any need for heating. In a repeated hydrogen generating reaction, the deposition of carbon generated on the surface of the catalyst can be suppressed, and a decrease in catalytic activity can be prevented.
    Type: Grant
    Filed: March 7, 2013
    Date of Patent: June 6, 2017
    Assignees: OITA UNIVERSITY, DOWA HOLDINGS CO., LTD.
    Inventors: Katsutoshi Nagaoka, Tatsuro Miyazaki, Takuya Yano, Kazumasa Ikari, Toshihiko Ueyama
  • Patent number: 9486879
    Abstract: There is provided a bonding material capable of forming a bonding body under an inert gas atmosphere such as a nitrogen atmosphere, and capable of exhibiting a bonding strength that endures a practical use even if not a heat treatment is applied thereto at a high temperature, which is the bonding material containing silver nanoparticles coated with a fatty acid having a carbon number of 8 or less and having an average primary particle size of 1 nm or more and 200 nm or less, and silver particles having an average particle size of 0.5 ?m or more and 10 ?m or less, and an organic material having two or more carboxyl groups.
    Type: Grant
    Filed: May 13, 2011
    Date of Patent: November 8, 2016
    Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Satoru Kurita, Keiichi Endoh, Yu Saito, Yutaka Hisaeda, Toshihiko Ueyama
  • Publication number: 20160172328
    Abstract: A method of bonding two different substances includes the steps of: applying a bonding material containing a flux component that includes an organic material having at least two carboxyl groups to a bonding surface of a bonding object, disposing an object to be bonded on the bonding material, performing preliminary firing at a preset temperature in a state in which the object to be bonded is disposed, and performing a main firing by heating at a temperature higher than the temperature of the preliminary firing.
    Type: Application
    Filed: December 11, 2015
    Publication date: June 16, 2016
    Applicant: DOWA Electronics Materials Co., Ltd.
    Inventors: Keiichi ENDOH, Yutaka HISAEDA, Akihiro MIYAZAWA, Aiko NAGAHARA, Toshihiko UEYAMA
  • Patent number: 9311947
    Abstract: A metal magnetic powder having a metal magnetic phase mainly composed of ferromagnetic elements, and composed of particles containing one or more kinds of elements selected from rare earth elements including Y, and Al, Si. And the method for producing the metal magnetic powder, including the steps of: eluting the non-magnetic components in the particles under an action of a reducing agent acting on the metal magnetic powder, in a solution containing a complexing agent capable of forming the complex with the non-magnetic components; and forming an oxide layer on the particles in the solution after eluting the non-magnetic components into the solution, without drying the particles.
    Type: Grant
    Filed: March 31, 2011
    Date of Patent: April 12, 2016
    Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Hirohisa Omoto, Takayuki Kikuchi, Toshihiko Ueyama
  • Publication number: 20160099087
    Abstract: A bonded product is obtained by applying a silver paste containing silver nanoparticles having an average primary particle diameter of 1 to 200 nm, and performing firing. A diameter of a crystallite of the bonded product on a (111) plane of Ag when heated at 250° C. for 10 minutes in an inert atmosphere is 65 nm or larger.
    Type: Application
    Filed: December 11, 2015
    Publication date: April 7, 2016
    Applicant: DOWA Electronics Materials Co., Ltd.
    Inventors: Keiichi ENDOH, Yutaka HISAEDA, Akihiro MIYAZAWA, Aiko NAGAHARA, Toshihiko UEYAMA
  • Patent number: 9240256
    Abstract: A method of forming a bonded product using metal nanoparticles is provided. More specifically, provided is a paste containing a flux component that can form a metal phase even in an inert atmosphere. The use of this paste allows a bonding material that can give a practically acceptable bonding strength to be provided in an inert atmosphere such as a nitrogen atmosphere at low temperatures without performing conventionally used pressurization. The paste is a bonding material configured to include: silver nanoparticles having an average primary particle diameter of 1 to 200 nm and coated with an organic material having 8 or less carbon atoms; a flux component having at least two carboxyl groups; and a dispersion medium. The use of this bonding material allows materials to be bonded even at a temperature of 300° C. or lower.
    Type: Grant
    Filed: April 23, 2010
    Date of Patent: January 19, 2016
    Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Keiichi Endoh, Yutaka Hisaeda, Akihiro Miyazawa, Aiko Nagahara, Toshihiko Ueyama
  • Publication number: 20150364814
    Abstract: There is provided a silver conductive film capable of inexpensively mass-producing conductive circuits, such as antennas for IC tags, which have excellent electrical characteristic and flexibility, by applying a silver particle dispersing solution, which contains 50-70% by weight of silver particles having a mean particle diameter of 20 nm or less, on a substrate by the flexographic printing, and then, calcining the silver particle dispersing solution to produce a silver conductive film, which contains 10-50% by volume of a sintered body of the silver particles and which has a volume resistivity of 3-100 ??·cm, a surface resistivity of 0.5?/? or less and a thickness of 1-6 ?m.
    Type: Application
    Filed: February 1, 2013
    Publication date: December 17, 2015
    Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Hidefumi Fujita, Shinichi Konno, Kimitaka Sato, Toshihiko Ueyama
  • Publication number: 20150239758
    Abstract: There is provided a method of producing a radioactive cesium decontaminator, including: suspending magnetic particles in a solvent, and coating each magnetic particle with organic monomer or polymer, to thereby form a precursor; adding a ferrocyanide aqueous solution and an aqueous solution containing at least one kind of transition metal into a suspension liquid containing the precursor after coating while applying a strong shear force, to thereby generate a radioactive cesium decontaminator; and removing water content from a slurry containing the obtained radioactive cesium decontaminator.
    Type: Application
    Filed: September 10, 2013
    Publication date: August 27, 2015
    Applicants: THE JIKEI UNIVERSITY, DOWA HOLDING CO., LTD.
    Inventors: Yoshihisa Namiki, Toshihiko Ueyama, Takayuki Yoshida, Ryoei Watanabe
  • Publication number: 20150171448
    Abstract: The present invention provides a catalyst in which a reaction initiation temperature at which self-heating function is exhibited is low and which is capable of suppressing carbon accumulation even when a reaction is repeated. The catalyst of the present invention includes a CeZr-based oxide, silicon, and a catalytically active metal, wherein the CeZr-based oxide satisfies CexZryO2 (x+y=1) and the silicon satisfies molar ratios of 0.02?Si/Zr and 0.01<Si/(Ce+Zr+Si)<0.2. When the catalyst is used, a reduction temperature for generating initial oxygen deficiency can be decreased. Depending on the catalytically active metal, a reduction activation treatment can be performed even at about 20° C. without any need for heating. In a repeated hydrogen generating reaction, the deposition of carbon generated on the surface of the catalyst can be suppressed, and a decrease in catalytic activity can be prevented.
    Type: Application
    Filed: March 7, 2013
    Publication date: June 18, 2015
    Applicants: DOWA HOLDINGS CO., LTD., OITA UNIVERSITY
    Inventors: Katsutoshi Nagaoka, Tatsuro Miyazaki, Takuya Yano, Kazumasa Ikari, Toshihiko Ueyama
  • Publication number: 20140346413
    Abstract: A silver-coated copper alloy powder, which has a low volume resistivity and excellent storage stability (reliability), is produced by coating a copper alloy powder, which has a chemical composition comprising 1 to 50 wt % of at least one of nickel and zinc and the balance being copper and unavoidable impurities (preferably a copper alloy powder wherein a particle diameter (D50 diameter) corresponding to 50% of accumulation in cumulative distribution of the copper alloy powder, which is measured by a laser diffraction particle size analyzer, is 0.1 to 15 ?m), with 7 to 50 wt % of a silver containing layer, preferably a layer of silver or an silver compound.
    Type: Application
    Filed: January 15, 2013
    Publication date: November 27, 2014
    Inventors: Kenichi Inoue, Kozo Ogi, Atsushi Ebara, Yuto Hiyama, Takahiro Yamada, Toshihiko Ueyama
  • Publication number: 20140346115
    Abstract: There is provided an aggregate of radioactive material removing particles in which two or more radioactive material removing particles having magnetic particles and a radioactive material adsorption component are assembled, wherein a pore volume in the aggregate is 0.5 mL/g or more and 5.0 mL/g or less, and the pore volume means a cumulative value obtained by a mercury press-in method.
    Type: Application
    Filed: May 19, 2014
    Publication date: November 27, 2014
    Inventors: Yoshihisa NAMIKI, Toshihiko UEYAMA, Takayuki YOSHIDA
  • Patent number: 8858700
    Abstract: In a bonding material using nanoparticles and a bonding method, use in combination with microparticles is proposed. However, there is the problem in which it is not easy to uniformly mix the nanoparticles and the microparticles. The present invention uses a bonding material including metal nanoparticles having an average particle diameter of 100 nm or less and a surface coated with an organic substance having 6 to 8 carbon atoms, and a polar solvent in an amount of 5 to 20% by mass with respect to a powder of the metal nanoparticles, and objects to be bonded with the bonding material interposed therebetween are fired at 200 to 350° C. under pressure. Thus, the metal nanoparticles are melted and returned to a bulk material, and therefore a bonding layer of the bulk material can be formed at a low temperature equal to or lower than a melting point.
    Type: Grant
    Filed: October 23, 2009
    Date of Patent: October 14, 2014
    Assignee: DOWA Electronics Materials Co., Ltd.
    Inventors: Keiichi Endoh, Aiko Nagahara, Yutaka Hisaeda, Toshihiko Ueyama
  • Patent number: 8852314
    Abstract: A magnetic powder for magnetic recording medium comprises acicular particles constituted primarily of Fe, wherein the powder contains Co in an amount such that the Co/Fe ratio is 50 at. % or less and the Co is contained in a manner such that the surface portion has a higher concentration than the core portion of the particles, and upon subjecting the magnetic powder for magnetic recording medium to TG measurement, the powder exhibits at least two oxidation starting points: a low-temperature side oxidation starting point and a high-temperature side oxidation starting point. The magnetic powder achieves improved resistance to oxidation without sacrificing magnetic characteristics.
    Type: Grant
    Filed: March 3, 2011
    Date of Patent: October 7, 2014
    Assignee: Dowa Electronics Materials Co., Ltd.
    Inventors: Shinichi Konno, Kenichi Inoue, Toshihiko Ueyama, Kenji Masada, Shinya Sasaki
  • Patent number: 8641929
    Abstract: Provided is a bonding material which enables formation of a bonded article in nitrogen, and can exhibit bonding strength to withstand practical use while having reduced bonding fluctuations between samples without a heat treatment procedure under pressurized or high temperature conditions. The bonding material comprises: silver nanoparticles having an average primary particle diameter of 1 to 200 nm and coated with an organic substance having 8 carbon atoms or less; a dispersion medium having a boiling point of 230° C. or higher; and a flux component including an organic matter having at least two carboxyl groups. Particularly, it is preferable to use the silver nanoparticles and submicron silver particles in combination.
    Type: Grant
    Filed: June 10, 2011
    Date of Patent: February 4, 2014
    Assignee: Dowa Electronics Materials Co., Ltd.
    Inventors: Keiichi Endoh, Yutaka Hisaeda, Akihiro Miyazawa, Aiko Nagahara, Toshihiko Ueyama