Patents by Inventor Toshihiko Umezu

Toshihiko Umezu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Light emitting diode, optical semiconductor device, epoxy resin composition and phosphor suited for optical semiconductor device, and method for manufacturing the same
    Patent number: 7550096
    Abstract: A method for producing a fluorescent material involving firing a mixture of a stock material and a flux. The method may involve a first firing process involving firing the mixture of the stock material and the flux in a weakly reducing atmosphere, followed by firing the resulting material in a second reducing atmosphere that is more reducing than the first weakly reducing atmosphere. The flux may include a liquid.
    Type: Grant
    Filed: December 28, 2007
    Date of Patent: June 23, 2009
    Assignee: Nichia Corporation
    Inventors: Kensho Sakano, Kazuhiko Sakai, Yuji Okada, Toshihiko Umezu
  • Light Emitting Diode, Optical Semiconductor Device, Epoxy Resin Composition Suited for Optical Semiconductor Device, and Method for Manufacturing the Same
    Publication number: 20080099727
    Abstract: A light emitting diode comprising an LED chip having a light emitting layer made of a nitride compound semiconductor and a light transmitting resin that includes a fluorescent material which absorbs at least a part of light emitted by the LED chip and emits light of a different wavelength, wherein the fluorescent material includes a fluorescent particles of small particle size and a fluorescent particles of large particle size, the fluorescent particles of large particle size being distributed in the vicinity of the LED chip in the light transmitting resin to form a wavelength converting layer, the fluorescent particles of small particle size being distributed on the outside of the wavelength converting layer in the light transmitting resin.
    Type: Application
    Filed: December 28, 2007
    Publication date: May 1, 2008
    Applicant: NICHIA CORPORATION
    Inventors: Kensho SAKANO, Kazuhiko Sakai, Yuji Okada, Toshihiko Umezu
  • Light emitting diode, optical semiconductor device, epoxy resin composition suited for optical semiconductor device, and method for manufacturing the same
    Patent number: 7342357
    Abstract: A light emitting diode comprising an LED chip having a light emitting layer made of a nitride compound semiconductor and a light transmitting resin that includes a fluorescent material which absorbs at least a part of light emitted by the LED chip and emits light of a different wavelength, wherein the fluorescent material includes a fluorescent particles of small particle size and a fluorescent particles of large particle size, the fluorescent particles of large particle size being distributed in the vicinity of the LED chip in the light transmitting resin to form a wavelength converting layer, the fluorescent particles of small particle size being distributed on the outside of the wavelength converting layer in the light transmitting resin.
    Type: Grant
    Filed: June 9, 2005
    Date of Patent: March 11, 2008
    Assignee: Nichia Corporation
    Inventors: Kensho Sakano, Kazuhiko Sakai, Yuji Okada, Toshihiko Umezu
  • Light emitting diode, optical semiconductor element and epoxy resin composition suitable for optical semiconductor element and production methods therefor
    Patent number: 6960878
    Abstract: A light emitting diode comprising an LED chip having a light emitting layer made of a nitride compound semiconductor and a light transmitting resin that includes a fluorescent material which absorbs at least a part of light emitted by the LED chip and emits light of a different wavelength, wherein the fluorescent material includes a fluorescent particles of small particle size and a fluorescent particles of large particle size, the fluorescent particles of large particle size being distributed in the vicinity of the LED chip in the light transmitting resin to form a wavelength converting layer, the fluorescent particles of small particle size being distributed on the outside of the wavelength converting layer in the light transmitting resin.
    Type: Grant
    Filed: January 24, 2002
    Date of Patent: November 1, 2005
    Assignee: Nichia Corporation
    Inventors: Kensho Sakano, Kazuhiko Sakai, Yuji Okada, Toshihiko Umezu
  • Light emitting diode, optical semiconductor device, epoxy resin composition suited for optical semiconductor device, and method for manufacturing the same
    Publication number: 20050224821
    Abstract: A light emitting diode comprising an LED chip having a light emitting layer made of a nitride compound semiconductor and a light transmitting resin that includes a fluorescent material which absorbs at least a part of light emitted by the LED chip and emits light of a different wavelength, wherein the fluorescent material includes a fluorescent particles of small particle size and a fluorescent particles of large particle size, the fluorescent particles of large particle size being distributed in the vicinity of the LED chip in the light transmitting resin to form a wavelength converting layer, the fluorescent particles of small particle size being distributed on the outside of the wavelength converting layer in the light transmitting resin.
    Type: Application
    Filed: June 9, 2005
    Publication date: October 13, 2005
    Applicant: NICHIA CORPORATION
    Inventors: Kensho Sakano, Kazuhiko Sakai, Yuji Okada, Toshihiko Umezu
  • Light emitting diode, optical semiconductor element and epoxy resin composition suitable for optical semiconductor element and production methods therefor
    Publication number: 20030080341
    Abstract: A light emitting diode comprising an LED chip having a light emitting layer made of a nitride compound semiconductor and a light transmitting resin that includes a fluorescent material which absorbs at least a part of light emitted by the LED chip and emits light of a different wavelength, wherein the fluorescent material includes a fluorescent particles of small particle size and a fluorescent particles of large particle size, the fluorescent particles of large particle size being distributed in the vicinity of the LED chip in the light transmitting resin to form a wavelength converting layer, the fluorescent particles of small particle size being distributed on the outside of the wavelength converting layer in the light transmitting resin.
    Type: Application
    Filed: September 11, 2002
    Publication date: May 1, 2003
    Inventors: Kensho Sakano, Kazuhiko Sakai, Yuji Okada, Toshihiko Umezu