Abstract: A storage to store a dispersion liquid in which particles including a resin are dispersed in a solvent is provided. The storage includes a storage tank to store the dispersion liquid, which is arranged on a passage leading from a dispersion liquid producing device to produce the dispersion liquid to a solvent removing device to remove the solvent from the dispersion liquid; and a pressure adjuster to adjust the pressure of the dispersion liquid in the storage tank to a pressure between the pressure of the dispersion liquid in the dispersion liquid producing device and the pressure of the dispersion liquid in the solvent removing device.

Abstract: A device featuring a substrate configured to include an upper surface and an opposing lower surface and, in parallel, a first and an opposing second peripheral edge, the first peripheral edge being smaller in length than the second peripheral edge, one or more semiconductor chip mounted over the upper surface of the substrate, a control semiconductor chip mounted over the upper surface of the substrate, a sealing resin covering the memory and control chips, and a plurality of external terminals provided over the lower surface of the substrate, the external terminals being arranged in a line along the first peripheral edge. The external terminals are used to fit the device to an electronic apparatus. The device may be a memory card having a stacked arrangement of two or more memory chips, and with the control chip being apart from or included in the stacked arrangement.

Abstract: A storage to store a dispersion liquid in which particles including a resin are dispersed in a solvent is provided. The storage includes a storage tank to store the dispersion liquid, which is arranged on a passage leading from a dispersion liquid producing device to produce the dispersion liquid to a solvent removing device to remove the solvent from the dispersion liquid; and a pressure adjuster to adjust the pressure of the dispersion liquid in the storage tank to a pressure between the pressure of the dispersion liquid in the dispersion liquid producing device and the pressure of the dispersion liquid in the solvent removing device.

Abstract: A semiconductor device includes first to third semiconductor chips. The second semiconductor chip is stacked over the first semiconductor chip. The third semiconductor chip is stacked over the second semiconductor chip. The second semiconductor chip shields the first semiconductor chip from noises generated by the third semiconductor chip. The second semiconductor chip shields the third semiconductor chip from noises generated by the first semiconductor chip.

Abstract: A device featuring a substrate configured to include an upper surface and an opposing lower surface and, in parallel, a first and an opposing second peripheral edge, the first peripheral edge being smaller in length than the second peripheral edge, one or more semiconductor chip mounted over the upper surface of the substrate, a control semiconductor chip mounted over the upper surface of the substrate, a sealing resin covering the memory and control chips, and a plurality of external terminals provided over the lower surface of the substrate, the external terminals being arranged in a line along the first peripheral edge. The external terminals are used to fit the device to an electronic apparatus. The device may be a memory card having a stacked arrangement of two or more memory chips, and with the control chip being apart from or included in the stacked arrangement.

Abstract: A device featuring a substrate configured to include an upper surface and an opposing lower surface and, in parallel, a first and an opposing second peripheral edge, the first peripheral edge being smaller in length than the second peripheral edge, one or more semiconductor chip mounted over the upper surface of the substrate, a control semiconductor chip mounted over the upper surface of the substrate, a sealing resin covering the memory and control chips, and a plurality of external terminals provided over the lower surface of the substrate, the external terminals being arranged in a line along the first peripheral edge. The external terminals are used to fit the device to an electronic apparatus. The device may be a memory card having a stacked arrangement of two or more memory chips, and with the control chip being apart from or included in the stacked arrangement.

Abstract: A device featuring a substrate configured to include an upper surface and an opposing lower surface and, in parallel, a first and an opposing second peripheral edge, the first peripheral edge being smaller in length than the second peripheral edge, one or more semiconductor chip mounted over the upper surface of the substrate, a control semiconductor chip mounted over the upper surface of the substrate, a sealing resin covering the memory and control chips, and a plurality of external terminals provided over the lower surface of the substrate, the external terminals being arranged in a line along the first peripheral edge. The external terminals are used to fit the device to an electronic apparatus. The device may be a memory card having a stacked arrangement of two or more memory chips, and with the control chip being apart from or included in the stacked arrangement.

Abstract: A semiconductor device featuring a substrate having a first surface defined by a first edge and an opposing second edge, electrode pads formed on the first surface, a first semiconductor chip mounted over the first surface between the first edge and the electrode pads and including first pads each electrically connected to a corresponding electrode pad, a second semiconductor chip stacked over the first semiconductor chip and including second pads each electrically connected to a corresponding electrode pad, a third semiconductor chip mounted over the first surface of the substrate between the second edge and the electrode pads and including third pads each electrically connected to a corresponding electrode pad, in which one electrode pad is electrically connected to one first pad, one second pad and one third pad and another electrode pad is electrically connected to a first pad and a second pad corresponding thereto, via separate bonding wires.

Abstract: A semiconductor device includes first to third semiconductor chips. The second semiconductor chip is stacked over the first semiconductor chip. The third semiconductor chip is stacked over the second semiconductor chip. The second semiconductor chip shields the first semiconductor chip from noises generated by the third semiconductor chip. The second semiconductor chip shields the third semiconductor chip from noises generated by the first semiconductor chip.

Abstract: A semiconductor device featuring a substrate having a first surface defined by a first edge and an opposing second edge, electrode pads formed on the first surface, a first semiconductor chip mounted over the first surface between the first edge and the electrode pads and including first pads each electrically connected to a corresponding electrode pad, a second semiconductor chip stacked over the first semiconductor chip and including second pads each electrically connected to a corresponding electrode pad, a third semiconductor chip mounted over the first surface of the substrate between the second edge and the electrode pads and including third pads each electrically connected to a corresponding electrode pad, in which one electrode pad is electrically connected to one first pad, one second pad and one third pad and another electrode pad is electrically connected to a first pad and a second pad corresponding thereto, via separate bonding wires.

Abstract: A semiconductor device includes first to third semiconductor chips. The second semiconductor chip is stacked over the first semiconductor chip. The third semiconductor chip is stacked over the second semiconductor chip. The second semiconductor chip shields the first semiconductor chip from noises generated by the third semiconductor chip. The second semiconductor chip shields the third semiconductor chip from noises generated by the first semiconductor chip.

Abstract: A semiconductor device includes at least bonding wires between electrode pads on a main surface of a semiconductor chip and connection pads on a wiring board. The wires form loop shapes from the electrode pads of the semiconductor chip. The semiconductor device also includes at least forming flat parts on the loop-shaped wires, and using a sealing material to seal the semiconductor chip such as to bury the flat parts.

Abstract: A method including forming an intermediate product, the intermediate product being configured to include a wiring substrate including a plurality of first electrodes, a plurality of second electrodes and a plurality of test electrodes, a first semiconductor chip mounted over the wiring substrate and including a plurality of first pads electrically connected respectively to the first electrodes, and a second semiconductor chip stacked over the first semiconductor chip and including a plurality of second pads electrically connected respectively to the second electrodes; encapsulating the first and second semiconductor chips; and performing electrical tests on the first and second semiconductor chips by use of the test electrodes, after the encapsulating of the first and second semiconductor chips.

Abstract: A method including forming an intermediate product, the intermediate product being configured to include a wiring substrate including a plurality of first electrodes, a plurality of second electrodes and a plurality of test electrodes, a first semiconductor chip mounted over the wiring substrate and including a plurality of first pads electrically connected respectively to the first electrodes, and a second semiconductor chip stacked over the first semiconductor chip and including a plurality of second pads electrically connected respectively to the second electrodes; encapsulating the first and second semiconductor chips; and performing electrical tests on the first and second semiconductor chips by use of the test electrodes, after the encapsulating of the first and second semiconductor chips.

Abstract: A method including forming an intermediate product, the intermediate product being configured to include a wiring substrate including a plurality of first electrodes, a plurality of second electrodes and a plurality of test electrodes, a first semiconductor chip mounted over the wiring substrate and including a plurality of first pads electrically connected respectively to the first electrodes, and a second semiconductor chip stacked over the first semiconductor chip and including a plurality of second pads electrically connected respectively to the second electrodes; encapsulating the first and second semiconductor chips; and performing electrical tests on the first and second semiconductor chips by use of the test electrodes, after the encapsulating of the first and second semiconductor chips.

Abstract: A method including forming an intermediate product, the intermediate product being configured to include a wiring substrate including a plurality of first electrodes, a plurality of second electrodes and a plurality of test electrodes, a first semiconductor chip mounted over the wiring substrate and including a plurality of first pads electrically connected respectively to the first electrodes, and a second semiconductor chip stacked over the first semiconductor chip and including a plurality of second pads electrically connected respectively to the second electrodes; encapsulating the first and second semiconductor chips; and performing electrical tests on the first and second semiconductor chips by use of the test electrodes, after the encapsulating of the first and second semiconductor chips.

Abstract: To provide a toner manufacturing method including: dissolving or dispersing a toner material into an organic solvent to prepare a toner solution, the toner material containing at least an active hydrogen group-containing compound, polymer reactive with the active hydrogen group-containing compound, binder resin, releasing agent and coloring agent; emulsifying or dispersing the toner solution into an aqueous medium to prepare an emulsified dispersion; reacting the active hydrogen group-containing compound with the polymer reactive with the active hydrogen group-containing compound in the aqueous medium produce an adhesive base material in the form of particle; and removing the organic solvent, wherein time X (hour) from a point where the organic solvent starts to be removed to a point where the concentration of the organic solvent reaches less than 12% by mass and temperature T (° C.) of the emulsified dispersion at the time X satisfy the relationship 5{exp(?0.2X)+1}?T?50X?0.2.

Abstract: A technique for mounting two semiconductor chips over a wiring substrate including mounting a first chip having first bonding pads over a surface of the wiring substrate having electrodes and stacking the second chip having second bonding pads over the first chip; connecting each of the first bonding pads to an associated one of the electrodes of the wiring substrate via an associated first wire; and connecting each of the second bonding pads to an associated one of the electrodes of the wiring substrate via an associated second wire. The bondings being carried out using a reverse bonding method in which at least one of the first and second wires are first bonded to an associated one of the electrodes of the wiring substrate followed by the bonding thereof to an associated one of the bonding pads of the first or second semiconductor chip.

Abstract: A semiconductor device includes first to third semiconductor chips. The second semiconductor chip is stacked over the first semiconductor chip. The third semiconductor chip is stacked over the second semiconductor chip. The second semiconductor chip shields the first semiconductor chip from noises generated by the third semiconductor chip. The second semiconductor chip shields the third semiconductor chip from noises generated by the first semiconductor chip.

Abstract: A technique for mounting two semiconductor chips over a wiring substrate including mounting a first chip having first bonding pads over a surface of the wiring substrate having electrodes and stacking the second chip having second bonding pads over the first chip; connecting each of the first bonding pads to an associated one of the electrodes of the wiring substrate via an associated first wire; and connecting each of the second bonding pads to an associated one of the electrodes of the wiring substrate via an associated second wire. The bondings being carried out using a reverse bonding method in which at least one of the first and second wires are first bonded to an associated one of the electrodes of the wiring substrate followed by the bonding thereof to an associated one of the bonding pads of the first or second semiconductor chip.