Patents by Inventor Toshihiko Watase

Toshihiko Watase has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170008143
    Abstract: To provide an abrasive material having a structured surface that is excellent in preventing adhesion and accumulation of foreign objects, and a manufacturing method thereof. The abrasive material of an embodiment of the present disclosure is an abrasive material having an abrasive layer with a structured surface with a plurality of three-dimensional elements arranged thereon, a surface treatment selected from the group consisting of fluoride treatment and silicon treatment being performed on at least a portion of the structured surface, and the fluoride treatment being selected from the group consisting of plasma treatment, chemical vapor deposition, physical vapor deposition, and fluorine gas treatment.
    Type: Application
    Filed: January 21, 2015
    Publication date: January 12, 2017
    Inventors: Hideki Minami, Toshihiko Watase, Yoko Nakamura, Shoichi Masuda, Jiro Hattori, Moses M. David
  • Patent number: 6776699
    Abstract: An abrasive pad for CMP has a substrate and an abrasive layer disposed on the substrate. An abrasive pad for CMP having a substrate and an abrasive layer disposed on the substrate, wherein said abrasive layer has a three-dimensional structure including a plurality of regularly arranged three-dimensional elements having a predetermined shape, and said abrasive layer comprises an abrasive composite containing advanced alumina abrasive grains produced by a CVD method and a binder as construction components.
    Type: Grant
    Filed: January 2, 2003
    Date of Patent: August 17, 2004
    Assignee: 3M Innovative Properties Company
    Inventors: Takashi Amano, Toshihiko Watase, Kengo Imamura
  • Publication number: 20040003895
    Abstract: An abrasive pad for CMP has a substrate and an abrasive layer disposed on the substrate. An abrasive pad for CMP having a substrate and an abrasive layer disposed on the substrate, wherein said abrasive layer has a three-dimensional structure including a plurality of regularly arranged three-dimensional elements having a predetermined shape, and said abrasive layer comprises an abrasive composite containing advanced alumina abrasive grains produced by a CVD method and a binder as construction components.
    Type: Application
    Filed: January 2, 2003
    Publication date: January 8, 2004
    Inventors: Takashi Amano, Toshihiko Watase, Kengo Imamura