Patents by Inventor Toshihiri Yamada

Toshihiri Yamada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Sealing structure, method of soldering and process for preparing sealing structure
    Patent number: 4854495
    Abstract: This invention discloses a method of soldering together at least two members selected form metals and ceramics, which comprises successively jointing a high-melting jointing material, a medium-melting jointing material, and a low-melting jointing material, and a sealing structure prepared by this method.The method according to present invention enables the preparation of a sealing structure having a soldered area which is excellent in tightness.
    Type: Grant
    Filed: June 18, 1987
    Date of Patent: August 8, 1989
    Assignee: Hitachi, Ltd.
    Inventors: Akihiko Yamamoto, Akiomi Kohno, Toshihiri Yamada, Motohiro Satou, Keiji Taguchi, Kazuaki Yokoi