Abstract: An insulating ink composition for forming an insulating film, which sufficiently achieves a low calcination temperature, solvent resistance and an insulating property, is provided. Furthermore, an ink composition for forming an insulating film which can form, by the printing method, fine insulating film patterns necessary for formation of highly integrated organic transistors is provided. The present invention provides an ink composition which forms an insulating film, and includes an organic solvent, a polyvinylphenol-based resin, an epoxy resin and a cross-linking aid. Particularly, the ink composition is a composition wherein the organic solvent includes an organic solvent which has a vapor pressure of 11.3×102 Pa or higher at 20° C. and a boiling point of lower than 115° C. under atmospheric pressure and an organic solvent which has a vapor pressure of less than 11.3×102 Pa at 20° C. and a boiling point of 115° C.

Abstract: An insulating ink composition for forming an insulating film, which sufficiently achieves a low calcination temperature, solvent resistance and an insulating property, is provided. Furthermore, an ink composition for forming an insulating film which can form, by the printing method, fine insulating film patterns necessary for formation of highly integrated organic transistors is provided. The present invention provides an ink composition which forms an insulating film, and includes an organic solvent, a polyvinylphenol-based resin, an epoxy resin and a cross-linking aid. Particularly, the ink composition is a composition wherein the organic solvent includes an organic solvent which has a vapor pressure of 11.3×102 Pa or higher at 20° C. and a boiling point of lower than 115° C. under atmospheric pressure and an organic solvent which has a vapor pressure of less than 11.3×102 Pa at 20° C. and a boiling point of 115° C.

Abstract: An organic-inorganic composite material is disclosed wherein an inorganic compound is finely dispersed in an organic polymer matrix in nanometer order and the inorganic compound content is large. The organic-inorganic composite material has formability and flexibility of organic materials and features of various metal compounds (such as hardness, catalytic power, insulating property, semiconducting property, electronic conductivity, ionic conductivity, large specific surface area, high heat resistance, wear resistance, and dimensional stability to temperature changes or moisture absorption) at the same time.

Abstract: An ion conductor has fine particles of an organic polymer including 20 to 80% by mass of ultra-fine particles of an inorganic compound, and an electrolytic solution impregnated into the fine particles of the organic polymer, wherein the fine particles of the organic polymer have a specific surface area measured by the BET method of 30 m2/g or more.

Abstract: An ion conductor has fine particles of an organic polymer including 20 to 80% by mass of ultra-fine particles of an inorganic compound, and an electrolytic solution impregnated into the fine particles of the organic polymer, wherein the fine particles of the organic polymer have a specific surface area measured by the BET method of 30 m2/g or more.

Abstract: An organic-inorganic composite material is disclosed wherein an inorganic compound is finely dispersed in an organic polymer matrix in nanometer order and the inorganic compound content is large. The organic-inorganic composite material has formability and flexibility of organic materials and features of various metal compounds (such as hardness, catalytic power, insulating property, semiconducting property, electronic conductivity, ionic conductivity, large specific surface area, high heat resistance, wear resistance, and dimensional stability to temperature changes or moisture absorption) at the same time.