Patents by Inventor Toshihiro Furusawa

Toshihiro Furusawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9287307
    Abstract: A chip size package (CSP) includes an antenna for wireless communication, used in signal transmission and reception with external substrates, the antenna being formed as a wiring of a rewiring layer, the rewiring layer being disposed between a silicon layer and solder bumps.
    Type: Grant
    Filed: February 21, 2014
    Date of Patent: March 15, 2016
    Assignee: SONY CORPORATION
    Inventors: Yukihisa Kinugasa, Toshihiro Furusawa, Yoshiteru Kamatani, Yoshihito Higashitsutsumi
  • Patent number: 9253387
    Abstract: There is provided a camera module including: a lens; an image pickup device arranged on an optical axis of the lens; and an actuator section configured to reciprocate the image pickup device in an optical axis direction of the lens, wherein the actuator section includes a movable joint section on which the image pickup device is fixed, a parallel link mechanism section having a movable end section attached to the movable joint section and a mounting end section, and a movable element that is configured to perform displacement motion by a displacement amount depending on a level of a voltage to be applied and that is coupled to a coupling region between the movable joint section and the movable end section of the parallel link mechanism section in such a manner that the displacement motion is transmittable.
    Type: Grant
    Filed: February 28, 2013
    Date of Patent: February 2, 2016
    Assignee: SONY CORPORATION
    Inventors: Toshihiro Furusawa, Yoshihito Higashitsutsumi, Yoshiteru Kamatani, Yukihisa Kinugasa, Hideo Kawabe, Takehisa Ishida, Yusaku Kato, Nobuyuki Nagai, Masayoshi Morita, Hiroyuki Yamagishi
  • Publication number: 20150070565
    Abstract: There is provided a camera module including: a lens; an image pickup device arranged on an optical axis of the lens; and an actuator section configured to reciprocate the image pickup device in an optical axis direction of the lens, wherein the actuator section includes a movable joint section on which the image pickup device is fixed, a parallel link mechanism section having a movable end section attached to the movable joint section and a mounting end section, and a movable element that is configured to perform displacement motion by a displacement amount depending on a level of a voltage to be applied and that is coupled to a coupling region between the movable joint section and the movable end section of the parallel link mechanism section in such a manner that the displacement motion is transmittable.
    Type: Application
    Filed: February 28, 2013
    Publication date: March 12, 2015
    Applicant: SONY CORPOTATION
    Inventors: Toshihiro Furusawa, Yoshihito Higashitsutsumi, Yoshiteru Kamatani, Yukihisa Kinugasa, Hideo Kawabe, Takehisa Ishida, Yusaku Kato, Nobuyuki Nagai, Masayoshi Morita, Hiroyuki Yamagishi
  • Patent number: 8860878
    Abstract: A camera module includes an imaging sensor, a power feed electrode, a first conductive member, and a first sealing member. The imaging sensor includes a light-receiving surface receiving light gathered by a lens. The power feed electrode is formed to a surface including the light receiving-surface of the imaging sensor, and the power feed electrode is configured to make a power feed. The first conductive member is configured to electrically connect the power feed electrode and a drive electrode. The drive electrode is provided to a drive section configured to drive the lens in accordance with the power feed. The first sealing member is formed by sealing the first conductive member.
    Type: Grant
    Filed: July 10, 2012
    Date of Patent: October 14, 2014
    Assignee: Sony Corporation
    Inventors: Toshiaki Iwafuchi, Toshihiro Furusawa, Yoshihito Higashitsutsumi
  • Publication number: 20140246745
    Abstract: A chip size package (CSP) includes an antenna for wireless communication, used in signal transmission and reception with external substrates, the antenna being formed as a wiring of a rewiring layer, the rewiring layer being disposed between a silicon layer and solder bumps.
    Type: Application
    Filed: February 21, 2014
    Publication date: September 4, 2014
    Applicant: Sony Corporation
    Inventors: Yukihisa KINUGASA, Toshihiro FURUSAWA, Yoshiteru KAMATANI, Yoshihito HIGASHITSUTSUMI
  • Publication number: 20130033639
    Abstract: A camera module includes an imaging sensor, a power feed electrode, a first conductive member, and a first sealing member. The imaging sensor includes a light-receiving surface receiving light gathered by a lens. The power feed electrode is formed to a surface including the light receiving-surface of the imaging sensor, and the power feed electrode is configured to make a power feed. The first conductive member is configured to electrically connect the power feed electrode and a drive electrode. The drive electrode is provided to a drive section configured to drive the lens in accordance with the power feed. The first sealing member is formed by sealing the first conductive member.
    Type: Application
    Filed: July 10, 2012
    Publication date: February 7, 2013
    Applicant: Sony Corporation
    Inventors: Toshiaki IWAFUCHI, Toshihiro Furusawa, Yoshihito Higashitsutsumi
  • Patent number: 7630686
    Abstract: A radio-frequency signal receiver and its manufacturing method are disclosed. A tuner receives a radio-frequency signal, and a demodulator receives an output signal from the tuner. An error corrector receives an output from the demodulator. A determiner determines whether or not an error rate supplied from the error corrector is not less than a predetermined rate. A controller receives an output from the determiner, and based on the determination, the controller controls a plurality of sections forming the radio-frequency signal receiver. The controller controls selectively one of the plurality of sections, thereby lowering the error rate. A manufacturing method of this receiver makes a memory, coupled to the controller, store a shift-amount of frequency corresponding to an interference signal in a pass-band of a narrow-band filter.
    Type: Grant
    Filed: January 21, 2003
    Date of Patent: December 8, 2009
    Assignee: Panasonic Corporation
    Inventors: Junichi Fukutani, Toshihiro Furusawa, Motoyoshi Kitagawa, Masashi Yasuda
  • Patent number: 7580690
    Abstract: A high-frequency receiver capable of improving both an interference-resistant characteristic and reception sensitivity is provided. A gain switch control unit includes: a signal level determination unit comparing a gain control voltage of an amplifying circuit with a reference voltage; and a gain switch controller provided between an output terminal of the signal level determination unit and a gain control input terminal provided to an amplifying circuit for gain control. When receiving a signal in a strong electric field area having a high possibility that a strong interference signal exists, a gain of the amplifying circuit is set to be smaller than that in a case of receiving a signal in a weak electric field area by a gain switch signal output from the gain switch controller.
    Type: Grant
    Filed: August 24, 2006
    Date of Patent: August 25, 2009
    Assignee: Panasonic Corporation
    Inventors: Akira Fujishima, Yasuhiro Hibino, Toshihiro Furusawa, Hirokazu Kitamura, Takashi Umeda, Takahiro Koyama
  • Patent number: 7194245
    Abstract: A high-frequency signal receiver includes a mixer having one port for receiving an input signal and another port for receiving an output from a local oscillator, a filter for receiving an output from the mixer, and an output terminal to which an output from the filter is supplied. At least the mixer and the filter are formed of balanced circuits, so that they have high capability of eliminating interference. Distances between the circuits thus can be short. Further, partition plates for shielding the interference are not needed, thus allowing the receiver to be small.
    Type: Grant
    Filed: January 21, 2003
    Date of Patent: March 20, 2007
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Toshihiro Furusawa, Akira Fujishima, Hirotoshi Takeuchi
  • Publication number: 20070049228
    Abstract: A high-frequency receiver capable of improving both an interference-resistant characteristic and reception sensitivity is provided. A gain switch control unit includes: a signal level determination unit comparing a gain control voltage of an amplifying circuit with a reference voltage; and a gain switch controller provided between an output terminal of the signal level determination unit and a gain control input terminal provided to an amplifying circuit for gain control. When receiving a signal in a strong electric field area having a high possibility that a strong interference signal exists, a gain of the amplifying circuit is set to be smaller than that in a case of receiving a signal in a weak electric field area by a gain switch signal output from the gain switch controller.
    Type: Application
    Filed: August 24, 2006
    Publication date: March 1, 2007
    Inventors: Akira Fujishima, Yasuhiro Hibino, Toshihiro Furusawa, Hirokazu Kitamura, Takashi Umeda, Takahiro Koyama
  • Publication number: 20040153879
    Abstract: A radio-frequency signal receiver and its manufacturing method are disclosed. A tuner receives a radio-frequency signal, and a demodulator receives an output signal from the tuner. An error corrector receives an output from the modulator. A determiner determines whether or not an error rate supplied from the error corrector is not less than a predetermined rate. A controller receives an output from the determiner, and based on the determination, the controller controls a plurality of sections forming the radio-frequency signal receiver. The controller controls selectively one of the plurality of sections, thereby lowering the error rate. A manufacturing method of this receiver makes a memory, coupled to the controller, store a shift-amount of frequency corresponding to an interference signal in a pass-band of a narrow-band filter.
    Type: Application
    Filed: November 13, 2003
    Publication date: August 5, 2004
    Inventors: Junichi Fukutani, Toshihiro Furusawa, Motoyoshi Kitagawa, Masashi Yasuda
  • Publication number: 20040067744
    Abstract: A high-frequency signal receiver includes a mixer having one port for receiving an input signal and another port for receiving an output from a local oscillator, a filter for receiving an output from the mixer, and an output terminal to which an output from the filter is supplied. At least the mixer and the filter are formed of balanced circuits, so that they have high capability of eliminating interference. Distances between the circuits thus can be short. Further, partition plates for shielding the interference are not needed, thus allowing the receiver to be small.
    Type: Application
    Filed: August 25, 2003
    Publication date: April 8, 2004
    Inventors: Toshihiro Furusawa, Akira Fujishima, Hirotoshi Takeuchi
  • Patent number: 6134375
    Abstract: A first digital processor (13) generates luminance data Y and color difference data U, V, using image data D1. The processor (13) further generates separated luminance data Y1, Y2 by halving the luminance data Y, and generates a compound color difference data C by combining the color difference data U, V for output. An JPEG encoder 13 compresses the separated luminance data Y1, Y2 and the compound color difference data C to generate compressed luminance data y1, y2 and compressed color difference data c. A modulator 15 modulates the compressed luminance data y1, y2 and the compressed color difference data c to generate luminance modulated signals m1, m2 and color difference modulated signal mc. A recording/reproducing section 16 records the luminance modulated signals m1, m2 and the color difference modulated signal mc in parallel onto the first to third recording tracks of a magnetic tape (20).
    Type: Grant
    Filed: February 27, 1998
    Date of Patent: October 17, 2000
    Assignee: Sanyo Electric Co., Ltd.
    Inventors: Kazuo Naganawa, Kazuo Ishimoto, Toshihiro Furusawa, Yoshihito Higashitsutsumi
  • Patent number: 5920343
    Abstract: An image sensing apparatus which performs fast data processing without suffering an increased manufacturing cost. The image sensing apparatus senses an object and produces an image data signal screen-by-screen. In one embodiment, an image sensing apparatus for producing an image data signal includes an image sensing unit, a signal processor, a main buffer memory, and an image data processing circuit. A first group of processed pixels having the size of a first matrix is stored in the main buffer memory. The image data processing circuit receives a second group of pixels having the size of a second matrix from the first group stored in the main buffer memory. Included in image data processing circuit is a sub buffer which is initially filled with the second group of pixels. As pixels are processed and removed from the sub buffer, a third group of pixels is provided from the main buffer which is equal in size to a horizontal row or a vertical column from the second group.
    Type: Grant
    Filed: August 9, 1996
    Date of Patent: July 6, 1999
    Assignee: Sanyo Electric Company, Ltd.
    Inventors: Tohru Watanabe, Toshihiro Furusawa, Toshio Nakakuki
  • Patent number: 5322869
    Abstract: Styrene-based resin composition containing as main components (A) 100 parts by weight of a styrene-based polymer having mainly a syndiotactic configuration and (B) 0.01 to 25 parts by weight of one or more nucleating agents selected from the group consisting of (1) metal salts of organic acids having an average particle diameter of not more than 50 .mu.m, (2) inorganic compounds having an average particle diameter of not more than 50 .mu.m, (3) organophosphorus compounds having an average particle diameter of not more than 50 .mu.m, and (4) metal salts of ionic hydrocarbon copolymer, and a process for producing styrene-based resin moldings by molding the above styrene-based resin composition at a temperature between room temperature and 200.degree. C. The resin composition of the present invention is suitable for injection molding and extrusion molding, and provides moldings which are of high crystallinity and are excellent in heat resistance, solvent resistance, chemical resistance and so forth.
    Type: Grant
    Filed: December 18, 1991
    Date of Patent: June 21, 1994
    Assignee: Idemitsu Kosan Co., Ltd.
    Inventors: Komei Yamasaki, Takashi Sumitomo, Toshikazu Ijitsu, Hiroshi Yamada, Toshihiro Furusawa
  • Patent number: 5202066
    Abstract: Disclosed is a plasticization method in which a molding material is supplied to a cylinder having a built-in screw to plasticize the molding material, and further, at least one of the cylinder and the screw is resonated to carry out the plasticization of the molding material. Also disclosed is a plasticization method in which the cylinder is vibrated by progressive waves to plasticize the molding material, and an apparatus able to carry out these plasticization methods.
    Type: Grant
    Filed: January 15, 1992
    Date of Patent: April 13, 1993
    Assignees: Idemitsu Kosan Co., Ltd., Seidensha Electronics Co., Ltd.
    Inventors: Toshihiro Furusawa, Atsushi Satoh, Takashi Nakajima, Noriaki Matsugishi
  • Patent number: 5202064
    Abstract: An extrusion molding method for improving the fluidity of a molding material in the die and significantly improving the productivity of the molded article of uniform thickness, and an extrusion molding apparatus adapted for smoothly carrying out the method and having an unsophisticated constructional arrangement, are disclosed.Molding is carried out while the die to which an extrusion orifice gap adjustment device is annexed is kept in resonant vibrations. The extrusion orifice gap adjustment device is annexed to a portion of the die constituting an extrusion orifice section, and molding is carried out while only the portion of the die is kept in resonant vibrations. The extrusion orifice gap adjustment device is annexed at a node of the resonant vibrations.
    Type: Grant
    Filed: September 16, 1991
    Date of Patent: April 13, 1993
    Assignees: Idemitsu Kosan Co., Ltd., Seidensha Electronics Co., Ltd.
    Inventors: Toshihiro Furusawa, Atsushi Satoh, Takashi Nakajima, Noriaki Matsugishi
  • Patent number: 5166238
    Abstract: The present invention relates to a styrene-based resin composition comprising a styrene-based polymer having mainly a syndiotactic configuration and a specified antioxidant, a fibrous molding or extrusion produced by spinning a syndiotactic styrene resin composition and a molding produced by shaping and/or spinning, and stretching said resin.
    Type: Grant
    Filed: May 15, 1990
    Date of Patent: November 24, 1992
    Assignee: Idemitsu Kosan Co., Ltd.
    Inventors: Akikazu Nakano, Toshihiro Furusawa, Toshikazu Ijitsu, Masakazu Suzuki, Nobuhide Ishihara, Masahiko Kuramoto, Hiroshi Uchida, Azuma Komeiji, Keisuke Funaki, Takashi Sumitomo
  • Patent number: 5068068
    Abstract: An improved method for carrying out an extrusion is provided, wherein an extrusion material in a flowable state is passed through a die under a pressure to impart a desired shape thereto, and the extrusion is carried out while the die is resonated by an ultrasonic wave in such a manner that the resonance occurs at an n wavelength, wherein n is m/2 and m is a positive integer. Further, an apparatus suitable for carrying out this extrusion method is provided.
    Type: Grant
    Filed: November 22, 1989
    Date of Patent: November 26, 1991
    Assignees: Idemitsu Kosan Co., Ltd., Seidensha Electronics Co., Ltd.
    Inventors: Toshihiro Furusawa, Atsushi Satoh, Takashi Nakajima, Noriaki Matsugishi
  • Patent number: 5017311
    Abstract: An injection molding method in which a molding material is injected into a cavity formed in a mold to be molded. The mold is driven to resonate so that resonance occurs in the mold at n wavelengths, where n=m/2 and m is a positive integer, and an injection molding apparatus provided with a fixed mold and a movable mold; the movable mold having a cavity in one side thereof, and an ultrasonic vibration feed device being connected to the other side thereof.
    Type: Grant
    Filed: July 17, 1989
    Date of Patent: May 21, 1991
    Assignees: Idemitsu Kosan Co., Ltd., Seidensha Electronics Co., Ltd.
    Inventors: Toshihiro Furusawa, Atsushi Satoh, Takashi Nakajima, Noriaki Matsugishi