Patents by Inventor Toshihiro Hachiya

Toshihiro Hachiya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic device
    Patent number: 6774490
    Abstract: An electronic equipment is capable of improving falling down shock resistance or impact resistance in an electronic equipment and of improving reliability of a solder joint in a semiconductor device die-bonded Si chip or the like to which thermal shock causing large deformation may act, bump mounting of BGA, CSP, WPP, flip-chip and so forth, a power module acting large stress and so forth. The electronic equipment has a circuit board and an electronic parts to be electrically connected to an electrode of the circuit board. The electrode of the circuit board and an electrode of the electronic part are connected by soldering using a lead free solder consisted of Cu: 0-2.0 mass %, In: 0.1-10 mass %, and Sn: remaining amount.
    Type: Grant
    Filed: March 25, 2003
    Date of Patent: August 10, 2004
    Assignee: Hitachi, Ltd.
    Inventors: Tasao Soga, Hanae Shimokawa, Tetsuya Nakatsuka, Masato Nakamura, Yuji Fujita, Toshiharu Ishida, Masahide Okamoto, Koji Serizawa, Toshihiro Hachiya, Hideki Mukuno
  • Electron device and semiconductor device
    Publication number: 20030186072
    Abstract: An electronic equipment is capable of improving falling down shock resistance or impact resistance in an electronic equipment and of improving reliability of a solder joint in a semiconductor device die-bonded Si chip or the like to which thermal shock causing large deformation may act, bump mounting of BGA, CSP, WPP, flip-chip and so forth, a power module acting large stress and so forth. The electronic equipment has a circuit board and an electronic parts to be electrically connected to an electrode of the circuit board. The electrode of the circuit board and an electrode of the electronic part are connected by soldering using a lead free solder consisted of Cu: 0-2.0 mass %, In: 0.1-10 mass %, and Sn: remaining amount.
    Type: Application
    Filed: March 25, 2003
    Publication date: October 2, 2003
    Inventors: Tasao Soga, Hanae Shimokawa, Tetsuya Nakatsuka, Masato Nakamura, Yuji Fujita, Toshiharu Ishida, Masahide Okamoto, Koji Serizawa, Toshihiro Hachiya, Hideki Mukuno
  • Electron device and semiconductor device
    Patent number: 6555052
    Abstract: An electronic equipment is capable of improving falling down shock resistance or impact resistance in an electronic equipment and of improving reliability of a solder joint in a semiconductor device die-bonded Si chip or the like to which thermal shock causing large deformation may act, bump mounting of BGA, CSP, WPP, flip-chip and so forth, a power module acting large stress and so forth. The electronic equipment has a circuit board and an electronic parts to be electrically connected to an electrode of the circuit board. The electrode of the circuit board and an electrode of the electronic part are connected by soldering using a lead free solder consisted of Cu: 0˜2.0 mass %, In: 0.1˜10 mass %, and Sn: remaining amount.
    Type: Grant
    Filed: March 7, 2001
    Date of Patent: April 29, 2003
    Assignee: Hitachi, Ltd.
    Inventors: Tasao Soga, Hanae Shimokawa, Tetsuya Nakatsuka, Masato Nakamura, Yuji Fujita, Toshiharu Ishida, Masahide Okamoto, Koji Serizawa, Toshihiro Hachiya, Hideki Mukuno
  • Electron device and semiconductor device
    Publication number: 20020066583
    Abstract: An electronic equipment is capable of improving falling down shock resistance or impact resistance in an electronic equipment and of improving reliability of a solder joint in a semiconductor device die-bonded Si chip or the like to which thermal shock causing large deformation may act, bump mounting of BGA, CSP, WPP, flip-chip and so forth, a power module acting large stress and so forth. The electronic equipment has a circuit board and an electronic parts to be electrically connected to an electrode of the circuit board. The electrode of the circuit board and an electrode of the electronic part are connected by soldering using a lead free solder consisted of Cu: 0˜2.0 mass %, In: 0.1˜10 mass %, and Sn: remaining amount.
    Type: Application
    Filed: March 7, 2001
    Publication date: June 6, 2002
    Inventors: Tasao Soga, Hanae Shimokawa, Tetsuya Nakatsuka, Masato Nakamura, Yuji Fujita, Toshiharu Ishida, Masahide Okamoto, Koji Serizawa, Toshihiro Hachiya, Hideki Mukuno