Patents by Inventor Toshihiro Higashikawa

Toshihiro Higashikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240051202
    Abstract: Object There is provided a molded article or an electrical product in which layout of a member up to an external connection terminal for electrical connection of a circuit film integrally molded with the molded body is easy. Solution means A molded body 30 includes one main surface 31 with which a circuit film 20 is integrally molded, and another main surface 32 facing the one main surface 31. A flexible printed wiring board 40 includes an internal connection terminal 41 electrically connected to an electrical circuit of the circuit film 20, an external connection terminal 42 exposed outside from the other main surface 32 of the molded body 30, and a flexible wiring line 43 connected to the inner connection terminal 41 and the external connection terminal 42, passing through an inside of the molded body 30, and extending so as to reach the other main surface 32.
    Type: Application
    Filed: July 29, 2020
    Publication date: February 15, 2024
    Applicant: NISSHA CO., LTD.
    Inventors: Seiichi YAMAZAKI, Toshihiro HIGASHIKAWA, Hitoshi HIRAI
  • Patent number: 11872735
    Abstract: In a first step, a circuit sheet is set such that a first region of a second main surface of the circuit sheet is in contact with a plateau portion of a first mold and a second region is not in contact with the first mold. In the first step, a first fixed portion of the circuit sheet is arranged on a first portion of the first mold, and a second fixed portion is arranged on a second portion of the first mold. The first portion is a portion that is higher than the plateau portion and runs along at least one of a first protruding portion and a second protruding portion provided along the plateau portion. The second portion is a portion where the first protruding portion or the second protruding portion is not provided along the plateau portion.
    Type: Grant
    Filed: August 26, 2021
    Date of Patent: January 16, 2024
    Assignee: NISSHA CO., LTD.
    Inventors: Seiichi Yamazaki, Toshihiro Higashikawa, Hitoshi Hirai, Koji Asai, Yuki Matsumoto
  • Publication number: 20230271361
    Abstract: In a first step, a circuit sheet is set such that a first region of a second main surface of the circuit sheet is in contact with a plateau portion of a first mold and a second region is not in contact with the first mold. In the first step, a first fixed portion of the circuit sheet is arranged on a first portion of the first mold, and a second fixed portion is arranged on a second portion of the first mold. The first portion is a portion that is higher than the plateau portion and runs along at least one of a first protruding portion and a second protruding portion provided along the plateau portion. The second portion is a portion where the first protruding portion or the second protruding portion is not provided along the plateau portion.
    Type: Application
    Filed: August 26, 2021
    Publication date: August 31, 2023
    Inventors: Seiichi YAMAZAKI, Toshihiro HIGASHIKAWA, Hitoshi HIRAI, Koji ASAI, Yuki MATSUMOTO
  • Patent number: 10710288
    Abstract: A molded product and an electrical product comprising a molded article that includes a main body made of resin and a standing wall made of resin. The standing wall integrally stands up from the end portion of the main body. A decorative sheet includes a base film and a conductive circuit layer. The base film continuously covers from the main body front surface to a wall front surface. The conductive circuit layer is disposed between the base film and the main body front surface. The decorative sheet is integrated with the molded article to implement a decoration with the base film. A flexible printed circuit board is disposed between the molded article and the conductive circuit layer. The flexible printed circuit board is partially embedded into and integrated with the standing wall. The flexible printed circuit board is electrically connected to the conductive circuit layer.
    Type: Grant
    Filed: July 19, 2018
    Date of Patent: July 14, 2020
    Assignee: NISSHA CO., LTD.
    Inventors: Seiichi Yamazaki, Toshihiro Higashikawa, Hitoshi Hirai
  • Publication number: 20200101646
    Abstract: A molded product and an electrical product comprising a molded article that includes a main body made of resin and a standing wall made of resin. The standing wall integrally stands up from the end portion of the main body. A decorative sheet includes a base film and a conductive circuit layer. The base film continuously covers from the main body front surface to a wall front surface. The conductive circuit layer is disposed between the base film and the main body front surface. The decorative sheet is integrated with the molded article to implement a decoration with the base film. A flexible printed circuit board is disposed between the molded article and the conductive circuit layer. The flexible printed circuit board is partially embedded into and integrated with the standing wall. The flexible printed circuit board is electrically connected to the conductive circuit layer.
    Type: Application
    Filed: July 19, 2018
    Publication date: April 2, 2020
    Inventors: Seiichi YAMAZAKI, Toshihiro HIGASHIKAWA, Hitoshi HIRAI
  • Patent number: 9444153
    Abstract: A composite molding comprises an insulative molded body molded into a prescribed shape; an insulative transfer layer covering at least part of a front surface of the molded body; an electrode pattern layer formed between the molded body and the transfer layer; an electrically conductive contact pin having one end side buried in the molded body and fixed thereto and an other end stuck out from the molded body; and an electrically conductive bonding agent formed between the electrode pattern layer and the molded body and bonding to the electrode pattern layer and the contact pin to form an electrical connection between the electrode pattern layer and the contact pin. This arrangement prevents defects caused by embedding a contact pin in a molded body and reliably makes an electrical connection between the contact pin and an electrode pattern layer.
    Type: Grant
    Filed: July 17, 2014
    Date of Patent: September 13, 2016
    Assignee: NISSHA PRINTING CO., LTD.
    Inventors: Seiichi Yamazaki, Toshihiro Higashikawa
  • Publication number: 20160211587
    Abstract: A composite molding comprises comprising: an insulative molded body molded into a prescribed shape; an insulative transfer layer covering at least part of a front surface of the molded body; an electrode pattern layer formed between the molded body and the transfer layer; an electrically conductive contact pin having one end side buried in the molded body and fixed thereto and an other end stuck out from the molded body; and an electrically conductive bonding agent formed between the electrode pattern layer and the molded body and bonding to the electrode pattern layer and the contact pin to form an electrical connection between the electrode pattern layer and the contact pin. This arrangement prevents defects caused by embedding a contact pin in a molded body and reliably makes an electrical connection between the contact pin and an electrode pattern layer.
    Type: Application
    Filed: July 17, 2014
    Publication date: July 21, 2016
    Inventors: Seiichi YAMAZAKI, Toshihiro HIGASHIKAWA
  • Patent number: 9256334
    Abstract: An injection molded product in which an electrical connection between a contact pin and an electrode pattern is sufficient, and a method of manufacturing the same, are provided. The injection molded product comprises: a base film; an electrode pattern, which is formed on the base film; an electrically conductive adhesive, which is formed on an upper surface of the electrode pattern; a contact pin, which contacts the electrically conductive adhesive, is electrically connected to the electrode pattern via the electrically conductive adhesive, and is electrically conductive; and a molded resin, which is injection molded along the base film such that the electrically conductive adhesive and part of the contact pin are embedded.
    Type: Grant
    Filed: May 28, 2013
    Date of Patent: February 9, 2016
    Assignee: NISSHA PRINTING CO., LTD.
    Inventors: Seiichi Yamazaki, Toshihiro Higashikawa, Tomohiro Matsuzaki, Masahiko Kariya
  • Publication number: 20150103503
    Abstract: An injection molded product in which an electrical connection between a contact pin and an electrode pattern is sufficient, and a method of manufacturing the same, are provided. The injection molded product comprises: a base film; an electrode pattern, which is formed on the base film; an electrically conductive adhesive, which is formed on an upper surface of the electrode pattern; a contact pin, which contacts the electrically conductive adhesive, is electrically connected to the electrode pattern via the electrically conductive adhesive, and is electrically conductive; and a molded resin, which is injection molded along the base film such that the electrically conductive adhesive and part of the contact pin are embedded.
    Type: Application
    Filed: May 28, 2013
    Publication date: April 16, 2015
    Inventors: Seiichi Yamazaki, Toshihiro Higashikawa, Tomohiro Matsuzaki, Masahiko Kariya