Abstract: An optical receiver is configured so as to be as less susceptible to noise as possible even in the case where high noise occurs inside an optical transceiver. The optical receiver includes a connection part that connects two photodiodes (PDs) constituting a dual photodiode and a transimpedance amplifier (TIA), wherein signal lines from the dual photodiode are surrounded by a conductor pattern that is not connected to each of the signal lines for each channel, and the conductor pattern is connected to a ground pattern on the transimpedance amplifier or a power source pattern for the PDs.

Abstract: An optical receiver is configured so as to be as less susceptible to noise as possible even in the case where high noise occurs inside an optical transceiver. The optical receiver includes a connection part that connects two photodiodes (PDs) constituting a dual photodiode and a transimpedance amplifier (TIA), wherein signal lines from the dual photodiode are surrounded by a conductor pattern that is not connected to each of the signal lines for each channel, and the conductor pattern is connected to a ground pattern on the transimpedance amplifier or a power source pattern for the PDs.

Abstract: An optical modulator driver circuit (1) includes an amplifier (50, Q10, Q11, R10-R13), and a current amount adjustment circuit (51) capable of adjusting a current amount of the amplifier (50) in accordance with a desired operation mode. The current amount adjustment circuit (51) includes at least two current sources (IS10) that are individually ON/OFF-controllable in accordance with a binary control signal representing the desired operation mode.

Abstract: A sensor network system is provided with a plurality of sensor terminals disposed in a predetermined area, and a monitoring center device that collects sensing data wirelessly transmitted from each of the plurality of sensor terminals. The sensor terminals wirelessly and intermittently transmit a transmission signal including sensor identification information and the latest sensing data from the sensors. The monitoring center device has the function of acquiring positional information of the sensor terminals in the predetermined area, and accumulates each item of the sensing data from the sensor terminals as time-series data in association with information about the time of acquisition. On the basis of the positional information of the sensor terminals and the time-series data of the accumulated sensing data, a time-series variation of an environmental element in the predetermined area is visually presented.

Abstract: An optical modulator driver circuit (1) includes an amplifier (50, Q10, Q11, R10-R13), and a current amount adjustment circuit (51) capable of adjusting a current amount of the amplifier (50) in accordance with a desired operation mode. The current amount adjustment circuit (51) includes at least two current sources (IS10) that are individually ON/OFF-controllable in accordance with a binary control signal representing the desired operation mode.

Abstract: A sensor network system is provided with a plurality of sensor terminals disposed in a predetermined area, and a monitoring center device that collects sensing data wirelessly transmitted from each of the plurality of sensor terminals. The sensor terminals wirelessly and intermittently transmit a transmission signal including sensor identification information and the latest sensing data from the sensors. The monitoring center device has the function of acquiring positional information of the sensor terminals in the predetermined area, and accumulates each item of the sensing data from the sensor terminals as time-series data in association with information about the time of acquisition. On the basis of the positional information of the sensor terminals and the time-series data of the accumulated sensing data, a time-series variation of an environmental element in the predetermined area is visually presented.

Abstract: A DLC-coated fishing lure includes a fishing lure base material made of metal and having a predetermined shape; an intermediate layer made of one selected from a first group, a second group and a third group, the first group consisting of at least one kind of metal selected from the IIIb group, the IVa group, the Va group and the VIa group in the periodic table of elements, the second group consisting of at least one of a carbide, a nitride and a carbonitride of the at least one kind of metal, and the third group consisting of a mutual solid solution made of at least one selected from the first group and the second group, the intermediate layer being formed on a surface of the fishing lure base material; and a DLC layer having a thickness ranging from about 0.05 ?m to about 0.55 ?m and formed on the intermediate layer, the DLC layer presenting an appearance of a interference color.

Abstract: A DLC-coated fishing lure includes a fishing lure base material made of metal and having a predetermined shape; an intermediate layer made of one selected from a first group, a second group and a third group, the first group consisting of at least one kind of metal selected from the IIIb group, the IVa group, the Va group and the VIa group in the periodic table of elements, the second group consisting of at least one of a carbide, a nitride and a carbonitride of the at least one kind of metal, and the third group consisting of a mutual solid solution made of at least one selected from the first group and the second group, the intermediate layer being formed on a surface of the fishing lure base material; and a DLC layer having a thickness ranging from about 0.05 ?m to about 0.55 ?m and formed on the intermediate layer, the DLC layer presenting an appearance of a interference color.

Abstract: The present invention relates to a semiconductor device in which electrodes formed on a semiconductor chip and electrodes formed on a wiring board are electrically connected via projecting elastic electrodes, and further relates to a mounting method of reducing a pressure applied to electrodes formed on a substrate or underlying wirings when a semiconductor chip and a wiring board are bonded.

Abstract: At least one pair of electrode formed on a mounting surface of a stage is in contact with a conductive layer formed on a first surface of an inspection object, and an electrical path is formed between the both by using a fritting phenomenon.

Abstract: The present invention relates to a semiconductor device in which electrodes formed on a semiconductor chip and electrodes formed on a wiring board are electrically connected via projecting elastic electrodes, and further relates to a mounting method of reducing a pressure applied to electrodes formed on a substrate or underlying wirings when a semiconductor chip and a wiring board are bonded.

Abstract: The present invention has been achieved to provide a novel optical transmission system realizing high-speed optical transmission over greater distance by suppressing waveform degradation caused by mode dispersion and mode transition in a multimode optical transmission line. The optical transmission system of the present invention includes: an optical transmitter for transmitting incoherent light; an excitation mechanism for exciting a predetermined mode in the incoherent light transmitted from the optical transmitter; a multimode optical transmission line for transmitting the incoherent light transmitted from the excitation mechanism; a transmission mechanism for transmitting a predetermined mode in the incoherent light transmitted from the excitation mechanism; and an optical receiver for receiving the incoherent light transmitted from the transmission mechanism or the incoherent light transmitted from the transmission mechanism.

Abstract: At least one pair of electrode formed on a mounting surface of a stage is in contact with a conductive layer formed on a first surface of an inspection object, and an electrical path is formed between the both by using a fritting phenomenon.

Abstract: Disclosed is an inspection method for inspecting the electrical characteristics of a device by bringing an inspecting probe into electrical contact with an inspection electrode. An insulating film formed on the surface of the inspection electrode is broken by utilizing a fritting phenomenon so as to bring the inspection electrode into electrical contact with the inspection electrode.

Abstract: Disclosed is an inspection method for inspecting the electrical characteristics of a device by bringing an inspecting probe into electrical contact with an inspection electrode. An insulating film formed on the surface of the inspection electrode is broken by utilizing a fritting phenomenon so as to bring the inspection electrode into electrical contact with the inspection electrode.

Abstract: The present invention relates to a high-reliable semiconductor device in which electrodes formed on substrates are prevented from deteriorating by sealing the electrodes with a frame member rather than a sealing material. The frame member in the present invention surrounds electrodes formed on the substrates. The inside of the frame member is vacuous or filled with a gas which does not react with the electrodes such as an inert gas and, thereby, the electrodes are prevented from deteriorating by attacks of oxygen or moisture.

Abstract: Disclosed is an inspection method for inspecting the electrical characteristics of a device by bringing an inspecting probe into electrical contact with an inspection electrode. An insulating film formed on the surface of the inspection electrode is broken by utilizing a fritting phenomenon so as to bring the inspection electrode into electrical contact with the inspection electrode.

Abstract: The present invention relates to a semiconductor device in which electrodes formed on a semiconductor chip and electrodes formed on a wiring board are electrically connected via projecting elastic electrodes, and further relates to a mounting method of reducing a pressure applied to electrodes formed on a substrate or underlying wirings when a semiconductor chip and a wiring board are bonded.

Abstract: At least one pair of electrode formed on a mounting surface of a stage is in contact with a conductive layer formed on a first surface of an inspection object, and an electrical path is formed between the both by using a fritting phenomenon.

Abstract: At least one pair of electrode formed on a mounting surface of a stage is in contact with a conductive layer formed on a first surface of an inspection object, and an electrical path is formed between the both by using a fritting phenomenon.