Patents by Inventor Toshihiro Kido

Toshihiro Kido has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9743192
    Abstract: A speaker includes a first vibrator, a first driving unit, a second vibrator, a second driving unit and a supporting unit. The first vibrator is connected to a diaphragm, which vibrates, thereby emitting sound. The first driving unit vibrates the first vibrator, thereby vibrating the diaphragm. The second vibrator is connected to a weight member. The second driving unit is connected to the opposite side of the first driving unit to the first vibrator, and vibrates the second vibrator on the same vibration axis as the vibration axis of the first vibrator, thereby vibrating the weight member. The supporting unit supports a coupled body, configured by joining the second vibrator and the weight member, at two or more portions in the direction of the vibration axis.
    Type: Grant
    Filed: December 3, 2015
    Date of Patent: August 22, 2017
    Assignee: FUJITSU TEN LIMITED
    Inventors: Kiyosei Shibata, Hiroshi Kowaki, Toshihiro Kido, Hirofumi Tetsu
  • Publication number: 20160192075
    Abstract: A speaker includes a first vibrator, a first driving unit, a second vibrator, a second driving unit and a supporting unit. The first vibrator is connected to a diaphragm, which vibrates, thereby emitting sound. The first driving unit vibrates the first vibrator, thereby vibrating the diaphragm. The second vibrator is connected to a weight member. The second driving unit is connected to the opposite side of the first driving unit to the first vibrator, and vibrates the second vibrator on the same vibration axis as the vibration axis of the first vibrator, thereby vibrating the weight member. The supporting unit supports a coupled body, configured by joining the second vibrator and the weight member, at two or more portions in the direction of the vibration axis.
    Type: Application
    Filed: December 3, 2015
    Publication date: June 30, 2016
    Applicant: FUJITSU TEN LIMITED
    Inventors: Kiyosei SHIBATA, Hiroshi KOWAKI, Toshihiro KIDO, Hirofumi TETSU
  • Patent number: 7445964
    Abstract: A semiconductor device includes at least one semiconductor structure which has a plurality of external connection electrodes formed on a semiconductor substrate. An insulating sheet member is arranged on the side of the semiconductor structure. Upper interconnections have connection pad portions that are arranged on the insulating sheet member in correspondence with the upper interconnections and connected to the external connection electrodes of the semiconductor structure.
    Type: Grant
    Filed: December 13, 2006
    Date of Patent: November 4, 2008
    Assignees: Casio Computer Co., Ltd., CMK Corporation
    Inventors: Ichiro Mihara, Takeshi Wakabayashi, Toshihiro Kido, Hiroyasu Jobetto, Yutaka Yoshino, Nobuyuki Kageyama, Daita Kohno, Jun Yoshizawa
  • Publication number: 20070099409
    Abstract: A semiconductor device includes at least one semiconductor structure which has a plurality of external connection electrodes formed on a semiconductor substrate. An insulating sheet member is arranged on the side of the semiconductor structure. Upper interconnections have connection pad portions that are arranged on the insulating sheet member in correspondence with the upper interconnections and connected to the external connection electrodes of the semiconductor structure.
    Type: Application
    Filed: December 13, 2006
    Publication date: May 3, 2007
    Applicants: Casio Computer Co., Ltd., CMK Corporation
    Inventors: Ichiro Mihara, Takeshi Wakabayashi, Toshihiro Kido, Hiroyasu Jobetto, Yutaka Yoshino, Nobuyuki Kageyama, Daita Kohno, Jun Yoshizawa
  • Patent number: 7183639
    Abstract: A semiconductor device includes at least one semiconductor structure which has a plurality of external connection electrodes formed on a semiconductor substrate. An insulating sheet member is arranged on the side of the semiconductor structure. Upper interconnections have connection pad portions that are arranged on the insulating sheet member in correspondence with the upper interconnections and connected to the external connection electrodes of the semiconductor structure.
    Type: Grant
    Filed: August 12, 2004
    Date of Patent: February 27, 2007
    Assignees: Casio Computer Co., Ltd., CMK Corporation
    Inventors: Ichiro Mihara, Takeshi Wakabayashi, Toshihiro Kido, Hiroyasu Jobetto, Yutaka Yoshino, Nobuyuki Kageyama, Daita Kohno, Jun Yoshizawa
  • Publication number: 20060222182
    Abstract: A plurality of speakers are installed at different positions in space and, of multichannel signals, only a center signal component is output from a speaker(s) mounted in at least one seat located within the space. The center signal component is output not only from the speaker(s) mounted in at least one seat, but also from a center speaker installed within the space. Further, the center signal component is reproduced by delaying it and outputting the delayed signal component from the speaker(s) mounted in at least one seat, thereby providing the precedence effect.
    Type: Application
    Filed: March 14, 2006
    Publication date: October 5, 2006
    Inventors: Shinichi Nakaishi, Toshihiro Kido
  • Publication number: 20050051886
    Abstract: A semiconductor device includes at least one semiconductor structure which has a plurality of external connection electrodes formed on a semiconductor substrate. An insulating sheet member is arranged on the side of the semiconductor structure. Upper interconnections have connection pad portions that are arranged on the insulating sheet member in correspondence with the upper interconnections and connected to the external connection electrodes of the semiconductor structure.
    Type: Application
    Filed: August 12, 2004
    Publication date: March 10, 2005
    Applicants: Casio Computer Co., Ltd., CMK Corporation
    Inventors: Ichiro Mihara, Takeshi Wakabayashi, Toshihiro Kido, Hiroyasu Jobetto, Yutaka Yoshino, Nobuyuki Kageyama, Daita Kohno, Jun Yoshizawa