Abstract: An optical device is provided to prevent a dicing blade form being clogged when a wafer is cut by means thereof. Further, an optical device is provided to the present invention can prevent unnecessary expansion of a resin used in the optical device. The present invention relates an optical device having a substrate and an optical waveguide layer laminated thereon. The optical waveguide layer has a first lateral surface connected to an optical fiber or an optical fiber array and a second lateral surface not connected to the same. The substrate has a lateral surface disposed on the same side as that of the second lateral surface of the optical waveguide layer. At least a portion of the second lateral surface of the optical waveguide layer is disposed in a plane different from the lateral surface of the substrate so that an exposed area of the substrate is formed between the second lateral surface of the optical waveguide layer and the lateral surface of the substrate.

Abstract: An optical pickup apparatus which carries out recording/reproduction or deletion of information on an optical disc, including a semiconductor laser device in which at least two light sources are integrated, and a hologram optical element which has a plurality of outgoing light areas that divide light reflected from the optical disc, each light being emitted from the semiconductor laser device; the hologram optical element has division lines which divide the outgoing light areas at a position intersecting with each optical axis of the reflected light. The optical pickup apparatus is able to detect a signal corresponding to a light beam divided almost equally in two, even when any one of the plurality of light sources are operating.

Abstract: An optical system comprising a substrate and an optical waveguide which is formed on the substrate and to which optical fibers are optically coupled. The optical waveguide has a plurality of straight core portions which obliquely intersect each other. The substrate has positioning sections for positioning a plurality of optical fibers optically coupled to two or more of the plurality of the core portions, the positioning sections having grooves on which the respective optical fibers are supported. When the plurality of optical fibers are supported on the respective grooves, offsets between centers of the plurality of the core portions and respective centers of the plurality of the optical fibers coupled to the core portions are equal to or less than 5 ?m.

Abstract: An optical element combination structure in which an optical fiber and an optical waveguide are combined with each other and which can reduce fluctuation of coupling loss due to a change in environmental temperature is provided. The present invention relates to an optical element combination structure in which an optical fiber and an optical waveguide are combined with each other. An optical element combination structure according to the present invention 1 comprises an optical fiber 2 and a substrate 6 on which an optical waveguide 4 is formed. The substrate 6 has a V-shaped cross-sectional groove 8 formed so that the optical fiber and the optical waveguide are aligned with each other, and a recess 10 formed on a waveguide side relative to the groove 8. The optical fiber is secured to the V-shaped cross-sectional groove 8 with an adhesive 22.

Abstract: An optical device is provided to prevent a dicing blade form being clogged when a wafer is cut by means thereof. Further, an optical device is provided to the present invention can prevent unnecessary expansion of a resin used in the optical device. The present invention relates an optical device having a substrate and an optical waveguide layer laminated thereon. The optical waveguide layer has a first lateral surface connected to an optical fiber or an optical fiber array and a second lateral surface not connected to the same. The substrate has a lateral surface disposed on the same side as that of the second lateral surface of the optical waveguide layer. At least a portion of the second lateral surface of the optical waveguide layer is disposed in a plane different from the lateral surface of the substrate so that an exposed area of the substrate is formed between the second lateral surface of the optical waveguide layer and the lateral surface of the substrate.

Abstract: A semiconductor laser device includes: a semiconductor laser chip which is composed of a semiconductor substrate and a plurality of semiconductor layers stacked on an element formation face of the semiconductor substrate and which outputs an irradiation light for irradiating an optical disk; and a light receiving element which receives the irradiation light reflected by the optical disk as a feedback light. The semiconductor laser chip includes on one face thereof an electrode facing an optical element and is fixed in a package so that at least one of sub-beams reflected by the optical disk is incident on the one face. A chip exposing portion for exposing a region of the one face where the sub-beam is incident is formed in the electrode.

Abstract: An optical module (1) according to the present invention has an optical filter (6) having an input surface (2) and an output surface (4), an input core (8) connected to the input surface (2), and an output core (10) connected to the output surface (4). Assuming that light having a predetermined wavelength is input at an input position (14) and transmitted according to Snell's law, a position at which the light is output from the output surface (4) is referred to as a Snell output position (20). In an equivalent optical filter (6?), the output position (16) is located away from the Snell output position (20) in a direction away from the input position (14) by a distance (D) relating to a group delay.

Abstract: The optical pickup device according to the present invention includes: a light source which emits a first light at a first wavelength, a second light at a second wavelength and a third light at a third wavelength; an optical path combining unit which combines vectors of the first, second and third light emitted by the light source, and matches optical axes of the first light and the third light; a light collection unit which condenses the light from the optical path combining unit into the optical information storage medium; a diffraction element which diffracts reflected light from the optical information storage medium; a first photo detector, a second photo detector and a third photo detector which receives the diffracted light from the first diffraction element; and a prevention unit formed between the first diffraction element and the first photo detector, the second photo detector and the third photo detector, and which prevents irradiation of + first-order diffracted light diffracted by the first diffr

Abstract: The present invention relates to a method for preparing an optical. waveguide device which comprises a step of forming a V-shaped groove on a substrate; a step of applying a filling polymer-containing coating solution having an NV value of not less than 35% onto the substrate, drying the applied coating solution and then removing the unnecessary filling polymer so that the filling polymer remains only in the V-shaped groove; forming an optical waveguide consisting of a polymer on the substrate; a step of making a cut at a position corresponding to the end face of the optical waveguide; and a step of removing all the polymer present in and on the V-shaped groove.

Abstract: The present invention relates to a package for containing an optical module coupled to an optical fiber and to an optical module assembly combining them. A package (6) according to the present invention has a body (10) and a lid (12). The body has a bottom panel (14) for supporting the optical module (4) and a plurality of side panels (16, 18, 20) provided along a periphery of the bottom panel (14) to surround the optical module (4). The lid has a top panel (38) mounted on the side panels (20) for covering the body (10), and extension panels (40) extending downward from the top panel (38). The side panels (16,18) and the extension panels (40) cooperates to form apertures (32a, 32b). Each of the body (10) and the lid (12) is formed by folding one sheet panel. Folding locations of the body (10) and the lid (12) have folding grooves (26, 44).

Abstract: A method for the preparation of an optical waveguide device characterized in that it comprises a first step for forming a first resin film on a substrate provided thereon with a lower clad layer; a second step for patterning the first resin film into a shape of an optical waveguide to thus form a core layer; a third step for forming a second resin film by coating the surfaces of the lower clad layer and the core layer with a solution containing a material for forming the second resin film according to the spin-coating method in such a manner that the thickness of the resulting film as measured from the upper surface of the lower clad layer and as determined after drying ranges from 3 to 10 times the thickness of the core layer and then drying the coated layer; and a fourth step for removing the second resin film in such a manner that the thickness of the second resin film as determined from the upper surface of the lower clad layer is less than 3 times that of the core layer and that the second resin film thu

Abstract: An optical element combination structure in which an optical fiber and an optical waveguide are combined with each other and which can reduce fluctuation of coupling loss due to a change in environmental temperature is provided. The present invention relates to an optical element combination structure in which an optical fiber and an optical waveguide are combined with each other. An optical element combination structure according to the present invention 1 comprises an optical fiber 2 and a substrate 6 on which an optical waveguide 4 is formed. The substrate 6 has a V-shaped cross-sectional groove 8 formed so that the optical fiber and the optical waveguide are aligned with each other, and a recess 10 formed on a waveguide side relative to the groove 8. The optical fiber is secured to the V-shaped cross-sectional groove 8 with an adhesive 22.

Abstract: A method of producing optical elements using a substrate having a recess, which is capable of easily removing a film in the recess, and optical elements formed. The optical element comprises a substrate 1, an optical waveguide structure layer 10 of resin disposed in a part of the region on the substrate 1, and a recess 21 formed in the region where the optical waveguide structure layer 10 is not disposed. The optical waveguide structure layer 10 includes an optical waveguide 4 and a clad layer. A coupler layer is disposed between the substrate 1 and the optical waveguide structure layer 10, and the film thickness distribution range of the coupler layer in the region below the optical waveguide 4 is such that the minimum film thickness is not more than 30 angstroms and the maximum film thickness is not less than 20 angstroms.

Abstract: A method of producing optical elements using a substrate having a recess, which is capable of easily removing a film in the recess, and optical elements formed. The optical element comprises a substrate 1, an optical waveguide structure layer 10 of resin disposed in a part of the region on the substrate 1, and a recess 21 formed in the region where the optical waveguide structure layer 10 is not disposed. The optical waveguide structure layer 10 includes an optical waveguide 4 and a clad layer. A coupler layer is disposed between the substrate 1 and the optical waveguide structure layer 10, and the film thickness distribution range of the coupler layer in the region below the optical waveguide 4 is such that the minimum film thickness is not more than 30 angstroms and the maximum film thickness is not less than 20 angstroms.

Abstract: An optical element combination structure 1 according to the present invention comprises an optical fiber 2 extending in a direction of an optical axis 1a, an optical waveguide 4 being aligned with the fiber 2 in a direction of the optical axes 1a and having an end surface 18 facing an end surface 12 of the fiber, and a substrate 6 coupled with the fiber 2 and the waveguide 4. The end surface 12 of the fiber 2 is formed perpendicular to the optical axis 1a, and the end surface 18 of the waveguide 4 is inclined relative to a surface perpendicular to the optical axis 1a. A value of refractive index of a core 12 of the fiber 2 is different from that of refractive index of a core 14 of the waveguide 4. A gap 30 between the fiber end surface 12 and the waveguide end surface 14 is filled with a filler 32 having substantially the same value of refractive index as that of refractive index of the fiber core 8.

Abstract: A method for preparing an optical device by dicing includes applying a dicing tape onto the back face of a substrate provided thereon with a large number of optical elements on the surface thereof and dicing the substrate from the surface side of the substrate using a blade to thus prepare individual optical devices and the method is characterized in that the dicing operation is conducted in several stages using a blade which can ensure a moderate autogenously blade-generating effect. An optical device prepared by the method includes a substrate and an optical element formed on the surface of the substrate and it is characterized in that the maximum size of the ruptures present on the back face of the substrate in the direction vertical to the cut surface is not more than 0.1 mm.

Abstract: An optical pickup apparatus which carries out recording/reproduction or deletion of information on an optical disc, including a semiconductor laser device in which at least two light sources are integrated, and a hologram optical element which has a plurality of outgoing light areas that divide light reflected from the optical disc, each light being emitted from the semiconductor laser device; the hologram optical element has division lines which divide the outgoing light areas at a position intersecting with each optical axis of the reflected light. The optical pickup apparatus is able to detect a signal corresponding to a light beam divided almost equally in two, even when any one of the plurality of light sources are operating.

Abstract: A semiconductor laser device includes: a semiconductor laser chip which is composed of a semiconductor substrate and a plurality of semiconductor layers stacked on an element formation face of the semiconductor substrate and which outputs an irradiation light for irradiating an optical disk; and a light receiving element which receives the irradiation light reflected by the optical disk as a feedback light. The semiconductor laser chip includes on one face thereof an electrode facing an optical element and is fixed in a package so that at least one of sub-beams reflected by the optical disk is incident on the one face. A chip exposing portion for exposing a region of the one face where the sub-beam is incident is formed in the electrode.

Abstract: A trapping apparatus traps solid substances converted from reaction products contained in exhaust gases discharged from a process apparatus by a vacuum pump. The trapping apparatus has a trap member for contacting the exhaust gases and trapping reaction products contained in exhaust gases, and a trap housing (1) accommodating the trap member (4) therein. The trap housing has an inlet port (2) for introducing exhaust gases, and an exhaust gas space (3) connected to the inlet port and having an increased cross-sectional area in the direction in which exhaust gases flow in. The trap housing has a flow passage defined therein for passing the exhaust gases in the exhaust gas space and then changing the direction of the exhaust gases so as to flow from the exhaust gas space substantially perpendicularly to the trap member so as to pass the exhaust gases through the trap member while in contact therewith.

Abstract: A method of producing optical elements using a substrate having a recess, which is capable of easily removing a film in the recess. An optical element comprises a substrate 1, and optical wavefuide structure layer 10 of resin disposed in a part of the region on the suvstrate 1, and a recess 21 formed in the region where the optical waveguide structure layer 10 is not disposed. The optical wavefuide structure layer 10 includes an optical wavefude 4 and a clad layer. A coupler layer is disposed vetween the substrate 1 and the optical wavefude structure layer 10, and the film thickness distribution range of the coupler layer in the region below the optical wavefuide 4 is such that the minimum film thickness is not more than 30 angstroms and the maximum film thickness is not less htan 20 angstroms.