Patents by Inventor Toshihiro Kuroki
Toshihiro Kuroki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11127435Abstract: A wearable camera includes an imaging unit; a storage unit configured to store video data imaged by the imaging unit; a sound collection unit disposed on an upper surface of a casing of the wearable camera and configured to collect a sound of a user; and a control unit configured to extract a sound of the user related to an imaging situation included in the video data, and add attribute information to the video data based on the extracted sound.Type: GrantFiled: February 13, 2020Date of Patent: September 21, 2021Assignee: Panasonic I-PRO Sensing Solutions Co., Ltd.Inventors: Satoru Ooyabu, Michinori Kishimoto, Toshihiro Kuroki
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Publication number: 20200273497Abstract: A wearable camera includes an imaging unit; a storage unit configured to store video data imaged by the imaging unit; a sound collection unit disposed on an upper surface of a casing of the wearable camera and configured to collect a sound of a user; and a control unit configured to extract a sound of the user related to an imaging situation included in the video data, and add attribute information to the video data based on the extracted sound.Type: ApplicationFiled: February 13, 2020Publication date: August 27, 2020Inventors: Satoru OOYABU, Michinori KISHIMOTO, Toshihiro KUROKI
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Patent number: 10141482Abstract: A semiconductor light emitting device includes a light emitting chip that includes a semiconductor layer at a first surface. A transparent film is provided on the semiconductor layer and forms an interface therewith. A phosphor resin layer, including a resin and a phosphor, is provided on the transparent film. A refractive index of the transparent film is greater than a refractive index of the semiconductor layer.Type: GrantFiled: March 3, 2016Date of Patent: November 27, 2018Assignee: ALPAD CORPORATIONInventors: Naoya Ushiyama, Masahiro Ogushi, Kazuhiro Tamura, Hidenori Egoshi, Toshihiro Kuroki
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Patent number: 9853195Abstract: A light-emitting device includes a semiconductor light-emitting element, for example, a light emitting diode. A first metal member includes a first metal plate and a first metal layer between the semiconductor light-emitting element and a first surface of the first metal plate. An insulating layer contacts a second surface of the first metal plate. The second surface is in a second plane that intersects a first plane of the first surface.Type: GrantFiled: March 3, 2016Date of Patent: December 26, 2017Assignee: Kabushiki Kaisha ToshibaInventors: Yuki Akamatsu, Yoshio Noguchi, Masahiro Ogushi, Teruo Takeuchi, Toshihiro Kuroki, Hidenori Egoshi, Takashi Arakawa, Kazuhiro Inoue, Toshihiro Komeya
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Publication number: 20170040499Abstract: A semiconductor light emitting device includes a light emitting chip that includes a semiconductor layer at a first surface. A transparent film is provided on the semiconductor layer and forms an interface therewith. A phosphor resin layer, including a resin and a phosphor, is provided on the transparent film. A refractive index of the transparent film is greater than a refractive index of the semiconductor layer.Type: ApplicationFiled: March 3, 2016Publication date: February 9, 2017Inventors: Naoya USHIYAMA, Masahiro OGUSHI, Kazuhiro TAMURA, Hidenori EGOSHI, Toshihiro KUROKI
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Publication number: 20160308099Abstract: A light-emitting device includes a semiconductor light-emitting element, for example, a light emitting diode. A first metal member includes a first metal plate and a first metal layer between the semiconductor light-emitting element and a first surface of the first metal plate. An insulating layer contacts a second surface of the first metal plate. The second surface is in a second plane that intersects a first plane of the first surface.Type: ApplicationFiled: March 3, 2016Publication date: October 20, 2016Inventors: Yuki AKAMATSU, Yoshio NOGUCHI, Masahiro OGUSHI, Teruo TAKEUCHI, Toshihiro KUROKI, Hidenori EGOSHI, Takashi ARAKAWA, Kazuhiro INOUE, Toshihiro KOMEYA
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Publication number: 20160079487Abstract: A semiconductor light-emitting device includes a package that includes a bottom surface and a first side section provided surround the bottom surface, a chip that includes a supporting substrate and a light-emitting section provided on the supporting substrate and is disposed on the bottom surface and spaced from the first side section, and a phosphor layer that is on the chip in a region above the bottom surface.Type: ApplicationFiled: March 1, 2015Publication date: March 17, 2016Inventor: Toshihiro KUROKI
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Publication number: 20160079217Abstract: According to one embodiment, a semiconductor light emitting device includes a lead frame; a chip mounted on the lead frame, the chip including a substrate and a light emitting element provided on the substrate; a wall section including an inner wall facing to a side portion of the chip, and an outer wall on an opposite side to the inner wall; and a phosphor layer provided on at least the chip. A distance between the side portion of the chip and the inner wall of the wall section is smaller than a thickness of the chip. An angle between an upper surface of the lead frame and the inner wall is smaller than an angle between the upper surface of the lead frame and the outer wall.Type: ApplicationFiled: August 28, 2015Publication date: March 17, 2016Inventors: Hidenori Egoshi, Yoshio Noguchi, Kazuhiro Inoue, Takashi Arakawa, Teruo Takeuchi, Toshihiro Kuroki, Masahiro Ogushi
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Publication number: 20150270450Abstract: A semiconductor light-emitting device includes a light-emitting element provided on a lead frame, a phosphor-containing first resin provided on the light-emitting element and having a first surface facing the light-emitting element, a transparent resin that is provided between the light-emitting element and the phosphor-containing first resin and covering the entirety of the first surface of the phosphor-containing first resin, and a spherical lens provided on the phosphor-containing first resin.Type: ApplicationFiled: July 22, 2014Publication date: September 24, 2015Inventors: Toshihiro KUROKI, Masahiro OGUSHI
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Patent number: 9082938Abstract: According to one embodiment, a light emitting device includes a base, a light emitting element, and a fluorescent body-containing layer. The light emitting element is installed on the base, has an upper surface and a lower surface, and includes a light emitting unit on the upper surface. The fluorescent body-containing layer is provided on the light emitting element and has a lower surface having an area smaller than an area of the light emitting unit and an upper surface having an area larger than an area of the light emitting unit.Type: GrantFiled: March 13, 2014Date of Patent: July 14, 2015Assignee: Kabushiki Kaisha ToshibaInventors: Takayoshi Fujii, Haruhiko Okazaki, Toshihiro Kuroki, Toshitake Kitagawa
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Publication number: 20150076543Abstract: According to one embodiment, a light emitting device includes a base, a light emitting element, and a fluorescent body-containing layer. The light emitting element is installed on the base, has an upper surface and a lower surface, and includes a light emitting unit on the upper surface. The fluorescent body-containing layer is provided on the light emitting element and has a lower surface having an area smaller than an area of the light emitting unit and an upper surface having an area larger than an area of the light emitting unit.Type: ApplicationFiled: March 13, 2014Publication date: March 19, 2015Applicant: Kabushiki Kaisha ToshibaInventors: Takayoshi FUJII, Haruhiko OKAZAKI, Toshihiro KUROKI, Toshitake KITAGAWA
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Publication number: 20150054011Abstract: According to one embodiment, a light emitting device includes a base, a light emitting element, a resin layer, a fluorescent material layer, and a lens layer. The base has an under surface, a top surface, and a side surface. The light emitting element is provided on the top surface of the base. The resin layer contacts a side surface of the light emitting element and the top surface of the base. A thickness of the resin layer is thinner from the side surface of the light emitting element toward the side surface of the base. The resin layer has light reflection particle dispersed. The fluorescent material layer is provided on the light emitting element and the resin layer. The lens layer is provided on the base and covers the fluorescent material layer.Type: ApplicationFiled: August 20, 2014Publication date: February 26, 2015Applicant: Kabushiki Kaisha ToshibaInventors: Hiroshi KOIZUMI, Toshihiro KUROKI, Yasunari UKITA, Tatsuya KOBAYASHI, Keiji NAKAGAWA
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Publication number: 20140361324Abstract: A light emitting device includes a light emitting element disposed on a portion of a first lead frame element, a first resin including a fluorescent material, and a second resin. The first resin is above the light emitting element. The second resin is between the first resin and the first lead frame element. In some embodiments, the second resin includes a filler material that reflects light emitted by the light emitting element. In some embodiments, the light emitting device includes a protective diode connected in reverse parallel with the light emitting element. In some embodiments, a transparent resin may be disposed first and second resins.Type: ApplicationFiled: February 28, 2014Publication date: December 11, 2014Inventors: Naoya USHIYAMA, Kazuhiro INOUE, Kenji SHIMOMURA, Tetsuro KOMATSU, Toshihiro KUROKI, Toshihiro KOMEYA, Kazuhiro TAMURA, Yoshiharu TSUBOI, Teruo TAKEUCHI, Kazuhisa IWASHITA
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Patent number: 8258697Abstract: According to one embodiment, a light emitting device includes a first lead, a light emitting element, a second lead and a molded body. The first lead includes a die pad portion having a major surface and a recess provided in the major surface, a bent portion bent toward above the major surface, and a thermally conductive portion extending outward from the die pad portion. The first lead is provided with a slit at an end of a fold. The light emitting element is bonded to a bottom surface of the recess. The second lead with one end portion is opposed to one end portion of the first lead. The molded body covers the light emitting element, the bent portion, the die pad portion, the thermally conductive portion, and the one end portion of the second lead, penetrates through the slit, and is made of a resin.Type: GrantFiled: December 16, 2010Date of Patent: September 4, 2012Assignee: Kabushiki Kaisha ToshibaInventors: Tetsuya Muranaka, Toshihiro Kuroki, Toshiaki Hosoya
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Publication number: 20110291541Abstract: According to one embodiment, a light emitting device includes a first lead, a light emitting element, a second lead and a molded body. The first lead includes a die pad portion having a major surface and a recess provided in the major surface, a bent portion bent toward above the major surface, and a thermally conductive portion extending outward from the die pad portion. The first lead is provided with a slit at an end of a fold. The light emitting element is bonded to a bottom surface of the recess. The second lead with one end portion is opposed to one end portion of the first lead. The molded body covers the light emitting element, the bent portion, the die pad portion, the thermally conductive portion, and the one end portion of the second lead, penetrates through the slit, and is made of a resin.Type: ApplicationFiled: December 16, 2010Publication date: December 1, 2011Applicant: KABUSHIKI KAISHA TOSHIBAInventors: Tetsuya Muranaka, Toshihiro Kuroki, Toshiaki Hosoya
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Patent number: 8030835Abstract: A light-emitting device includes: a first lead including a bonding region and a first outer edge extending generally parallel to a first direction; a light-emitting element bonded to the bonding region; a second lead including an electrical connection region connected to the light-emitting element; and a molded body including a first side surface generally perpendicular to the first direction, a second side surface provided on a side opposite to the first side surface and being generally perpendicular to the first direction, a lower surface, and a recess provided in a surface opposite to the lower surface, the molded body being formed so that one end portion of the first lead protrudes from the first side surface, the other end portion of the first lead and an end portion of the second lead each protrude from the second side surface, and the bonding region and the electrical connection region are exposed from a bottom surface of the recess.Type: GrantFiled: December 1, 2009Date of Patent: October 4, 2011Assignee: Kabushiki Kaisha ToshibaInventors: Toshihiro Kuroki, Yoshio Ariizumi
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Publication number: 20110074276Abstract: A light-emitting device includes: a first lead including a bonding region and a first outer edge extending generally parallel to a first direction; a light-emitting element bonded to the bonding region; a second lead including an electrical connection region connected to the light-emitting element; and a molded body including a first side surface generally perpendicular to the first direction, a second side surface provided on a side opposite to the first side surface and being generally perpendicular to the first direction, a lower surface, and a recess provided in a surface opposite to the lower surface, the molded body being formed so that one end portion of the first lead protrudes from the first side surface, the other end portion of the first lead and an end portion of the second lead each protrude from the second side surface, and the bonding region and the electrical connection region are exposed from a bottom surface of the recess.Type: ApplicationFiled: December 1, 2009Publication date: March 31, 2011Applicant: KABUSHIKI KAISHA TOSHIBAInventors: Toshihiro Kuroki, Yoshio Ariizumi
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Patent number: 7808007Abstract: A semiconductor light-emitting element is disposed in a depression of a container. A first fluorescent material layer is located in the depression. At least a portion of the first fluorescent material layer is provided between the opening of the depression and the semiconductor light-emitting element. A second fluorescent material layer having first and second portions is disposed in the depression. The first portion is provided between the bottom of the depression and the semiconductor light-emitting element. The second portion is provided between the side surface of the depression and the semiconductor light-emitting element. The first and second fluorescent material layers are excited by the light radiated from the semiconductor light-emitting element to emit a light having a first wavelength longer than the emission wavelength of the semiconductor light-emitting element and another light having a second wavelength longer than the first wavelength respectively.Type: GrantFiled: May 29, 2008Date of Patent: October 5, 2010Assignee: Kabushiki Kaisha ToshibaInventors: Kazuaki Otsuka, Toshihiro Kuroki
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Publication number: 20090008666Abstract: A semiconductor light-emitting element is disposed in a depression of a container. A first fluorescent material layer is located in the depression. At least a portion of the first fluorescent material layer is provided between the opening of the depression and the semiconductor light-emitting element. A second fluorescent material layer having first and second portions is disposed in the depression. The first portion is provided between the bottom of the depression and the semiconductor light-emitting element. The second portion is provided between the side surface of the depression and the semiconductor light-emitting element. The first and second fluorescent material layers are excited by the light radiated from the semiconductor light-emitting element to emit a light having a first wavelength longer than the emission wavelength of the semiconductor light-emitting element and another light having a second wavelength longer than the first wavelength respectively.Type: ApplicationFiled: May 29, 2008Publication date: January 8, 2009Applicant: KABUSHIKI KAISHA TOSHIBAInventors: Kazuaki Otsuka, Toshihiro Kuroki