Patents by Inventor Toshihiro NAMBU

Toshihiro NAMBU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10024907
    Abstract: A through electrode and a multilayer wiring are provided on a semiconductor substrate, and a bottom layer connection wiring, a lower layer connection wiring, an upper layer connection wiring, and a top layer connection wiring are provided in the multilayer wiring. The through electrode is connected to the bottom layer connection wiring, and a via is arranged at a position other than a position immediately above the through electrode.
    Type: Grant
    Filed: February 26, 2016
    Date of Patent: July 17, 2018
    Assignee: TOSHIBA MEMORY CORPORATION
    Inventors: Shinya Watanabe, Toshihiro Nambu
  • Publication number: 20160351492
    Abstract: A through electrode and a multilayer wiring are provided on a semiconductor substrate, and a bottom layer connection wiring, a lower layer connection wiring, an upper layer connection wiring, and a top layer connection wiring are provided in the multilayer wiring. The through electrode is connected to the bottom layer connection wiring, and a via is arranged at a position other than a position immediately above the through electrode.
    Type: Application
    Filed: February 26, 2016
    Publication date: December 1, 2016
    Inventors: Shinya WATANABE, Toshihiro NAMBU