Patents by Inventor Toshihiro Naoi

Toshihiro Naoi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Die bonding apparatus
    Patent number: 6244493
    Abstract: In a die bonding apparatus with a position correcting stage that has a die carrying surface upon which a die is placed by a collet, the external circumferential shape of the die carrying surface of the position correcting stage is formed so as to be smaller than the external circumferential shape of the die to be carried on the die carrying surface, thus avoiding damages to the surface of the die.
    Type: Grant
    Filed: July 6, 1998
    Date of Patent: June 12, 2001
    Assignee: Kabushiki Kaisha Shinkawa
    Inventors: Eiichi Shimazaki, Tsutomu Sugimoto, Toshihiro Naoi, Osamu Nakamura, Noboru Fujino