Abstract: Provided is a liquid stabilizer, which can improve releasability without impairing transparency. A liquid stabilizer for a chlorine-containing resin of the present invention includes: an oxidized polyethylene wax having an acid value of 5 mgKOH/g or more; a dispersion medium; and at least one kind selected from the group consisting of a zinc salt, an alkaline earth metal salt, and an organotin compound. The liquid stabilizer of the present invention is a dispersion, and a dispersoid including the oxidized polyethylene wax has a median diameter (D50) of from 1 ?m to 50 ?m.

Abstract: The present invention provides a chlorine-containing resin composition capable of providing a processed product that is excellent in thermal stability and heat resistance and that has various excellent properties derived from the chlorine-containing resin in an efficient, easy, simple, and high-yield manner, without degrading the appearance of the processed product. The present invention also provides a method for providing such a processed product. The present invention relates to a chlorine-containing resin composition containing a chlorine-containing resin, a hydrotalcite powder, and organic acid zinc, wherein the hydrotalcite powder contains magnesium (Mg) and/or zinc (Zn), and aluminum (Al), the molar ratio of the total amount of magnesium and zinc to the amount of aluminum ((Mg+Zn)/Al) is 2.20 or less, and the hydrotalcite powder has an oil absorption of 30 ml/100 g or less.

Abstract: The present invention provides a chlorine-containing resin composition capable of providing a processed product that is excellent in thermal stability and heat resistance and that has various excellent properties derived from the chlorine-containing resin in an efficient, easy, simple, and high-yield manner, without degrading the appearance of the processed product. The present invention also provides a method for providing such a processed product. The present invention relates to a chlorine-containing resin composition containing a chlorine-containing resin, a hydrotalcite powder, and organic acid zinc, wherein the hydrotalcite powder contains magnesium (Mg) and/or zinc (Zn), and aluminum (Al), the molar ratio of the total amount of magnesium and zinc to the amount of aluminum ((Mg+Zn)/Al) is 2.20 or less, and the hydrotalcite powder has an oil absorption of 30 ml/100 g or less.

Abstract: In a method of manufacturing a circuit forming board, a first sheet having a first direction is transferred in a second direction, so that the first direction of the first sheet is parallel to the second direction. Films are stuck onto both surfaces of the first sheet while transferring the first sheet in a third direction orthogonal to the first direction of the first sheet. This method allows a connecting member, such as conductive paste, to electrically couple between layers of the circuit forming board.

Abstract: A manufacturing method of a clad board includes: sticking a releasing film to a pre-preg sheet; forming a non-through-hole or through-hole in the pre-preg sheet including the releasing film; filling the hole with conductive paste; peeling off the film; and heating and pressing a metal foil onto the pre-preg sheet. The clad board has a smooth face formed on one face or both the faces of the pre-preg sheet, so that the conductive paste is restrained from spreading in an interface between the pre-preg sheet and the releasing film. This structure can avoid short-circuit between circuits and prevent insulating reliability from lowering. As a result, an yield rate is improved, and a reliable circuit board is obtainable.

Abstract: A stable and high quality circuit forming substrate is provided even when the work size is increased in the circuit forming substrate. In a stacking step, prepregs that are B stage substrate materials, are arranged lined with respect to a first metal foil, and stacked on the first metal foil. A C stage substrate material is stacked on the B stage substrate materials. Further, the prepregs that are two or more B stage substrate materials, are stacked on the C stage substrate material and a second metal foil is stacked thereon.

Abstract: A conductive portion is formed in a hole formed in a material sheet. A metal foil is placed on a surface of the material sheet to provide a laminated sheet. The laminated sheet is heated and pressed to provide a circuit-forming board. The metal foil includes a pressure absorption portion and a hard portion adjacent to the pressure absorption portion. The pressure absorption portion has a thickness changing according to a pressure applied thereto. The circuit-forming board provided by this method provides a high-density circuit board of high quality having reliable electrical connection.

Abstract: A conductive portion is formed in a hole formed in a material sheet. A metal foil is placed on a surface of the material sheet to provide a laminated sheet. The laminated sheet is heated and pressed to provide a circuit-forming board. The metal foil includes a pressure absorption portion and a hard portion adjacent to the pressure absorption portion. The pressure absorption portion has a thickness changing according to a pressure applied thereto. The circuit-forming board provided by this method provides a high-density circuit board of high quality having reliable electrical connection.

Abstract: A stable and high quality circuit forming substrate is provided even when the work size is increased in the circuit forming substrate. In a stacking step, prepregs that are B stage substrate materials, are arranged lined with respect to a first metal foil, and stacked on the first metal foil. A C stage substrate material is stacked on the B stage substrate materials. Further, the prepregs, that are two or more B stage substrate materials, are stacked on the C stage substrate material and a second metal foil is stacked thereon.

Abstract: A circuit board with reliable electrical connections is provided. An insulated board material, having connections for connecting a layer to another layer, includes a reinforcing member. A thickness of the entire insulated board material is at least equal to and not more than 1.5 times of a thickness of the reinforcing member.

Abstract: A laminated circuit board has electronic components buried therein wherein the laminated circuit board may assure excellent reliability of electrical connections and high mechanical strength even with electronic components mounted in high density. It comprises a substrate on which a land disposed on one main surface thereof is connected and fixed by solder to integrated circuit or the like, and a sheet laminated on the upper surface of the substrate and also provided with a resin fluid filling portion formed by clearance at the outer periphery of integrated circuit or the like, wherein the sheet maintains its shape by woven or non-woven cloth having a hole in which integrated circuit or the like is buried, and the woven or non-woven cloth is impregnated with resin having heat fluidity and is thermally compressed. Thus, the electrical and mechanical connections between the laminated circuit board and electronic component can be enhanced in reliability.

Abstract: In a heat and press stage of manufacturing printed wiring boards, a functional surface layer having release property is provided on a surface of a cushion, and a blocking layer is prepared between the functional surface layer and an inner layer having cushion property so that a frequency of use of the cushion can be increased.

Abstract: A conductive portion is formed in a hole formed in a material sheet. A metal foil is placed on a surface of the material sheet to provide a laminated sheet. The laminated sheet is heated and pressed to provide a circuit-forming board. The metal foil includes a pressure absorption portion and a hard portion adjacent to the pressure absorption portion. The pressure absorption portion has a thickness changing according to a pressure applied thereto. The circuit-forming board provided by this method provides a high-density circuit board of high quality having reliable electrical connection.

Abstract: A laminated circuit board with electronic components buried therein comprises a substrate on which a land disposed on one main surface thereof is connected and fixed by solder to an integrated circuit (or the like). A sheet is laminated on the upper surface of the substrate. A filling portion by fluid resin is formed by clearance at the outer periphery of the integrated circuit (or the like). The sheet maintains its shape by woven or non-woven cloth having a hole in which the integrated circuit (or the like) is buried. The woven or non-woven cloth is impregnated with resin having heat fluidity and is thermally compressed. Thus, the electrical and mechanical connections between the laminated circuit board and electronic component can be enhanced in reliability.

Abstract: In order to improve the adhesion of a circuit to a circuit forming board, a separation film including a base film and a coating layer formed on the base film is joined to both the sides of the board. When a laser beam is applied to form a throughhole in the board, a unified portion of the board and the separation film is formed around the throughhole. An energy beam is applied to the whole or a part of the surface of a circuit formed at a circuit forming step to transfer a part of the separation film. Thus, a high density board where the circuit strongly adheres to the board can be realized in the manufacturing process of the circuit forming board.

Abstract: It is possible to obtain a clean high-quality circuit board by removing affected material and foreign matter produced when a hole is formed. A manufacturing method of the circuit board includes (a) preparing a film-coated board material by bonding a film material as a mask to a board material, (b) forming a hole in the film-coated board material by applying a laser beam thereto, and (c) selectively removing the unnecessary material sticking to the film-coated board material from the film-coated board material by supersonic cleaning without peeling the film material off the board material. Unnecessary material such as foreign matter is produced when the hole is formed, and the unnecessary material sticks to the board material. After removal of such unnecessary material, a conductive material is disposed in the hole, using the film material as a mask, and the film material is later removed from the board material.

Abstract: A conductive portion is formed in a hole formed in a material sheet. A metal foil is placed on a surface of the material sheet to provide a laminated sheet. The laminated sheet is heated and pressed to provide a circuit-forming board. The metal foil includes a pressure absorption portion and a hard portion adjacent to the pressure absorption portion. The pressure absorption portion has a thickness changing according to a pressure applied thereto. The circuit-forming board provided by this method provides a high-density circuit board of high quality having reliable electrical connection.

Abstract: A method of manufacturing a circuit board comprising: an inner layer board laminating step for laminating inner layer board material and one or more metal sheet(s) for inner layer; an inner layer circuit forming step for forming circuits of the metal sheet to make an inner layer circuit board; a multi-layer laminating step for laminating one or more metal sheet(s) for multi-layer, one or more multi-layer board material(s) and one or more inner layer circuit board(s); and a multi-layer circuit forming step for forming circuits of the metal sheet for the multi-layer, wherein the inner layer board material and the multi-layer board material are different in material composition from each other. According to the present invention, it is possible to stabilize the quality of interstitial connection of the inner layer circuit board and to improve the mechanical strength such as the adhesive strength of an outer layer circuit.

Abstract: The present invention aims to provide a printing plate capable of preventing paste of high viscosity adhering to an edge of a squeegee from being transferred to and left on a through hole of a printed circuit board when the paste is being filled by a squeegeeing method. The printing plate has a metal sheet (3) provided with a squeegee cleaning section (7) formed thereon and fixed to the back surface of a slanting area (5) of mask (2) attached to a plate framework (1). The through hole of the printed circuit board is filled with paste only after paste of high viscosity adhering to the edge of the squeegee is removed by the squeegee cleaning section (7), to prevent the paste from being left on the through hole, and thereby achieving the printed circuit board of excellent quality.

Abstract: In the process of forming a through-hole or blind-hole at desired positions of a the substrate material, the present invention sets a drilling target position for each hole and a plurality of auxiliary drilling positions at a periphery of the drilling target position, and performs a plurality of drillings at the drilling target position and the plurality of auxiliary drilling positions. In another preferred embodiment of the present invention, a plurality of drillings are performed only at the auxiliary drilling positions per one hole at the desired position. According to the present invention, through-holes or blind-holes having several sizes of diameters can be formed by using one drilling jig under a single drilling condition. Accordingly, it is possible to efficiently produce circuit boards at low costs.