Patents by Inventor Toshihiro Nishii

Toshihiro Nishii has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10947377
    Abstract: The present invention provides a chlorine-containing resin composition capable of providing a processed product that is excellent in thermal stability and heat resistance and that has various excellent properties derived from the chlorine-containing resin in an efficient, easy, simple, and high-yield manner, without degrading the appearance of the processed product. The present invention also provides a method for providing such a processed product. The present invention relates to a chlorine-containing resin composition containing a chlorine-containing resin, a hydrotalcite powder, and organic acid zinc, wherein the hydrotalcite powder contains magnesium (Mg) and/or zinc (Zn), and aluminum (Al), the molar ratio of the total amount of magnesium and zinc to the amount of aluminum ((Mg+Zn)/Al) is 2.20 or less, and the hydrotalcite powder has an oil absorption of 30 ml/100 g or less.
    Type: Grant
    Filed: July 6, 2017
    Date of Patent: March 16, 2021
    Assignee: Sakai Chemical Industry Co., Ltd.
    Inventors: Koichi Tsuda, Yasuhiro Tai, Toshihiro Nishii
  • Publication number: 20200325322
    Abstract: The present invention provides a chlorine-containing resin composition capable of providing a processed product that is excellent in thermal stability and heat resistance and that has various excellent properties derived from the chlorine-containing resin in an efficient, easy, simple, and high-yield manner, without degrading the appearance of the processed product. The present invention also provides a method for providing such a processed product. The present invention relates to a chlorine-containing resin composition containing a chlorine-containing resin, a hydrotalcite powder, and organic acid zinc, wherein the hydrotalcite powder contains magnesium (Mg) and/or zinc (Zn), and aluminum (Al), the molar ratio of the total amount of magnesium and zinc to the amount of aluminum ((Mg+Zn)/Al) is 2.20 or less, and the hydrotalcite powder has an oil absorption of 30 ml/100 g or less.
    Type: Application
    Filed: July 6, 2017
    Publication date: October 15, 2020
    Inventors: Koichi TSUDA, Yasuhiro TAI, Toshihiro NISHII
  • Patent number: 10479780
    Abstract: An objective of the present invention is to provide low-molecular-weight compounds that can inhibit Src family kinases. The present invention relates to compounds represented by general formula (I) or pharmacologically acceptable salts thereof. In the formula, Ar1 is optionally substituted C6-10 arylene or 5- to 10-membered heteroarylene, and Ar2 is optionally substituted C6-10 aryl or 5- to 10-membered heteroaryl. R1 and R2 are defined as described in the specification.
    Type: Grant
    Filed: June 17, 2016
    Date of Patent: November 19, 2019
    Assignees: Chugai Seiyaku Kabushiki Kaisha, F. Hoffmann-La Roche AG
    Inventors: Hirosato Ebiike, Toshihiro Aoki, Takashi Chiba, Masami Kochi, Kimitaka Nakama, Satoshi Niizuma, Hiroki Nishii, Jun Ohwada, Hiroyuki Shimamura, Aiko Suge, Yoshito Nakanishi, Natsuki Kobayashi
  • Patent number: 10436294
    Abstract: Fletching wear caused by elastic deformation in the axial direction of an input-side disk 2c due to thrust force of a pressure device is prevented. A female-spline section 13a formed around the middle section in the axial direction of the inner-circumferential surface of a center hole 19 in the input-side disk 2c and a male-spline section 12a formed around the outer-circumferential surface of one end section in the axial direction of an input rotating shaft 1b engage with a spline engagement. A disk-side fitting surface section 22 formed around a portion of the inner-circumferential surface of the center hole 19 in the input-side disk 2c that is adjacent to the other end side of the female-spline section 13a and a shaft-side fitting surface section 23 formed around a portion of the outer-circumferential surface of the input rotating shaft 1b that is adjacent to the other end side of the male spline section 12a are fitted together with an interference fit.
    Type: Grant
    Filed: March 24, 2015
    Date of Patent: October 8, 2019
    Assignees: NSK LTD., HONDA MOTOR CO., LTD.
    Inventors: Kota Fukuda, Toshirou Toyoda, Hiroki Nishii, Toshihiro Saito
  • Patent number: 8069557
    Abstract: In a method of manufacturing a circuit forming board, a first sheet having a first direction is transferred in a second direction, so that the first direction of the first sheet is parallel to the second direction. Films are stuck onto both surfaces of the first sheet while transferring the first sheet in a third direction orthogonal to the first direction of the first sheet. This method allows a connecting member, such as conductive paste, to electrically couple between layers of the circuit forming board.
    Type: Grant
    Filed: May 14, 2004
    Date of Patent: December 6, 2011
    Assignee: Panasonic Corporation
    Inventors: Toshihiro Nishii, Yoshihiro Kawakita, Kunio Kishimoto
  • Patent number: 7754321
    Abstract: A manufacturing method of a clad board includes: sticking a releasing film to a pre-preg sheet; forming a non-through-hole or through-hole in the pre-preg sheet including the releasing film; filling the hole with conductive paste; peeling off the film; and heating and pressing a metal foil onto the pre-preg sheet. The clad board has a smooth face formed on one face or both the faces of the pre-preg sheet, so that the conductive paste is restrained from spreading in an interface between the pre-preg sheet and the releasing film. This structure can avoid short-circuit between circuits and prevent insulating reliability from lowering. As a result, an yield rate is improved, and a reliable circuit board is obtainable.
    Type: Grant
    Filed: September 11, 2003
    Date of Patent: July 13, 2010
    Assignee: Panasonic Corporation
    Inventors: Shigeru Yamane, Eiji Kawamoto, Hideaki Komoda, Takeshi Suzuki, Toshihiro Nishii, Shinji Nakamura
  • Patent number: 7685707
    Abstract: A stable and high quality circuit forming substrate is provided even when the work size is increased in the circuit forming substrate. In a stacking step, prepregs that are B stage substrate materials, are arranged lined with respect to a first metal foil, and stacked on the first metal foil. A C stage substrate material is stacked on the B stage substrate materials. Further, the prepregs that are two or more B stage substrate materials, are stacked on the C stage substrate material and a second metal foil is stacked thereon.
    Type: Grant
    Filed: March 16, 2006
    Date of Patent: March 30, 2010
    Assignee: Panasonic Corporation
    Inventor: Toshihiro Nishii
  • Patent number: 7624502
    Abstract: A conductive portion is formed in a hole formed in a material sheet. A metal foil is placed on a surface of the material sheet to provide a laminated sheet. The laminated sheet is heated and pressed to provide a circuit-forming board. The metal foil includes a pressure absorption portion and a hard portion adjacent to the pressure absorption portion. The pressure absorption portion has a thickness changing according to a pressure applied thereto. The circuit-forming board provided by this method provides a high-density circuit board of high quality having reliable electrical connection.
    Type: Grant
    Filed: January 21, 2005
    Date of Patent: December 1, 2009
    Assignee: Panasonic Corporation
    Inventor: Toshihiro Nishii
  • Patent number: 7572500
    Abstract: A conductive portion is formed in a hole formed in a material sheet. A metal foil is placed on a surface of the material sheet to provide a laminated sheet. The laminated sheet is heated and pressed to provide a circuit-forming board. The metal foil includes a pressure absorption portion and a hard portion adjacent to the pressure absorption portion. The pressure absorption portion has a thickness changing according to a pressure applied thereto. The circuit-forming board provided by this method provides a high-density circuit board of high quality having reliable electrical connection.
    Type: Grant
    Filed: August 1, 2007
    Date of Patent: August 11, 2009
    Assignee: Panasonic Corporation
    Inventor: Toshihiro Nishii
  • Publication number: 20090183366
    Abstract: A stable and high quality circuit forming substrate is provided even when the work size is increased in the circuit forming substrate. In a stacking step, prepregs that are B stage substrate materials, are arranged lined with respect to a first metal foil, and stacked on the first metal foil. A C stage substrate material is stacked on the B stage substrate materials. Further, the prepregs, that are two or more B stage substrate materials, are stacked on the C stage substrate material and a second metal foil is stacked thereon.
    Type: Application
    Filed: March 16, 2006
    Publication date: July 23, 2009
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventor: Toshihiro Nishii
  • Patent number: 7356916
    Abstract: A circuit board with reliable electrical connections is provided. An insulated board material, having connections for connecting a layer to another layer, includes a reinforcing member. A thickness of the entire insulated board material is at least equal to and not more than 1.5 times of a thickness of the reinforcing member.
    Type: Grant
    Filed: July 16, 2002
    Date of Patent: April 15, 2008
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Toshihiro Nishii, Yasuharu Fukui, Kiyohide Tatsumi, Yoshihiro Kawakita, Shinji Nakamura, Hideaki Komoda
  • Publication number: 20080073024
    Abstract: A laminated circuit board has electronic components buried therein wherein the laminated circuit board may assure excellent reliability of electrical connections and high mechanical strength even with electronic components mounted in high density. It comprises a substrate on which a land disposed on one main surface thereof is connected and fixed by solder to integrated circuit or the like, and a sheet laminated on the upper surface of the substrate and also provided with a resin fluid filling portion formed by clearance at the outer periphery of integrated circuit or the like, wherein the sheet maintains its shape by woven or non-woven cloth having a hole in which integrated circuit or the like is buried, and the woven or non-woven cloth is impregnated with resin having heat fluidity and is thermally compressed. Thus, the electrical and mechanical connections between the laminated circuit board and electronic component can be enhanced in reliability.
    Type: Application
    Filed: November 20, 2007
    Publication date: March 27, 2008
    Inventors: Junichi Kimura, Toshihiro Nishii, Akio Ochi, Shinji Harada
  • Patent number: 7325300
    Abstract: In a heat and press stage of manufacturing printed wiring boards, a functional surface layer having release property is provided on a surface of a cushion, and a blocking layer is prepared between the functional surface layer and an inner layer having cushion property so that a frequency of use of the cushion can be increased.
    Type: Grant
    Filed: October 11, 2002
    Date of Patent: February 5, 2008
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kiyohide Tatsumi, Toshihiro Nishii, Shinji Nakamura
  • Publication number: 20080017403
    Abstract: A conductive portion is formed in a hole formed in a material sheet. A metal foil is placed on a surface of the material sheet to provide a laminated sheet. The laminated sheet is heated and pressed to provide a circuit-forming board. The metal foil includes a pressure absorption portion and a hard portion adjacent to the pressure absorption portion. The pressure absorption portion has a thickness changing according to a pressure applied thereto. The circuit-forming board provided by this method provides a high-density circuit board of high quality having reliable electrical connection.
    Type: Application
    Filed: August 1, 2007
    Publication date: January 24, 2008
    Inventor: Toshihiro Nishii
  • Patent number: 7317621
    Abstract: A laminated circuit board with electronic components buried therein comprises a substrate on which a land disposed on one main surface thereof is connected and fixed by solder to an integrated circuit (or the like). A sheet is laminated on the upper surface of the substrate. A filling portion by fluid resin is formed by clearance at the outer periphery of the integrated circuit (or the like). The sheet maintains its shape by woven or non-woven cloth having a hole in which the integrated circuit (or the like) is buried. The woven or non-woven cloth is impregnated with resin having heat fluidity and is thermally compressed. Thus, the electrical and mechanical connections between the laminated circuit board and electronic component can be enhanced in reliability.
    Type: Grant
    Filed: November 18, 2004
    Date of Patent: January 8, 2008
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Junichi Kimura, Toshihiro Nishii, Akio Ochi, Shinji Harada
  • Patent number: 7251885
    Abstract: In order to improve the adhesion of a circuit to a circuit forming board, a separation film including a base film and a coating layer formed on the base film is joined to both the sides of the board. When a laser beam is applied to form a throughhole in the board, a unified portion of the board and the separation film is formed around the throughhole. An energy beam is applied to the whole or a part of the surface of a circuit formed at a circuit forming step to transfer a part of the separation film. Thus, a high density board where the circuit strongly adheres to the board can be realized in the manufacturing process of the circuit forming board.
    Type: Grant
    Filed: February 4, 2004
    Date of Patent: August 7, 2007
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventor: Toshihiro Nishii
  • Patent number: 7143772
    Abstract: It is possible to obtain a clean high-quality circuit board by removing affected material and foreign matter produced when a hole is formed. A manufacturing method of the circuit board includes (a) preparing a film-coated board material by bonding a film material as a mask to a board material, (b) forming a hole in the film-coated board material by applying a laser beam thereto, and (c) selectively removing the unnecessary material sticking to the film-coated board material from the film-coated board material by supersonic cleaning without peeling the film material off the board material. Unnecessary material such as foreign matter is produced when the hole is formed, and the unnecessary material sticks to the board material. After removal of such unnecessary material, a conductive material is disposed in the hole, using the film material as a mask, and the film material is later removed from the board material.
    Type: Grant
    Filed: December 12, 2003
    Date of Patent: December 5, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kunio Kishimoto, Toshihiro Nishii, Toshiaki Takenaka, Shinji Nakamura, Akihiro Miura
  • Publication number: 20060242827
    Abstract: A conductive portion is formed in a hole formed in a material sheet. A metal foil is placed on a surface of the material sheet to provide a laminated sheet. The laminated sheet is heated and pressed to provide a circuit-forming board. The metal foil includes a pressure absorption portion and a hard portion adjacent to the pressure absorption portion. The pressure absorption portion has a thickness changing according to a pressure applied thereto. The circuit-forming board provided by this method provides a high-density circuit board of high quality having reliable electrical connection.
    Type: Application
    Filed: January 21, 2005
    Publication date: November 2, 2006
    Inventor: Toshihiro Nishii
  • Publication number: 20060210780
    Abstract: A method of manufacturing a circuit board comprising: an inner layer board laminating step for laminating inner layer board material and one or more metal sheet(s) for inner layer; an inner layer circuit forming step for forming circuits of the metal sheet to make an inner layer circuit board; a multi-layer laminating step for laminating one or more metal sheet(s) for multi-layer, one or more multi-layer board material(s) and one or more inner layer circuit board(s); and a multi-layer circuit forming step for forming circuits of the metal sheet for the multi-layer, wherein the inner layer board material and the multi-layer board material are different in material composition from each other. According to the present invention, it is possible to stabilize the quality of interstitial connection of the inner layer circuit board and to improve the mechanical strength such as the adhesive strength of an outer layer circuit.
    Type: Application
    Filed: May 17, 2006
    Publication date: September 21, 2006
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventor: Toshihiro Nishii
  • Patent number: 7105277
    Abstract: The present invention aims to provide a printing plate capable of preventing paste of high viscosity adhering to an edge of a squeegee from being transferred to and left on a through hole of a printed circuit board when the paste is being filled by a squeegeeing method. The printing plate has a metal sheet (3) provided with a squeegee cleaning section (7) formed thereon and fixed to the back surface of a slanting area (5) of mask (2) attached to a plate framework (1). The through hole of the printed circuit board is filled with paste only after paste of high viscosity adhering to the edge of the squeegee is removed by the squeegee cleaning section (7), to prevent the paste from being left on the through hole, and thereby achieving the printed circuit board of excellent quality.
    Type: Grant
    Filed: September 19, 2003
    Date of Patent: September 12, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Toshiaki Takenaka, Toshihiro Nishii, Hideaki Komoda, Toshikazu Kondo, Shinji Nakamura