Patents by Inventor Toshihiro Okiyama

Toshihiro Okiyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Brittle material cleavage-cutting apparatus
    Patent number: 5254833
    Abstract: The brittle material cleavage-cutting apparatus of the present invention comprises a placing stand for holding a brittle material and beam scanning device for deflecting a laser beam from a laser source so that a brittle material placed on the placing stand is scanned along a planned cleavage-cutting line. By the beam scanning device, the laser-beam irradiation position on the brittle material is repeatedly moved in short cycles along the planned cleavage-cutting line.
    Type: Grant
    Filed: August 27, 1992
    Date of Patent: October 19, 1993
    Assignee: Soei Tsusho Company, Ltd.
    Inventor: Toshihiro Okiyama