Abstract: A light-emitting chip mounted on a leadframe has a light-emitting surface substantially orthogonal to an optical grating surface of a scale and in a direction of an optical grating. A transparent resin is molded so that it seals both the light-emitting chip and the leadframe. A first optical element reflects the light from the light-emitting chip substantially parallel to the optical grating surface and in a direction orthogonal to the direction of the optical grating. A second optical element reflects the parallel light from the first optical element and illuminates the optical grating over a specified area in the direction of the optical grating as the reflected parallel light is converged toward the optical grating.

Abstract: A scale and index scale are respectively provided with a sliding rail and sliding film. The sliding rail and sliding film are formed by means of compound plating in which a self lubricating substance such as PTFE resin powder is dispersed.

Abstract: A scale and index scale are respectively provided with a sliding rail and sliding film. The sliding rail and sliding film are formed by means of compound plating in which a self lubricating substance such as PTFE resin powder is dispersed.

Abstract: A light-emitting chip mounted on a leadframe has a light-emitting surface substantially orthogonal to an optical grating surface of a scale and in a direction of an optical grating. A transparent resin is molded so that it seals both the light-emitting chip and the leadframe. A first optical element reflects the light from the light-emitting chip substantially parallel to the optical grating surface and in a direction orthogonal to the direction of the optical grating. A second optical element reflects the parallel light from the first optical element and illuminates the optical grating over a specified area in the direction of the optical grating as the reflected parallel light is converged toward the optical grating.

Abstract: An optical encoder includes a reflective scale 1 and a sensor head 2. The sensor head 2 comprises a lead frame 21; and LED chip 22 mounted on the lead frame 21 and having a light-emitting surface directing upward for irradiating the scale 1; a photosensitive device chip 23 mounted on the lead frame 21 and having a photosensitive surface directing downward for receiving a reflected light from the scale 1; and a transparent resin body 24 molded for sealing the LED chip 22 and the photosensitive device chip 23 therein. A convex 25 is formed on a surface, which faces on the light-emitting surface of the LED chip 22, of the transparent resin body 24. A reflective film 26 is formed over the convex 25.

Abstract: In an optical encoder having a reflection-type scale and a sensor head 1, the sensor head 1 is formed of a resin-molded block 10. The block 10 has a hole 15 opened to be opposed to the scale, and interconnection lines. In the hole 15, a light emitting device 20 is buried so as to irradiate the scale. A device substrate 30, on which a light receiving IC chip 32 is mounted for receiving the reflected light from the scale, is attached to the front surface of the block 10. The interconnection lines 12, to which the light emitting device 20 and the IC chip 32 are connected, are led to external circuits through an FPC substrate 40.

Abstract: An optical encoder is disclosed, that comprises a main scale 1, a light radiating means 2, and a second member 3. The main scale 1 is a first member having an optical grating 12. The light radiating means 2 radiates collimated light to the main scale 1. The second member 3 detects variations of bright images and dark images corresponding to the relative movement between the main scale 1 and the second member 3. The second member 3 comprises a glass substrate 4 and a light receiving IC chip 5. The glass substrate 4 has thin film electrodes. The light receiving IC chip 5 has a light receiving device array 51 that is in common with an index grating, is disposed on a reverse surface of the glass substrate through solder bumps 54 by face-down bonding method. A transparent resin for sealing the front surface of the light receiving IC chip is filled in a gap between the IC chip 5 and the glass substrate 4.

Abstract: A photoelectric type displacement detecting instrument comprising: a main optical lattice formed on a first member; an auxiliary optical lattice formed on a second member; a light emitter for emitting detecting light to the both optical lattices in a direction from the outer side of the second member to the first member; a light receiver opposed to the light emitter, interposing therebetween the both optical lattices, for receiving the detecting light transmitted through the both optical lattices, transducing changes in the value of the received light through the repeat of overlappings due to relative movements between the both optical lattices into electric signals; and an electronic circuit for calculating a relative moving distance between the main optical lattice and the auxiliary optical lattice on the basis of the electric signals.