Abstract: A machine tool includes a trough which collects chips; a mobile unit which is located above the trough and moves in the longitudinal direction of the trough on a bed, is configured from a first beam member, a second beam member, and a connecting member connecting the first beam member and the second beam member, and is formed with a hollow that opens toward the trough from above; a first guide which supports the mobile unit in such a manner that the mobile unit is movable in the longitudinal direction of the trough; a second guide which faces the first guide across the trough, and supports the mobile unit in such a manner that the mobile unit is movable in the longitudinal direction of the trough; and a cradle, both ends of which are supported by the first beam member and the second beam member.

Abstract: A semiconductor memory device includes a first plane including a memory cell array, a second plane including a memory cell array, a control circuit configured to control operations performed on the first and second planes separately and independently, and first register for storing a condition value related to a condition of an operation to be performed on a plane. When a first command to store a first condition value in a first address of the first register is received, the control circuit specifies a plane to which the first address has been allocated. When the first plane is specified by the first address, the control circuit determines whether the first plane is in a command receivable state. Then, when the control circuit determines that the first plane is in the command receivable state, the control circuit stores the first condition value in the first address of the first register.

Abstract: An information processor including a memory; and a processor coupled to the memory and method thereof. The processor is configured to store first identification information of a first source file corresponding to an object file that is not linked, judge whether second identification information of a second source file specified as a target of compilation is stored in the memory, and generate an object file through compilation on a third source file where the second identification information of the second source file is stored in the memory. The processor is also configured to perform inter-file optimization on the second source file and the third source file to generate a plurality of intermediate files and generate a plurality of object files through compilation on the plurality of generated intermediate files.

Abstract: A semiconductor memory device includes a substrate that has a first main surface and a second main surface opposite to the first main surface, a first semiconductor chip which is mounted on the first main surface and includes a first register, a plurality of first input/output (IO) terminals, and a first circuit connected between the first IO terminals and the first register, and a second semiconductor chip which is mounted on the second main surface and includes a second register, a plurality of second input/output (IO) terminals, and a second circuit connected between the second IO terminals and the second register. The second circuit is connected to the second IO terminals through input lines and to the second register through output lines, and is configured to change a connection path between the input lines and the output lines in response to a connection change command.

Abstract: A touch panel of the present invention includes a touch panel substrate, a cover substrate provided to overlap the touch panel, and a connection part including a scattering layer laminated from the cover substrate side toward the touch panel substrate side and is provided between the touch panel substrate and the cover substrate in an area other than a display area.

Abstract: An upright machining center is characterized in being provided with: x-axis guides for moving and guiding a table in the left-right direction on a bed; a column provided on the bed and provided with an opening that straddles the x-axis guides in the front-back direction so that a moving body, on which the table is provided, can enter therein in the left-right direction; a saddle, which is disposed on the upper part of the column so as to be movable in the front-back direction and for which a first y-axis guide that extends in the front-back direction on the right side of the left-right direction and a left second y-axis guide that is located lower and parallel thereto are provided; and a main shaft head, which is disposed on the left side surface of the saddle and moves in the vertical direction.

Abstract: A semiconductor memory device includes a substrate that has a first main surface and a second main surface opposite to the first main surface, a first semiconductor chip which is mounted on the first main surface and includes a first register, a plurality of first input/output (IO) terminals, and a first circuit connected between the first IO terminals and the first register, and a second semiconductor chip which is mounted on the second main surface and includes a second register, a plurality of second input/output (IO) terminals, and a second circuit connected between the second IO terminals and the second register. The second circuit is connected to the second IO terminals through input lines and to the second register through output lines, and is configured to change a connection path between the input lines and the output lines in response to a connection change command.

Abstract: A shock absorbing structure of a vehicle door including a vehicle body panel with a service hole includes a door trim and a shock absorber. The door trim covers the vehicle body panel from an interior side of a vehicle. The shock absorber is mounted to the vehicle body panel to cover the service hole. The shock absorber includes a shock absorbing portion that is inserted in the service hole. The shock absorbing portion is disposed such that an end of the shock absorbing portion on an exterior side of the vehicle is disposed more to the exterior side of the vehicle than the service hole and between the vehicle body panel and the door trim.

Abstract: Disclosed is a method for adjusting a dispersion diameter to control the dispersion diameter of a dispersed phase in a thermoplastic resin composition having a multiphase structure, and a thermoplastic resin composition obtained by the method. The method includes mixing a polyolefin resin, a polyamide resin, and a compatibilizer and has a continuous phase composed of the polyolefin resin and a dispersed phase dispersed in the continuous phase and composed of the polyamide resin where the compatibilizer is a polymer having a reactive group that reacts with the polyamide resin, and that an amount of the polymer to be mixed based on a total of the polyolefin resin and the polyamide resin is varied to adjust a dispersion diameter of the dispersed phase. This composition has 50 or more but 450 or less the dispersed phase per 10 micrometers square.

Abstract: A thermoplastic resin composition, a method for manufacturing the same, and a molded body are provided. The composition includes a polyolefin resin PO, a polyimide resin PA, and a compatibilizer. The composition has a first phase composed of the PA and compatibilizer and/or a reaction product thereof and a second phase composed of the PO and interposed between the first phases. The first phase has a matrix phase composed of the PA and a dispersed phase dispersed in the matrix phase and composed of the compatibilizer and/or a reaction product thereof. The first phase includes a branched phase having branch portions. The method includes melt-kneading the PA and compatibilizer so that a mixing ratio of the compatibilizer is 11% by mass or more but 45% by mass or less per 100% by mass of a total of the PO, PA, and compatibilizer, and melt-kneading an obtained composition and the PO.

Abstract: A semiconductor memory device includes a substrate that has a first main surface and a second main surface opposite to the first main surface, a first semiconductor chip which is mounted on the first main surface and includes a first register, a plurality of first input/output (IO) terminals, and a first circuit connected between the first IO terminals and the first register, and a second semiconductor chip which is mounted on the second main surface and includes a second register, a plurality of second input/output (IO) terminals, and a second circuit connected between the second IO terminals and the second register. The second circuit is connected to the second IO terminals through input lines and to the second register through output lines, and is configured to change a connection path between the input lines and the output lines in response to a connection change command.

Abstract: Disclosed herein are a foamed resin molded body that has excellent impact resistance and rigidity and that is hardly fractured even when subjected to high impact, and a method for manufacturing the same. The foamed resin molded body is made of an olefin-based resin composition containing an olefin resin and a polyamide resin, the olefin-based resin composition has a continuous phase containing the olefin resin and a dispersed phase dispersed in the continuous phase and containing the polyamide resin, and the dispersed phase contains a melt-kneaded product of the polyamide resin and an elastomer having a reactive group that reacts with the polyamide resin.

Abstract: An information storage unit stores a refrigeration apparatus in association with operation condition information about operation conditions of the refrigeration apparatus, and an information terminal of a user or an information terminal of a shop, the user or the shop being in charge of a regular inspection of the refrigeration apparatus. An information processing unit generates regular inspection information to be used for the regular inspection of the refrigeration apparatus based on the operation condition information associated with the refrigeration apparatus in the information storage unit, the regular inspection information including items related to the operation conditions of the refrigeration apparatus, and sends the regular inspection information to the user's information terminal or the shop's information terminal which is associated with the refrigeration apparatus in the information storage unit.

Abstract: Disclosed herein are a molded body having a continuous phase (A) containing a first polyolefin resin and a second polyolefin resin and a dispersed phase (B) containing a polyamide resin and a modified elastomer, wherein the dispersed phase (B) is composed of a melt-kneaded product of the polyamide resin and the modified elastomer, and wherein when a total of the continuous phase (A) and the dispersed phase (B) is 100% by mass, a content of the dispersed phase (B) is 70% by mass or less, and when a total of the first polyolefin resin and the second polyolefin resin is 100% by mass, a content of the second polyolefin resin is 70% by mass or less, and a method including the steps of: obtaining a molded body raw material by mixing a first polyolefin resin and an impact-resistant resin obtained by melt-kneading a second polyolefin resin and a melt-kneaded product of a polyamide resin and a modified elastomer; and obtaining a molded body.

Abstract: Disclosed herein are a modifier having a continuous phase (A) containing a second polyolefin resin and a dispersed phase (B) containing a polyamide resin and a modified elastomer, wherein the dispersed phase (B) is composed of a melt-kneaded product of the polyamide resin and the modified elastomer having a reactive group, and wherein when a total of the continuous phase (A) and the dispersed phase (B) is 100% by mass, a content of the dispersed phase (B) is 80% by mass or less, a method for using the modifier, including mixing 0.5 parts by mass or more but 70 parts by mass or less of the modifier per 100 parts by mass of a first polyolefin resin, and a method for producing the modifier, including the step of melt-kneading the second polyolefin resin and a melt-kneaded product of the polyamide resin and the modified elastomer.

Abstract: An upright machining center is characterized in being provided with: x-axis guides for moving and guiding a table in the left-right direction on a bed; a column provided on the bed and provided with an opening that straddles the x-axis guides in the front-back direction so that a moving body, on which the table is provided, can enter therein in the left-right direction; a saddle, which is disposed on the upper part of the column so as to be movable in the front-back direction and for which a first y-axis guide that extends in the front-back direction on the right side of the left-right direction and a left second y-axis guide that is located lower and parallel thereto are provided; and a main shaft head, which is disposed on the left side surface of the saddle and moves in the vertical direction.

Abstract: A machine tool includes a trough which collects chips; a mobile unit which is located above the trough and moves in the longitudinal direction of the trough on a bed, is configured from a first beam member, a second beam member, and a connecting member connecting the first beam member and the second beam member, and is formed with a hollow that opens toward the trough from above; a first guide which supports the mobile unit in such a manner that the mobile unit is movable in the longitudinal direction of the trough; a second guide which faces the first guide across the trough, and supports the mobile unit in such a manner that the mobile unit is movable in the longitudinal direction of the trough; and a cradle, both ends of which are supported by the first beam member and the second beam member.

Abstract: A shock absorbing structure of a vehicle door including a vehicle body panel with a service hole includes a door trim and a shock absorber. The door trim covers the vehicle body panel from an interior side of a vehicle. The shock absorber is mounted to the vehicle body panel to cover the service hole. The shock absorber includes a shock absorbing portion that is inserted in the service hole. The shock absorbing portion is disposed such that an end of the shock absorbing portion on an exterior side of the vehicle is disposed more to the exterior side of the vehicle than the service hole and between the vehicle body panel and the door trim.

Abstract: A work machine includes: a bed having a table positioned on the upper surface thereof; sidewalls positioned to the left and right of the bed and projecting to the rear of the rear surface of the bed; support members for each supporting the bed in relation to a floor surface by using two points on the sidewalls to the left and right of the bed, and using at least one other point; a vertically moving body for moving along a pair of left and right vertical guides positioned in the vertical direction down to the vicinity of the floor surface on the rear surface of the bed; and a vertical drive means for moving the vertically moving body as one of the abovementioned relative movements, and having a pair of left and right feed screws positioned in parallel with the vertical guides.

Abstract: A parallel computing apparatus includes a first processor that executes a first thread, a second processor that executes a second thread, and a memory. The memory includes a first private area that corresponds to the first thread, a second private area that corresponds to the second thread, and a shared area. The first processor stores first data in the first private area and stores address information that enables access to the first data in the shared area. The second processor stores second data in the second private area, accesses the first data based on the address information, and generates third data based on the first and second data.