Abstract: This application discloses the structure of an ESC stage where a chucking electrode is sandwiched by a moderation layer and a covering layer. The moderation layer and the covering layer have the thermal expansion coefficients between the dielectric plate and the chucking electrode. This application also discloses the structure of an ESC stage where a chucking electrode is sandwiched by a moderation layer and a covering layer, which have internal stress directed oppositely to that of the chucking electrode. This application further discloses a substrate processing apparatus for carrying out a process onto a substrate as the substrate is maintained at a temperature higher than room temperature, comprising the electrostatic chucking stage for holding the substrate during the process.

Abstract: A heater plate and a support structure are provided in a chamber. First terminals are arranged on the reverse side of the heater plate. The support structure is provided with second terminals in positions opposite to the first terminals, individually. The first and second terminals are coupled mechanically and electrically to one another by means of springy joint members of an electrically-conductive material. The joint members are removably attached to the first and second terminals. The heater plate can be separated from the support structure by disengaging the joint members from the first or second terminals.

Abstract: A heater plate and a support structure are provided in a chamber. First terminals are arranged on the reverse side of the heater plate. The support structure is provided with second terminals in positions opposite to the first terminals, individually. The first and second terminals are coupled mechanically and electrically to one another by means of springy joint members of an electrically-conductive material. The joint members are removably attached to the first and second terminals. The heater plate can be separated from the support structure by disengaging the joint members from the first or second terminals.

Abstract: A ceramic cover plate is placed on the surface of a heater typically consisting of a ceramic heater used in a CVD device so as to cover the entire heating surface of the heater, and a silicon wafer 2 is placed on a recessed supporting surface 2a defined by the surface of the cover plate 2. The surface of the ceramic heater is therefore protected by the cover made of a ceramic plate, and the surface of the ceramic heater is prevented from being directly exposed to the gas such as the cleaning gas. Because the corrosion caused by the cleaning gas is limited to the cover, the ceramic heater can be renewed simply by replacing the cover. This substantially reduces the cost for the maintenance work.

Abstract: A coil spring device comprises a coil spring formed of a spiral wire having a first end and a second end, a first end support mechanism supporting the first end of the wire, and a second end support mechanism supporting the second end of the wire. The paired support mechanisms are movable relatively to each other in the axial direction of the coil spring. The first support mechanism supports the first end of the wire for rotation only around a first diametrical axis which extends toward a coil central axis. The second support mechanism supports the second end of the wire for rotation only around a second diametrical axis which extends toward the central axis.