Abstract: An electronic component includes a component body, a metal terminal, and a bonding material. The component body includes an element body and an external electrode. The metal terminal includes a first main surface and a second main surface, and a side surface. The bonding material electrically and physically connects the external electrode and the metal terminal. The metal terminal includes a first metal layer including the first main surface, a second metal layer including the second main surface, and a terminal body including the side surface. The terminal body is exposed at the side surface, and the first metal layer and the second metal layer are separated from each other on the side surface. Each of the first metal layer and the second metal layer includes a Ni plated layer. The terminal body includes Cu. The bonding material includes solder.

Abstract: A ceramic electronic device comprises an element body including a ceramic layer and an internal electrode layer, and an external electrode electrically connected to at least one end of the internal electrode layer. The element body includes an interface part at least at a part of a boundary between the external electrode and the ceramic layer. The interface part includes an oxide containing aluminium and an oxide containing boron.

Abstract: A damping device for a tower-like structure, includes a liquid column tube having an arbitrary shape and a pair of opposite upstanding end portions thereof where liquid levels are formed, and an orifice provided at an intermediate portion within the liquid column tube, the liquid column tube being mounted upon the tower-like structure. The damping property of the damping device can be quantitatively defined by employing the orifice. Furthermore, as the intermediate portion of the liquid column tube defined between the opposite upstanding end portions can be appropriately configured, the installation space for the damping device is optimized.