Patents by Inventor Toshihiro Teshiba

Toshihiro Teshiba has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polyimide film for molding, its manufacturing method and molding product
    Patent number: 8168744
    Abstract: To provide a polyimide film for molding that is light and has excellent surface smoothness, safety, moldability, heat resistance, and handleability and thus can be used as the reflector base material for illuminating devices. The polyimide film for molding is made of a thermoplastic polyimide obtained from a reaction between an aromatic tetracarboxylic acid or its dianhydride and an aromatic diamine. The lowest viscoelasticity of storage elasticity (E?) of viscoelasticity is 108 Pa or lower, and the tensile elongation at glass transition temperature (E?) A is 150% or higher.
    Type: Grant
    Filed: February 9, 2009
    Date of Patent: May 1, 2012
    Assignee: E. I. du Pont de Nemours and Company
    Inventor: Toshihiro Teshiba
  • POLYIMIDE FILM FOR MOLDING, ITS MANUFACTURING METHOD AND MOLDING PRODUCT
    Publication number: 20090209725
    Abstract: To provide a polyimide film for molding that is light and has excellent surface smoothness, safety, moldability, heat resistance, and handleability and thus can be used as the reflector base material for illuminating devices. The polyimide film for molding is made of a thermoplastic polyimide obtained from a reaction between an aromatic tetracarboxylic acid or its dianhydride and an aromatic diamine. The lowest viscoelasticity of storage elasticity (E?) of viscoelasticity is 108 Pa or lower, and the tensile elongation at glass transition temperature (E?) A is 150% or higher.
    Type: Application
    Filed: February 9, 2009
    Publication date: August 20, 2009
    Applicant: E.I. DU PONT DE NEMOURS AND COMPANY
    Inventor: TOSHIHIRO TESHIBA
  • Semiconductor device-encapsulating epoxy resin composition
    Patent number: 5567749
    Abstract: A semiconductor-encapsulating composition comprised of (i) an epoxy resin preferably containing a bifunctional biphenyl-skeletal epoxy resin and/or a bifunctional naphthalene-skeletal epoxy resin, (ii) a curing agent containing 4,4'-dihydroxybiphenyl, and (iii) 70 to 95% by weight, based on the total epoxy resin composition, of a filler.
    Type: Grant
    Filed: October 25, 1994
    Date of Patent: October 22, 1996
    Assignee: Toray Industries, Inc.
    Inventors: Yasushi Sawamura, Toshihiro Teshiba, Masayuki Tanaka
  • Semiconductor device-encapsulating epoxy resin composition
    Patent number: 5360837
    Abstract: Disclosed is a semiconductor device-encapsulating epoxy resin composition comprising (i) an epoxy resin (A) containing at least one of a bifunctional epoxy resin (a1) having a biphenyl skeleton and a bifunctional epoxy resin (a2) having a naphthalene skeleton, (ii) a curing agent (B), and (iii) a filler containing fused silica (C) having a specified kind and specified mean particle diameter. This composition has an excellent heat resistance of solder, and further reliability after thermal cycles and reliability after solder-bath dipping.
    Type: Grant
    Filed: December 11, 1992
    Date of Patent: November 1, 1994
    Assignee: Toray Industries, Inc.
    Inventors: Shiro Honda, Yasushi Sawamura, Masayuki Tanaka, Keiji Kayaba, Toshihiro Teshiba