Abstract: A control device for controlling the running behavior of a four wheeled vehicle has a mathematical tire model of each wheel defining a relationship between longitudinal and lateral forces vs. slip ratio, synthesizes the mathematical tire model at zero slip and a control input from an outside running behavior controller such as a spin controller or a driftout controller to generate nominal values of longitudinal force, lateral force and yaw moment of the vehicle body, and controls the slip ratio of the wheels through cyclic adjustment so as to approach the differences between the nominal values and the actual values in the longitudinal force, lateral force and yaw moment of the vehicle body to the corresponding differences of those parameters due to differentiation thereof by the slip ratio based upon the mathematical tire model.

Abstract: A control device for controlling the running behavior of a four wheeled vehicle has a mathematical tire model of each wheel defining a relationship between longitudinal and lateral forces vs. slip ratio, synthesizes the mathematical tire model at zero slip and a control input from an outside running behavior controller such as a spin controller or a driftout controller to generate nominal values of longitudinal force, lateral force and yaw moment of the vehicle body, and controls the slip ratio of the wheels through cyclic adjustment so as to approach the differences between the nominal values and the actual values in the longitudinal force, lateral force and yaw moment of the vehicle body to the corresponding differences of those parameters due to differentiation thereof by the slip ratio based upon the mathematical tire model.

Abstract: A semiconductor circuit device includes a multi-layered substrate comprising a plurality of signal lines sandwiched between a power source line and a ground line, with insulation layers formed therebetween to reduce fluctuation of a ground line potential at the time of simultaneous switching of the signal lines and to increase the operational speed. The signal lines provides bidirectional current paths and is disposed between the current source line and the ground line. The multi-layered substrate is formed around a semiconductor pellet. Electrode pads are formed on the insulation layer over the ground line on the same level as the signal lines and generally on the same level as the main surface of the semiconductor pellet where electrodes pads are formed. Bonding wires are used to electrically connect the electrode pads on the pellet and the electrodes formed on the insulation layer.