Abstract: The present invention provides a wafer polishing method and a polishing apparatus which are capable of preventing peripheral sags of a wafer due to polishing and then manufacturing the wafer, especially an SOI wafer at a high flatness level. There is provided a wafer polishing method using a polishing apparatus which comprises a rotatable table having a polishing cloth adhered thereon and a polishing head equipped with a wafer holding plate opposing to the table and in which the back surface of the wafer is held by a holding surface of the wafer holding plate and the front surface of the wafer is pressed to and polished by the polishing pad, comprising a polishing step of polishing the front surface of the wafer to a predetermined total polishing stock removal without changing the polishing apparatus, wherein the polishing step is divided into plural sub-steps and a holding position of the wafer in a subsequent sub-step is different from a holding position of the wafer in a previous sub-step.

Abstract: The present invention provides a wafer polishing method and a polishing apparatus which are capable of preventing peripheral sags of a wafer due to polishing and then manufacturing the wafer, especially an SOI wafer at a high flatness level. There is provided a wafer polishing method using a polishing apparatus which comprises a rotatable table having a polishing cloth adhered thereon and a polishing head equipped with a wafer holding plate opposing to the table and in which the back surface of the wafer is held by a holding surface of the wafer holding plate and the front surface of the wafer is pressed to and polished by the polishing pad, comprising a polishing step of polishing the front surface of the wafer to a predetermined total polishing stock removal without changing the polishing apparatus, wherein the polishing step is divided into plural sub-steps and a holding position of the wafer in a subsequent sub-step is different from a holding position of the wafer in a previous sub-step.

Abstract: Framework, defining a predetermined curing area, corresponds in size and shape to a provisionally-assembled watercraft body to be subjected to adhesive curing. Openable/closeable gate, constituting one end portion of the framework, allows the provisionally-assembled watercraft body to be carried therethrough into the curing area. Positioning mechanism positions the carried provisionally-assembled watercraft body in the curing area. Warm air blowing mechanism includes a plurality of nozzles provided at predetermined intervals on and along upper horizontal portions of the framework and gate and at a level slightly higher than peripheral edges of a hull and deck of the watercraft body to be joined by adhesive, which blow warm air downward onto the peripheral edges of the watercraft body.

Abstract: An adhesive applying apparatus is used in joining together a hull and a deck with an adhesive. The apparatus includes an adhesive applying gun for ejecting an adhesive, and a guide means attached to the gun. The guide means guides the gun in such a manner that the gun moves along an upper edge portion of the hull.

Abstract: Framework, defining a predetermined curing area, corresponds in size and shape to a provisionally-assembled watercraft body to be subjected to adhesive curing. Openable/closeable gate, constituting one end portion of the framework, allows the provisionally-assembled watercraft body to be carried therethrough into the curing area. Positioning mechanism positions the carried provisionally-assembled watercraft body in the curing area. Warm wind blowing mechanism includes a plurality of nozzles provided at predetermined intervals on and along upper horizontal portions of the framework and gate and at a level slightly higher than peripheral edges of a hull and deck of the watercraft body to be joined by adhesive, which blow warm wind downward onto the peripheral edges of the watercraft body.

Abstract: An adhesive applying apparatus is used in joining together a hull and a deck with an adhesive. The apparatus includes an adhesive applying gun for ejecting an adhesive, and a guide means attached to the gun. The guide means guides the gun in such a manner that the gun moves along an upper edge portion of the hull.

Abstract: A hanging-down jig is provided for supporting a vehicle body frame for a motorcycle in a hung-down manner on a hanger of an overhead conveyor. A dummy frame is mounted on the vehicle body frame for the motorcycle for supporting the vehicle body frame in a hang-down manner on a support arm of the hanger of the overhead conveyor. The dummy frame includes a center member coupled to the vehicle body frame by a pin, and a pair of left and right side members coupled to the vehicle body frame by a pin. The angle of, the longitudinal positions of and the lateral distance between the side members with respect to the center member can be adjusted as desired. The longitudinal and vertical positions of a support portion provided on the support arm of the hanger and engaged with a hanging-down member of the dummy frame can be adjusted as desired.

Abstract: A method for chamfer mirror-like polishing a wafer having an orientation flat by rotating the wafer in a state of being pressed by a rotating buffering wheel with a predetermined pressure, is disclosed. Mirror-surface polishing a stable wafer chamfer can be obtained with a relatively simple control system. The invention is predicated in the fact that the wafer rotation speed Ns has low inertial mass and low rotation speed so that the wafer rotation speed control can be obtained with high response property and high accuracy compared to pressing pressure control and buffering wheel control, and it features detecting intrinsic peripheral part, corners and orientation flat part of wafer according to a detection signal of detection means for detecting the wafer mirror-like polishing position and controlling the wafer rotation speed Ns according to the detected wafer mirror-like polishing position.

Abstract: A method for chamfer mirror-like polishing a wafer having an orientation flat by rotating the wafer in a state of being pressed by a rotating buffering wheel with a predetermined pressure, is disclosed. Mirror-surface polishing a stable wafer chamfer can be obtained with a relatively simple control system. The invention is predicated in the fact that the wafer rotation speed N.sub.s has low inertial mass and low rotation speed so that the wafer rotation speed control can be obtained with high response property and high accuracy compared to pressing pressure control and buffering wheel control, and it features detecting intrinsic peripheral part, corners and orientation flat part of wafer according to a detection signal of detection means for detecting the wafer mirror-like polishing position and controlling the wafer rotation speed N.sub.s according to the detected wafer mirror-like polishing position.

Abstract: A method and an apparatus, for polishing a thin plate. The method comprises the steps of: rotating a holding plate on one surface of which the thin plate is held to adhere; and bringing the thin plate held on the rotating holding plate into contact with a polishing pad mounted on a surface of a rotating turn table, to polish the thin plate. The step of polishing the one surface of the holding plate is carried out by using the polishing pad for polishing the thin plate before the thin plate is held to adhere on the one surface of the holding plate.

Abstract: A polishing apparatus of a peripheral chamfered portion of a semiconductor wafer is disclosed. The polishing apparatus comprises: a rotary drum around the periphery of which a tape having an abrasive layer thereon is wound; a first motor for rotating the rotary drum; a wafer holding mechanism which comprises a wafer holding member for holding a wafer, a second motor for rotating the wafer holding member, a supporting member for supporting the wafer holding member and the second motor, and a wafer inclining member for changing the tilt angle of the wafer with respect to the rotary drum by reciprocally rotating the supporting member on a first axis which is substantially parallel with the main surface of the wafer; and a moving member for bringing the wafer held on the supporting member into contact with or separating it from the tape wound around the rotary drum.

Abstract: The invention seeks to provide a method of producing slices, such as semiconductor wafers, from a rod-like ingot, which does not require any cutting margin for slicing so that less material is consumed, and also is free from warping or denatured layer of the slices, as well as being free from operating environment deterioration with high quality. A cylindrical ingot is obtained by cutting or grinding the outer periphery of a rod-like ingot, and it is then formed with a plurality of annular grooves at a predetermined pitch in its longitudinal direction to obtain a cylindrical work with annular grooves. The work is then severed in the section defined by the bottom of each annular groove by generating a stress in excess of the rupture strength of the slice in the groove.After the heating of the cylindrical work with annular grooves, the under-process end face of the work is suitably cooled quickly by cooling water jet from a jet nozzle from the outer periphery toward the center of the work.

Abstract: A polishing system for polishing a wafer or the like, comprises: a vacuum system comprising a vacuum pump and a vacuum passage connected thereto; a fluid supply system comprising a fluid source and a fluid passage connected thereto; a polishing head comprising a holding member for holding the wafer or the like on the lower surface thereof which has at least one through hole in communication with the vacuum passage and the fluid passage; and a polishing member. Polishing of the wafer or the like is performed by pressing the wafer or the like held on the lower surface of the holding member, against the polishing member while providing relative motion between the holding member and the polishing member and supplying an abrasive slurry to the polishing member. Separation of the wafer or the like from the polishing head is performed by injecting a fluid from the fluid supply system to the object through the through hole of the holding member.

Abstract: The invention concerns a process of polishing wafers, in which a silicon wafer held on a wafer support plate rotatable under a predetermined applied pressure, is polished by mechanochemical polishing in a plurality of polishing steps with an abrasive material interposed between the wafer and a polishing pad cloth applied to a polishing surface plate moved relative to the wafer support plate at a predetermined relative speed. Quality comparable to that of wafers obtainable by a prior art three-step polishing process can be obtained with a two-step wafer polishing step comprising a primary polishing step and a final polishing step. The primary polishing step is performed by setting a high polishing pressure of 300 to 700 g/cm.sup.2 and a reference relative speed of 50 to 150 m/min., and quick increase of the relative speed to 2 to 4 times and quick reduction of the polishing pressure down to 1/2 to 1/10 are caused in a final stage of the primary polishing step.

Abstract: A device for raising aquarium fish is a combination of a water tank and a receptacle assembly. The water tank has an upper opening, a lid for closing the upper opening and provided with an illumination mechanism and a filtration mechanism, and a fastening portion. The receptacle assembly is for supplying electricity to the illumination and filtration mechanisms and has a fastened portion for engagement with the fastening portion of the water tank.

Abstract: A device for raising aquarium fish is a combination of a water tank and a receptacle assembly (4). The water tank has an upper opening, a lid for closing the upper opening and provided with an illumination mechanism and a filtration mechanism (3), and a fastening portion at notch (3c). The receptacle assembly is for supplying electricity to the illumination and filtration mechanisms and has a fastened portion for engagement with the fastening portion of the water tank.

Abstract: An illuminator for an aquarium tank including a tank body and a lid member mounted on the tank body is accommodated in the lid member. The illuminator includes a base plate, a light source attached to the base plate, a translucent cover for covering the light source and protecting it from waterdrops. The cover is provided with a plurality of fastened members and a plurality of resilient fastening members are provided on the base plate for detachably engaging the fastened members.

Abstract: A hinge device is used in an aquarium tank including a tank body and a lid member mounted on the tank body and having a front lid pivotably attached thereto. The hinge device includes bottomed holes formed in the opposite side surfaces of the lid member, a pair of pin members each including an abutment portion, a shaft portion and a resilient portion between the abutment portion and the shaft portion, and bearing holes formed on opposite side walls of the front lid. The front lid is pivotably attached to the lid member, with the abutment portion abutted against the bottom of the bottomed hole and the shaft portion thrust into the bearing hole by the resilient force of the resilient portion.

Abstract: The present invention relates to an applicator for applying a liquid such as floor wax. When an operator adjusts a handle-mounted valve, drops of wax fall down from tube-shaped nozzles arranged in an equidistant relationship on the base of the applicator. The wax is supplied from a bag-shaped container mounted on an intermediate portion of the handle and flows down to the nozzles via filters, an adjusting valve, a distributing chamber and discharge passages. When the applicator is not in use, it is placed on a tray which keeps the base moist with a cloth tightly stretched on the base of the applicator. Steam fills the space between the cloth and the base to prevent solidification of the wax.