Abstract: A semiconductor device can include: a semiconductor chip including a first and second surface, a first electrode on the first surface, an active area on the second surface, a second electrode on the second surface, and a third electrode on the second surface; a first conductive member in the active area of the semiconductor chip and electrically connected to the semiconductor chip; a second conductive member in a second area and isolated from the first conductive member, the second area an area in which, when viewed from above, with respect to a first area of the active area in which the first conductive member is not provided, circles sharing centers of shortest distances between an outer periphery of the first conductive member and an outer periphery of the active area can be drawn largest in the first area; and a lead terminal connected to the first conductive member.

Abstract: According to one embodiment, a simulation apparatus is disclosed. The simulation apparatus includes a storage device storing data relating to a thermal equivalent circuit of a semiconductor device. The simulation apparatus further includes an estimation device estimating a time-dependent change in thermal characteristics of the semiconductor device by using the data. The thermal equivalent circuit includes a first thermal equivalent circuit corresponding to a lower-surface-side part of the semiconductor device. The thermal equivalent circuit further includes a second thermal equivalent circuit connected to the first thermal equivalent circuit and corresponding to an upper-surface-side part of the semiconductor device.

Abstract: A semiconductor package includes a PDA chip, a MOS chip, and a wiring plate including a first principal surface and a second principal surface, the first principal surface being provided with a first rigid plate that is non-conductive and a second rigid plate that is conductive, the PDA chip being fixed to the first rigid plate by using a non-conductive bonding agent, a lower surface terminal of the MOS chip being soldered to the second rigid plate, the second principal surface being provided with an input terminal and an output terminal, the input terminal being electrically connected to the PDA chip, the output terminal being electrically connected to the second rigid plate.

Abstract: Provided is a current detection device including a first stacked board; a second stacked board provided on a first region on the first stacked board; a third stacked board provided on a second region on the first stacked board; a magnetic measurement element provided in a third region on the first stacked board, the magnetic element provided between the first region and the second region; and a first coil provided on the magnetic measurement element or below the magnetic measurement element.

Abstract: A current detection device includes a plane-shaped first coil pattern having a winding number of at least two or more, a magnetic field detection element isolated from the first coil pattern in a direction orthogonal to a plane of the first coil pattern, and arranged to receive a magnetic field formed by the first coil pattern, a driving circuit configured to drive the magnetic field detection element and output an output signal, a second coil pattern, a first substrate on the first coil pattern, a second substrate on the second coil pattern, and a third substrate on the magnetic field detection element. The magnetic field detection element is provided between the first coil pattern and the second coil pattern.

Abstract: Provided is a current detection device including: a first board; a second board provided above the first board in parallel to the first board; a magnetic measurement element provided between the first board and the second board; a first coil having at least one of a first wire provided on the first board or a second wire provided on the second board and having a first connection conductor connected to the first wire provided on the first board or the second wire provided on the second board; and a second coil having at least one of a third wire provided on the first board or a fourth wire provided on the second board and having a second connection conductor connected to the third wire provided on the first board or the fourth wire provided on the second board, the second coil being connected to the first coil such that magnetic fields generated in the first coil and the second coil by a current for electrically conducting the first coil and the second coil have the same direction.

Abstract: A printed circuit board of an embodiment includes a board, a first ground plane provided on a first face of the board and having a first opening, a first wiring provided above the first ground plane, a second ground plane provided on a second face facing the first face of the board and having a second opening, a second wiring provided above the second ground plane, and a third wiring penetrating the board between the first opening and the second opening and connecting the first wiring and the second wiring. The third wiring is provided in the first opening and in the second opening when viewed from a direction perpendicular to the first face of the board.

Abstract: Provided is a current detection device including: a first board; a second board provided above the first board in parallel to the first board; a magnetic measurement element provided between the first board and the second board; a first coil having at least one of a first wire provided on the first board or a second wire provided on the second board and having a first connection conductor connected to the first wire provided on the first board or the second wire provided on the second board; and a second coil having at least one of a third wire provided on the first board or a fourth wire provided on the second board and having a second connection conductor connected to the third wire provided on the first board or the fourth wire provided on the second board, the second coil being connected to the first coil such that magnetic fields generated in the first coil and the second coil by a current for electrically conducting the first coil and the second coil have the same direction.

Abstract: Provided is a current detection device including a first stacked board; a second stacked board provided on a first region on the first stacked board; a third stacked board provided on a second region on the first stacked board; a magnetic measurement element provided in a third region on the first stacked board, the magnetic element provided between the first region and the second region; and a first coil provided on the magnetic measurement element or below the magnetic measurement element.

Abstract: A current detection device in an embodiment includes a plane-shaped coil pattern having a winding number of at least two or more, a Hall element provided to be isolated from the coil pattern in a direction orthogonal to a plane of the coil pattern and disposed to receive a magnetic field formed by the coil pattern, and a driving circuit configured to drive the Hall element and output an output signal.

Abstract: A printed circuit board of an embodiment includes a board, a first ground plane provided on a first face of the board and having a first opening, a first wiring provided above the first ground plane, a second ground plane provided on a second face facing the first face of the board and having a second opening, a second wiring provided above the second ground plane, and a third wiring penetrating the board between the first opening and the second opening and connecting the first wiring and the second wiring. The third wiring is provided in the first opening and in the second opening when viewed from a direction perpendicular to the first face of the board.

Abstract: A disk drive includes a metal base that has a rectangular bottom wall and side walls formed on each side of the rectangular bottom wall, the side walls including a first side wall on a shorter side, a metal cover that is fixed to the metal base with a plurality of metal screws, including two screws disposed at opposite ends of the side wall, a gap being formed between an upper end of the first side wall and the metal cover, a magnetic disk disposed on the metal base, at a position offset from a center of the metal base in a longitudinal direction towards the first side wall, and a head. The first side wall and the metal cover are electrically connected at an intermediate position of the first side wall between said opposite ends of the first side wall.

Abstract: A disk drive includes a metal base that has a rectangular bottom wall and side walls formed on each side of the rectangular bottom wall, the side walls including a first side wall on a shorter side, a metal cover that is fixed to the metal base with a plurality of metal screws, including two screws disposed at opposite ends of the side wall, a gap being formed between an upper end of the first side wall and the metal cover, a magnetic disk disposed on the metal base, at a position offset from a center of the metal base in a longitudinal direction towards the first side wall, and a head. The first side wall and the metal cover are electrically connected at an intermediate position of the first side wall between said opposite ends of the first side wall.

Abstract: A disk drive includes a metal base that has a rectangular bottom wall and side walls formed on each side of the rectangular bottom wall, the side walls including a first side wall on a shorter side, a metal cover that is fixed to the metal base with a plurality of metal screws, including two screws disposed at opposite ends of the side wall, a gap being formed between an upper end of the first side wall and the metal cover, a magnetic disk disposed on the metal base, at a position offset from a center of the metal base in a longitudinal direction towards the first side wall, and a head. The first side wall and the metal cover are electrically connected at an intermediate position of the first side wall between said opposite ends of the first side wall.

Abstract: According to one embodiment, a design support method includes generating first layout data when first electronic components and first positions of the first electronic components on a printed circuit board are specified, computing temperature distribution data showing a temperature distribution on a surface of the board, acquiring a maximum thermal resistance temperature of the second electronic component when the second electronic component is specified, calculating a first temperature on the surface at a second position based on the temperature distribution data when the second position is specified, determining whether the second electronic component can be arranged at the second position based on the first temperature and the maximum thermal resistance temperature, and prohibiting generation of a second layout data when it is determined that the second electronic component can be arranged at the second position, the second layout data showing the first positions and the second position.

Abstract: According to one embodiment, a storage device includes a multilayer wiring board; an internal circuit formed to include a memory device mounted on the multilayer wiring board; a plurality of connector terminals formed on the multilayer wiring board and used for connection to an external apparatus; and a plurality of connector pads formed on the multilayer wiring board and configured to connect wires in the internal circuit and the connector terminals, a connector pad for signals among the connector pads including a micro-strip line including a signal conductor pattern conductor on a surface layer and an internal layer ground conductor. The micro-strip line is formed by patterning a plurality of internal layer ground conductors such that the internal layer ground conductor is set as a target of the signal conductor pattern conductor on the surface layer.

Abstract: According to one embodiment, a design support method includes generating first layout data when first electronic components and first positions of the first electronic components on a printed circuit board are specified, computing temperature distribution data showing a temperature distribution on a surface of the board, acquiring a maximum thermal resistance temperature of the second electronic component when the second electronic component is specified, calculating a first temperature on the surface at a second position based on the temperature distribution data when the second position is specified, determining whether the second electronic component can be arranged at the second position based on the first temperature and the maximum thermal resistance temperature, and prohibiting generation of a second layout data when it is determined that the second electronic component can be arranged at the second position, the second layout data showing the first positions and the second position.

Abstract: According to one embodiment, a wiring board includes a transmission line provided to perform communications between a first semiconductor chip and a second semiconductor chip, the transmission line is formed of a distributed constant wiring portion having a characteristic impedance matched to one of an output impedance of the first semiconductor chip and an output impedance of the second semiconductor chip, and a lumped constant wiring portion which is narrower than the distributed constant wiring portion and shorter than a length which can be regarded as a lumped constant circuit.

Abstract: According to one embodiment, a wiring board includes a transmission line provided to perform communications between a first semiconductor chip and a second semiconductor chip, the transmission line is formed of a distributed constant wiring portion having a characteristic impedance matched to one of an output impedance of the first semiconductor chip and an output impedance of the second semiconductor chip, and a lumped constant wiring portion which is narrower than the distributed constant wiring portion and shorter than a length which can be regarded as a lumped constant circuit.