Abstract: A semiconductor device can include: a semiconductor chip including a first and second surface, a first electrode on the first surface, an active area on the second surface, a second electrode on the second surface, and a third electrode on the second surface; a first conductive member in the active area of the semiconductor chip and electrically connected to the semiconductor chip; a second conductive member in a second area and isolated from the first conductive member, the second area an area in which, when viewed from above, with respect to a first area of the active area in which the first conductive member is not provided, circles sharing centers of shortest distances between an outer periphery of the first conductive member and an outer periphery of the active area can be drawn largest in the first area; and a lead terminal connected to the first conductive member.

Abstract: A first conductor includes a first portion, a second portion, and a third portion. The first portion is in contact with the first electrode and has a second length in the first direction that is shorter than the first length. The second portion is located farther in a second direction than the first portion, is connected to the first portion, and has a third length in the first direction that is longer than the second length. The third portion is located farther in the second direction than the second portion, is connected to the second portion, and is exposed from a sealing resin.

Abstract: According to one embodiment, a semiconductor device includes: a substrate including a first surface extending in a first direction and a second direction; a first transistor; a light receiver; a light emitter provided on the light receiver; an input terminal provided on the first surface of the substrate; a first conductor configured to electrically couple a source electrode of the first transistor and a first electrode of the light receiver; a second conductor configured to electrically couple a gate electrode of the first transistor and a second electrode of the light receiver; and a third conductor configured to couple a third electrode of the light emitter and the input terminal, wherein the light emitter and the input terminal are provided at positions overlapping with each other in a third direction, and the third conductor is provided inside the substrate.

Abstract: According to one embodiment, a simulation apparatus is disclosed. The simulation apparatus includes a storage device storing data relating to a thermal equivalent circuit of a semiconductor device. The simulation apparatus further includes an estimation device estimating a time-dependent change in thermal characteristics of the semiconductor device by using the data. The thermal equivalent circuit includes a first thermal equivalent circuit corresponding to a lower-surface-side part of the semiconductor device. The thermal equivalent circuit further includes a second thermal equivalent circuit connected to the first thermal equivalent circuit and corresponding to an upper-surface-side part of the semiconductor device.

Abstract: A semiconductor package includes a PDA chip, a MOS chip, and a wiring plate including a first principal surface and a second principal surface, the first principal surface being provided with a first rigid plate that is non-conductive and a second rigid plate that is conductive, the PDA chip being fixed to the first rigid plate by using a non-conductive bonding agent, a lower surface terminal of the MOS chip being soldered to the second rigid plate, the second principal surface being provided with an input terminal and an output terminal, the input terminal being electrically connected to the PDA chip, the output terminal being electrically connected to the second rigid plate.

Abstract: A semiconductor device includes a first substrate, a second substrate, a first semiconductor element, a second semiconductor element, a connection conductor, a connection conductor, and a sealing part. The first substrate includes a first surface, a second surface, a first insulating substrate, and a first conductive layer. The second substrate includes a third surface, a fourth surface, a second insulating substrate, and a second conductive layer. The first semiconductor element includes a first semiconductor layer, a first electrode, a second electrode, and a first control electrode. The second semiconductor element includes a second semiconductor layer, a third electrode, a fourth electrode, and a second control electrode. The connection conductor electrically connects the first and fourth electrodes. The sealing part covers a portion of the first substrate, a portion of the second substrate, the first semiconductor element, and the second semiconductor element.

Abstract: A semiconductor device can include: a semiconductor chip including a first and second surface, a first electrode on the first surface, an active area on the second surface, a second electrode on the second surface, and a third electrode on the second surface; a first conductive member in the active area of the semiconductor chip and electrically connected to the semiconductor chip; a second conductive member in a second area and isolated from the first conductive member, the second area an area in which, when viewed from above, with respect to a first area of the active area in which the first conductive member is not provided, circles sharing centers of shortest distances between an outer periphery of the first conductive member and an outer periphery of the active area can be drawn largest in the first area; and a lead terminal connected to the first conductive member.

Abstract: According to one embodiment, a simulation apparatus is disclosed. The simulation apparatus includes a storage device storing data relating to a thermal equivalent circuit of a semiconductor device. The simulation apparatus further includes an estimation device estimating a time-dependent change in thermal characteristics of the semiconductor device by using the data. The thermal equivalent circuit includes a first thermal equivalent circuit corresponding to a lower-surface-side part of the semiconductor device. The thermal equivalent circuit further includes a second thermal equivalent circuit connected to the first thermal equivalent circuit and corresponding to an upper-surface-side part of the semiconductor device.

Abstract: A semiconductor package includes a PDA chip, a MOS chip, and a wiring plate including a first principal surface and a second principal surface, the first principal surface being provided with a first rigid plate that is non-conductive and a second rigid plate that is conductive, the PDA chip being fixed to the first rigid plate by using a non-conductive bonding agent, a lower surface terminal of the MOS chip being soldered to the second rigid plate, the second principal surface being provided with an input terminal and an output terminal, the input terminal being electrically connected to the PDA chip, the output terminal being electrically connected to the second rigid plate.

Abstract: Provided is a current detection device including a first stacked board; a second stacked board provided on a first region on the first stacked board; a third stacked board provided on a second region on the first stacked board; a magnetic measurement element provided in a third region on the first stacked board, the magnetic element provided between the first region and the second region; and a first coil provided on the magnetic measurement element or below the magnetic measurement element.

Abstract: A current detection device includes a plane-shaped first coil pattern having a winding number of at least two or more, a magnetic field detection element isolated from the first coil pattern in a direction orthogonal to a plane of the first coil pattern, and arranged to receive a magnetic field formed by the first coil pattern, a driving circuit configured to drive the magnetic field detection element and output an output signal, a second coil pattern, a first substrate on the first coil pattern, a second substrate on the second coil pattern, and a third substrate on the magnetic field detection element. The magnetic field detection element is provided between the first coil pattern and the second coil pattern.

Abstract: Provided is a current detection device including: a first board; a second board provided above the first board in parallel to the first board; a magnetic measurement element provided between the first board and the second board; a first coil having at least one of a first wire provided on the first board or a second wire provided on the second board and having a first connection conductor connected to the first wire provided on the first board or the second wire provided on the second board; and a second coil having at least one of a third wire provided on the first board or a fourth wire provided on the second board and having a second connection conductor connected to the third wire provided on the first board or the fourth wire provided on the second board, the second coil being connected to the first coil such that magnetic fields generated in the first coil and the second coil by a current for electrically conducting the first coil and the second coil have the same direction.

Abstract: A printed circuit board of an embodiment includes a board, a first ground plane provided on a first face of the board and having a first opening, a first wiring provided above the first ground plane, a second ground plane provided on a second face facing the first face of the board and having a second opening, a second wiring provided above the second ground plane, and a third wiring penetrating the board between the first opening and the second opening and connecting the first wiring and the second wiring. The third wiring is provided in the first opening and in the second opening when viewed from a direction perpendicular to the first face of the board.

Abstract: Provided is a current detection device including: a first board; a second board provided above the first board in parallel to the first board; a magnetic measurement element provided between the first board and the second board; a first coil having at least one of a first wire provided on the first board or a second wire provided on the second board and having a first connection conductor connected to the first wire provided on the first board or the second wire provided on the second board; and a second coil having at least one of a third wire provided on the first board or a fourth wire provided on the second board and having a second connection conductor connected to the third wire provided on the first board or the fourth wire provided on the second board, the second coil being connected to the first coil such that magnetic fields generated in the first coil and the second coil by a current for electrically conducting the first coil and the second coil have the same direction.

Abstract: Provided is a current detection device including a first stacked board; a second stacked board provided on a first region on the first stacked board; a third stacked board provided on a second region on the first stacked board; a magnetic measurement element provided in a third region on the first stacked board, the magnetic element provided between the first region and the second region; and a first coil provided on the magnetic measurement element or below the magnetic measurement element.

Abstract: A current detection device in an embodiment includes a plane-shaped coil pattern having a winding number of at least two or more, a Hall element provided to be isolated from the coil pattern in a direction orthogonal to a plane of the coil pattern and disposed to receive a magnetic field formed by the coil pattern, and a driving circuit configured to drive the Hall element and output an output signal.

Abstract: A printed circuit board of an embodiment includes a board, a first ground plane provided on a first face of the board and having a first opening, a first wiring provided above the first ground plane, a second ground plane provided on a second face facing the first face of the board and having a second opening, a second wiring provided above the second ground plane, and a third wiring penetrating the board between the first opening and the second opening and connecting the first wiring and the second wiring. The third wiring is provided in the first opening and in the second opening when viewed from a direction perpendicular to the first face of the board.

Abstract: A disk drive includes a metal base that has a rectangular bottom wall and side walls formed on each side of the rectangular bottom wall, the side walls including a first side wall on a shorter side, a metal cover that is fixed to the metal base with a plurality of metal screws, including two screws disposed at opposite ends of the side wall, a gap being formed between an upper end of the first side wall and the metal cover, a magnetic disk disposed on the metal base, at a position offset from a center of the metal base in a longitudinal direction towards the first side wall, and a head. The first side wall and the metal cover are electrically connected at an intermediate position of the first side wall between said opposite ends of the first side wall.

Abstract: A disk drive includes a metal base that has a rectangular bottom wall and side walls formed on each side of the rectangular bottom wall, the side walls including a first side wall on a shorter side, a metal cover that is fixed to the metal base with a plurality of metal screws, including two screws disposed at opposite ends of the side wall, a gap being formed between an upper end of the first side wall and the metal cover, a magnetic disk disposed on the metal base, at a position offset from a center of the metal base in a longitudinal direction towards the first side wall, and a head. The first side wall and the metal cover are electrically connected at an intermediate position of the first side wall between said opposite ends of the first side wall.

Abstract: A disk drive includes a metal base that has a rectangular bottom wall and side walls formed on each side of the rectangular bottom wall, the side walls including a first side wall on a shorter side, a metal cover that is fixed to the metal base with a plurality of metal screws, including two screws disposed at opposite ends of the side wall, a gap being formed between an upper end of the first side wall and the metal cover, a magnetic disk disposed on the metal base, at a position offset from a center of the metal base in a longitudinal direction towards the first side wall, and a head. The first side wall and the metal cover are electrically connected at an intermediate position of the first side wall between said opposite ends of the first side wall.