Patents by Inventor Toshihiro Watanbe

Toshihiro Watanbe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20020192102
    Abstract: A powder compact is produced by disposing a foil or film-like mold member packed with a powder in a cavity of a rubber mold which is loaded in a die. The rubber mold, the foil or film-like type mold member and the powder packed in the foil or film-like mold member are compressed by a punch to obtain a powder compact. The powder compact with the foil or film-like mold member being attached thereto is removed, by pressure, from the rubber mold. Since the powder to be compressed into a compact is not packed directly in the cavity of the rubber mold, but is packed in the mold member, no part of the rubber mold is caught in the space formed by the powder that is in contact with the rubber mold. Accordingly, cracks and chips in the powder compact can be prevented even when the rubber mold is restored to its initial shape and many shape and size variations of the powder compact can be realized.
    Type: Application
    Filed: June 6, 2002
    Publication date: December 19, 2002
    Applicant: Intermetallics Co., Ltd.
    Inventors: Masato Sagawa, Toshihiro Watanbe