Patents by Inventor Toshihiro Yaji

Toshihiro Yaji has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6464783
    Abstract: A method for manufacturing a prepreg in which a reinforcing substrate is impregnated with a thermosetting matrix resin. In the method, the reinforcing substrate is moved in a traveling direction. The thermosetting matrix resin is supplied to an outer circumferential surface of a transferring roller. The thermosetting matrix resin which substantially contains no solvent and which is in. a molten state is transferred from the outer circumferential surface of the transferring roller to a first surface of a reinforcing substrate while the reinforcing substrate moves. The thermosetting matrix resin which is transferred to the first surface is forced to permeate through the reinforcing substrate by pressing at least one pressing roller on the thermosetting matrix resin transferred to the first surface while the reinforcing substrate moves. The reinforcing substrate impregnated with the thermosetting matrix resin is heated to semi-cure the thermosetting matrix resin.
    Type: Grant
    Filed: October 18, 2000
    Date of Patent: October 15, 2002
    Assignee: Matsushita Electric Works, Ltd.
    Inventors: Ryuichi Hamabe, Hiroshi Harada, Noriaki Sugimoto, Hiroyuki Mori, Toshihiro Yaji, Yoshinori Matsuzaki
  • Patent number: 6245383
    Abstract: A method for manufacturing a prepreg in which a reinforcing substrate is impregnated with a thermosetting matrix resin. In the method, the reinforcing substrate is moved in a traveling direction. The thermosetting matrix resin is supplied to an outer circumferential surface of a transferring roller. The thermosetting matrix resin which substantially contains no solvent and which is in a molten state is transferred from the outer circumferential surface of the transferring roller to a first surface of a reinforcing substrate while the reinforcing substrate moves. The thermosetting matrix resin which is transferred to the first surface is forced to permeate through the reinforcing substrate by pressing at least one pressing roller on the thermosetting matrix resin transferred to the first surface while the reinforcing substrate moves. The reinforcing substrate impregnated with the thermosetting matrix resin is heated to semi-cure the thermosetting matrix resin.
    Type: Grant
    Filed: September 29, 1999
    Date of Patent: June 12, 2001
    Assignee: Matsushita Electric Works, Ltd.
    Inventors: Ryuichi Hamabe, Hiroshi Harada, Noriaki Sugimoto, Hiroyuki Mori, Toshihiro Yaji, Yoshinori Matsuzaki