Abstract: A molding method in which a control plate having a size which is equal to or larger than the width of the outlet port of a supply passage are disposed in a cavity adjacent to the resin supply passage of a mold and thereby, the resin molding can be effected substantially equally at upper and lower sides of the insert comprising a semiconductor device and a lead.

Abstract: A package is provided for achieving higher packing density and higher circuit integration of memories, in particular, a structure is provided having a plurality of thin, surface mount packages which are stacked up. Each of the laminated packages includes a semiconductor pellet, leads fixed to the front surface of the pellet, a radiating plate fixed to the rear surface of the same, and a resin mold member. To achieve a stabilized laminated structure, the mold member is shaped into a convex form on the front side of the pellet and into a concave form on the rear side of the same, so that the concave portion of one package can engage with the convex portion of another package.

Abstract: The present invention consists in that a through hole of large area is provided in a die pad or a tab, thereby to prevent a resin from cracking at the rear surface of a surface-packaging resin package in a high-temperature soldering atmosphere of vapor-phase reflow or the like, whereby a resin-molded surface-packaged IC of high reliability is provided.

Abstract: A semiconductor device having a structure in which an insulating resin film or sheet is stuck on the principal surface of a semiconductor chip which is formed with circuits and in which the inner lead portions of a lead frame are arranged on the principal surface of the semiconductor chip through the insulating sheet, is provided in order that the semiconductor chip having the highest possible density of integration may be received placed in a standardized package. The present invention particularly features the shape of the lead frame, according to which the inner lead portions lying within a sealing member are substantially entirely arrayed over the semiconductor chip itself.

Abstract: In a tabless lead frame wherein a space for laying inner leads is sufficiently secured when a lengthened and enlarged semiconductor pellet is placed or set in a resin-molding package, through holes are provided in leads for the purpose of increasing the occupation area ratio of a resin portion. Furthermore, each of the leads corresponding to the lower surface of the pellet is branched into a plurality of portions in the widthwise direction thereof in order to reduce a stress. Further, in an insulating sheet which is interposed between the leads and the pellet, the dimension of the shorter lateral sides thereof is set smaller than that of the shorter lateral sides of the pellet in order to prevent cracks from occurring at the end part of the insulating sheet.