Abstract: A probe of the present invention includes a beam portion cantilevered by a holding portion, and a contact extending perpendicularly to and downward from a free end of the beam portion. An inner cut portion is formed on a fixed end side of the beam portion in a side portion of the contact, and an outer cut portion is formed on a free end side of the beam portion in a side portion of the contact, so that the outer cut portion and the inner cut portion are formed to bend the contact when the contact contacts an electrode of an object to be inspected at a predetermined contact pressure. According to the present invention, in inspection of electrical characteristics of the object to be inspected, suitable contact between the probe and the object to be inspected may be maintained and the durability of the probe may be improved.

Abstract: A probe card according to the present invention includes a support plate for supporting probes that contact an object to be inspected, a circuit board, a holding member for holding a lower surface of an outer peripheral portion of the support plate, and an abutting member disposed between the lower surface of the outer peripheral portion of the support plate and the holding member and protruding upward to abut to the lower surface of the outer peripheral portion of the support plate. Accordingly, horizontal expansion of the support plate itself is allowed, and at the time of inspecting electrical characteristics of the object to be inspected, even though the temperature of the support plate is increased and the support plate expands, the support plate can expand in a horizontal direction, thereby suppressing vertical deformation of the support plate.

Abstract: A reinforcing member is formed at a top surface side of a probe card including a support plate for supporting a contactor and a circuit board. A plurality of long guide holes are formed in an outer peripheral portion of the reinforcing member. Fixing members fixed to a holding member and collars formed around outer circumferences of the fixing members are formed in the guide holes. A length in a longitudinal direction of each of the guide holes is greater than a diameter of each of the collars, and a central line in the longitudinal direction of each of the guide holes passes through a center of the reinforcing member. Due to the guide holes, horizontal expansion of the reinforcing member itself is allowed.

Abstract: Contact pressure between a wafer and a probe is maintained at an appropriate level. A probe card 2 has a contactor 11 for supporting a probe 10, a printed wiring board 13 electrically connected to the contactor 11, and a reinforcement member 14. On the upper surface side of the probe card 2 is provided a top plate 70 connected to the reinforcement member 14 by a connection member 80. A groove 90 is formed in the upper surface of the top plate 70, and a strain gauge 91 is attached at the groove 90. When a wafer W and the probe 10 are in contact with each other, an upward load acts on the probe card 2 by pressure caused by the contact, and the load causes strain in the top plate 70. The amount of the strain in the top plate 70 is measured, and contact pressure between the wafer W and the probe 10 is regulated and set based on the amount of the strain.

Abstract: A probe card according to the present invention includes a support plate for supporting probes that contact an object to be inspected, a circuit board, a holding member for holding a lower surface of an outer peripheral portion of the support plate, and an abutting member disposed between the lower surface of the outer peripheral portion of the support plate and the holding member and protruding upward to abut to the lower surface of the outer peripheral portion of the support plate. Accordingly, horizontal expansion of the support plate itself is allowed, and at the time of inspecting electrical characteristics of the object to be inspected, even though the temperature of the support plate is increased and the support plate expands, the support plate can expand in a horizontal direction, thereby suppressing vertical deformation of the support plate.

Abstract: A reinforcing member is formed at a top surface side of a probe card including a support plate for supporting a contactor and a circuit board. A plurality of long guide holes are formed in an outer peripheral portion of the reinforcing member. Fixing members fixed to a holding member and collars formed around outer circumferences of the fixing members are formed in the guide holes. A length in a longitudinal direction of each of the guide holes is greater than a diameter of each of the collars, and a central line in the longitudinal direction of each of the guide holes passes through a center of the reinforcing member. Due to the guide holes, horizontal expansion of the reinforcing member itself is allowed.

Abstract: A probe of the present invention includes a beam portion cantilevered by a holding portion, and a contact extending perpendicularly to and downward from a free end of the beam portion. An inner cut portion is formed on a fixed end side of the beam portion in a side portion of the contact, and an outer cut portion is formed on a free end side of the beam portion in a side portion of the contact, so that the outer cut portion and the inner cut portion are formed to bend the contact when the contact contacts an electrode of an object to be inspected at a predetermined contact pressure. According to the present invention, in inspection of electrical characteristics of the object to be inspected, suitable contact between the probe and the object to be inspected may be maintained and the durability of the probe may be improved.

Abstract: In accordance with an increase in speed, a wiring structure has rapidly become more microscopic and thinner and a wiring layer has become extremely thin, and therefore, giving a contact load to a probe for the inspection as has been conventionally done causes damage to a wiring layer and an insulation layer because the probe penetrates not only the oxide film but also the wiring layer or because of a concentration stress from the probe. On the other hand, decreasing the contact load causes unstable continuity between the probe and an electrode pad. It is an object of the present invention to surely and stably inspect an object to be inspected by breaking an oxide film with a low stylus pressure.

Abstract: Contact pressure between a wafer and a probe is maintained at an appropriate level. A probe card 2 has a contactor 11 for supporting a probe 10, a printed wiring board 13 electrically connected to the contactor 11, and a reinforcement member 14. On the upper surface side of the probe card 2 is provided a top plate 70 connected to the reinforcement member 14 by a connection member 80. A groove 90 is formed in the upper surface of the top plate 70, and a strain gauge 91 is attached at the groove 90. When a wafer W and the probe 10 are in contact with each other, an upward load acts on the probe card 2 by pressure caused by the contact, and the load causes strain in the top plate 70. The amount of the strain in the top plate 70 is measured, and contact pressure between the wafer W and the probe 10 is regulated and set based on the amount of the strain.

Abstract: It is an object of the present invention to conduct highly reliable inspection by adjusting a contactor of a probe card and an inspection object in a prober to a parallel state even if the contactor and the inspection object become not parallel to each other. The present invention is a probe card mounted in a prober via a holder, the probe card including: a contactor; a circuit board electrically connected to the contactor; a reinforcing member reinforcing the circuit board; and a parallelism adjustment mechanism adjusting a degree of parallelism between the contactor and an inspection object disposed in the prober.

Abstract: In accordance with an increase in speed, a wiring structure has rapidly become more microscopic and thinner and a wiring layer has become extremely thin, and therefore, giving a contact load to a probe for the inspection as has been conventionally done causes damage to a wiring layer and an insulation layer because the probe penetrates not only the oxide film but also the wiring layer or because of a concentration stress from the probe. On the other hand, decreasing the contact load causes unstable continuity between the probe and an electrode pad. It is an object of the present invention to surely and stably inspect an object to be inspected by breaking an oxide film with a low stylus pressure.

Abstract: In a mechanism for fixing a probe card, the probe card and a support frame are joined to each other about the axis of each of the probe card and the support frame by a plurality of first fastening members. Also, the outer circumferential edge portion of the support frame is fixed by a plurality of second fastening members to a holder fixed to a probe unit. The probe card is held by the mechanism such that the central region of the probe card is restricted by the first fastening members and the outer circumferential portion of the probe card is not restricted so as to be rendered free. It follows that the probe card is expanded toward the outer circumferential edge portion by thermal expansion under a high-temperature. However, the probe card is prevented from being deformed in the shape of a dome.

Abstract: In a mechanism for fixing a probe card, the probe card and a support frame are joined to each other about the axis of each of the probe card and the support frame by a plurality of first fastening members. Also, the outer circumferential edge portion of the support frame is fixed by a plurality of second fastening members to a holder fixed to a probe unit. The probe card is held by the mechanism such that the central region of the probe card is restricted by the first fastening members and the outer circumferential portion of the probe card is not restricted so as to be rendered free. It follows that the probe card is expanded toward the outer circumferential edge portion by thermal expansion under a high-temperature. However, the probe card is prevented from being deformed in the shape of a dome.

Abstract: There is disclosed a wafer temperature control apparatus comprising a heater for heating a wafer chuck, a cooler which contacts the heater via seal members, a temperature sensor passed through the heater and cooler to enter a concave portion of the wafer chuck, and a PID controller for controlling the heater in accordance with a detected temperature of the temperature sensor. A connection hole connected to a gap &dgr; formed between the heater and the cooler via the seal members is formed in the cooler, and connected to a vacuum pump via a changeover valve. Additionally, when the changeover valve is controlled via the PID controller to set a pressure of the gap &dgr; to a reduced pressure or an atmospheric pressure, the cooler is attached to or detached from the heater.

Abstract: A vacuum coupling system according to the present invention is a mechanism that is used accurately to position and connect a vacuum coupling to a valve mechanism of a shell, which is formed by integrally attracting a wafer and a contactor to a wafer chuck by vacuum suction, in conducting a reliability test or other tests on IC chips that is formed on the wafer. This system comprises an air cylinder for advancing the vacuum coupling toward the valve mechanism, a positioning member to be advanced together with the vacuum coupling, a guide member for guiding the vacuum coupling to the valve mechanism in cooperation with the positioning member, a guide rail for guiding the around the wafer chuck while the positioning member is advancing, and a pair of POGO pins for returning the air cylinder to its neutral position.

Abstract: A temperature measuring unit of a wafer chuck measures the temperature of a wafer chuck when the wafer chuck holding a wafer W making in-unison contact with a contactor is made to contact a bottom jacket and the bottom jacket controls the wafer W to a specific test temperature. At least three recessed sections are formed in the back of the wafer chuck in such a manner that they have a depth extending from the back of the chuck to the vicinity of its surface. Through holes corresponding to the recessed sections are made in the bottom jacket. Temperature sensors that can be inserted into the through holes and in the recessed sections are provided on the side opposite to the wafer chuck of the bottom jacket. The sensors are supported by springs. During a test, the tips of the temperature sensors are caused to make elastic contact with the recessed sections.

Abstract: An aligning apparatus includes a first image pickup camera for picking up an image of an inspection contactor, a moving body located so as to be movable in X-, Y-, Z- and .theta.-directions and having the first image pickup camera fixed thereon, a wafer bearer capable of being located on the moving body and supporting a semiconductor wafer, a control circuit for controlling movements of the moving body moved in the individual directions, and a second image pickup camera for picking up an image of the semiconductor wafer on the bearer moving under the control of the control circuit.

Abstract: There is provided an inspection apparatus comprises, a transportation unit for transporting the object of inspection to a position opposite to the contact portion, a sucking holder movable toward and away from the contact portion and adapted to hold the object of inspection by suction; and a pressure contact mechanism provided separately from the transportation unit and adapted to press the sucking holder, thereby pressing the object of inspection against the contact portion. Thus the tranportation mechanism is separated from the pressure contact mechanism, the transportation mechanism can be reduced in weight, and the pressure contact mechanism can ensure setting of appropriate pressing. The operation time can be shortened, moreover, since the object of inspection is kept attached to the contact portion by the transportation mechanism as it is pressed against the contact portion.

Abstract: In a mechanism for fixing a probe card, the probe card and a support frame are joined to each other about the axis of each of the probe card and the support frame by a plurality of first fastening members. Also, the outer circumferential edge portion of the support frame is fixed by a plurality of second fastening members to a holder fixed to a probe unit. The probe card is held by the mechanism such that the central region of the probe card is restricted by the first fastening members and the outer circumferential portion of the probe card is not restricted so as to be rendered free. It follows that the probe card is expanded toward the outer circumferential edge portion by thermal expansion under a high-temperature. However, the probe card is prevented from being deformed in the shape of a dome.

Abstract: In a mechanism for fixing a probe card, the probe card and a support frame are joined to each other about the axis of each of the probe card and the support frame by a plurality of first fastening members. Also, the outer circumferential edge portion of the support frame is fixed by a plurality of second fastening members to a holder fixed to a probe unit. The probe card is held by the mechanism such that the central region of the probe card is restricted by the first fastening members and the outer circumferential portion of the probe card is not restricted so as to be rendered free. It follows that the probe card is expanded toward the outer circumferential edge portion by thermal expansion under a high-temperature. However, the probe card is prevented from being deformed in the shape of a dome.