Abstract: Provided is an intermittently coupled optical fiber ribbon in which a bonded portion in which adjacent optical fibers are bonded by an adhesive resin and a non-bonded portion are intermittently provided in a longitudinal direction. The bonded portion is provided on one side of the optical fiber ribbon. A part of the bonded portion protrudes further than a tangent line passing through surfaces of the adjacent optical fibers on the one side. In the longitudinal direction, at least one of longitudinal end portions of the bonded portion has a larger protrusion height than a central portion of the bonded portion. The adhesive resin has a composite elastic modulus of 0.5 GPa or more and 6.0 or less at 23° C.

Abstract: An intermittently coupled-type optical fiber ribbon includes a plurality of optical fibers arranged in parallel and intermittently coupling portions formed by coupling parts between the adjacent optical fibers with a resin. In the coupling portions, the resin is provided on one side surface and the other side surface of the optical fiber ribbon. When an average of maximum values of thicknesses TF of the coupling portions on the one side surface is set as TFave and an outer diameter of each optical fiber is set as D, D/4?TFave?D/2. When an average of maximum values of thicknesses TB of the coupling portions on the other side surface is set as TBave, TBave<TFave.

Abstract: This device for three-dimensionally measuring a linear object includes a stereo camera, a transmission-light illuminator, and an arithmetic device. The stereo camera images a linear object. The transmission-light illuminator faces the stereo camera so that the linear object is placed between the transmission-light illuminator and the stereo camera. The arithmetic device acquires a three-dimensional shape of the linear object. The stereo camera acquires a transmitted-light image of the linear object captured while the linear object is illuminated by the transmission-light illuminator. The arithmetic device acquires the three-dimensional shape of the linear object based on the transmitted-light image.

Abstract: A driving consciousness estimation device includes a driving readiness estimation unit configured to estimate a driving readiness relating to a driving consciousness of the driver from a driver's reaction to the travelling environment, a driving task demand estimation unit configured to estimate a driving task demand which is an index required for the driver with respect to the driving readiness from the travelling environment, and an attention awakening unit configured to execute awakening of attention for the driver relating to the driving of the vehicle based on the result of comparison between the driving readiness and the driving task demand.

Abstract: In a step of intermittently applying an adhesive resin, while rotating an adhesive resin conveying roller formed by alternately laminating a disk-like fiber roller installed in a pass line, a disk-like partition plate having a diameter larger than that of the fiber roller and including a gap portion for holding the adhesive resin in a part of the vicinity of a peripheral edge portion in a circumferential direction, the adhesive resin conveying roller is immersed in the adhesive resin, which is not cured, to hold the adhesive resin in the gap portion, and then the optical fibers are brought into contact with the partition plate such that the partition plate is sandwiched between the optical fibers in running, so as to intermittently apply the adhesive resin held in the gap portion to the optical fibers in a longitudinal direction.

Abstract: A method for manufacturing an optical fiber comprises a coating step of forming a first layer consisting of a first curable resin composition containing a photopolymerization initiator and a second layer consisting of a second curable resin composition containing another photopolymerization initiator on the glass fiber, a first irradiation step of irradiating UV rays in a first wavelength range from a first UV light source toward the glass fiber, and a second irradiation step of irradiating UV rays in a range shorter in wavelength than the first wavelength range from a second UV light source toward the glass fiber.

Abstract: An optical fiber ribbon is disclosed. The optical fiber ribbon includes first and second optical fibers arranged in parallel, and at least one coupling member made of a resin material. The coupling member couples the first and second optical fibers by adhering the first and second optical fibers each other intermittently in a longitudinal direction of the first and second optical fibers. A breaking elongation of the resin material constituting the coupling member is equal to or more than 200% and equal to or less than 500%.

Abstract: A driving consciousness estimation device includes a driving readiness estimation unit configured to estimate a driving readiness relating to a driving consciousness of the driver from a driver's reaction to the travelling environment, a driving task demand estimation unit configured to estimate a driving task demand which is an index required for the driver with respect to the driving readiness from the travelling environment, and an attention awakening unit configured to execute awakening of attention for the driver relating to the driving of the vehicle based on the result of comparison between the driving readiness and the driving task demand.

Abstract: An optical fiber ribbon is disclosed. The optical fiber ribbon includes first and second optical fibers arranged in parallel, and at least one coupling member made of a resin material. The coupling member couples the first and second optical fibers by adhering the first and second optical fibers each other intermittently in a longitudinal direction of the first and second optical fibers. A breaking elongation of the resin material constituting the coupling member is equal to or more than 200% and equal to or less than 500%.

Abstract: A damper includes a housing, a cap, a rotor portion, and blade portions projecting from the rotor portion. The blade portions include deformation portions in which the blade portions expand the diameter in one rotational direction in response to a resistance received from a viscous fluid, and in which the blade portions reduce the diameter in the other rotational direction. The blade portions engage a ring member provided on an inner circumference of the housing at a time of diameter expansion, and drag the ring member around.

Abstract: A damper includes a housing, a cap, a rotor portion, and blade portions projecting from the rotor portion. The blade portions include deformation portions in which the blade portions expand the diameter in one rotational direction in response to a resistance received from a viscous fluid, and in which the blade portions reduce the diameter in the other rotational direction. The blade portions engage a ring member provided on an inner circumference of the housing at a time of diameter expansion, and drag the ring member around.

Abstract: A semiconductor package provided with a heat radiator achieving a further improvement of reliability by reducing an influence of thermal stress. For this purpose, the heat radiator is formed by a heat radiator comprised of a heat radiation plate plus a box shaped part and comprised so that the entire semiconductor chip is enclosed in this box shaped part together with a board via a metallic bonding material.

Abstract: A manufacturing method for a substrate with a stiffener is disclosed, the substrate being capable of ensuring a good flatness of a printed board when heated to a high temperature and then cooled. The method comprises a first step of preparing a printed board and a stiffener, the printed board including a wiring part and an insulating part formed of an organic insulating material, and the stiffener being formed of a material with a smaller coefficient of thermal expansion than that of the material of the printed board, and a second step of bonding the printed board and the stiffener with a thermosetting adhesive. In the second step, a curing process temperature for curing the thermosetting adhesive is equal to or higher than the glass transition point of the organic insulating material.

Abstract: A method and an apparatus are provided for mounting and removing electronic components using solder bumps while constraining thermal stresses to a substrate. The method and apparatus for mounting and removing an electronic component (bear chip 32) to be soldered onto the substrate with solder bumps 114 is configured to move the electronic component to detect contact of the solder bumps with the substrate or contact of a tool (chuck unit 38) with the electronic component, to define the contact as an original point for raising a heating temperature of the electronic component and the substrate from the heating temperature to a maximum heating temperature HTm as well as move the electronic component in conformity with the temperature rising, and to move the electronic component from a position where the maximum heating temperature is achieved to a mounting height of the substrate.

Abstract: A heat conductive bonding material 6 has a first bonding region 7 transferring heat of a semiconductor chip 1 to a heat spreader 4, and a second bonding region 8 relaxing a thermal stress generated between the semiconductor chip 1 and the heat spreader 4.

Abstract: In a semiconductor device, a semiconductor element is mounted on a package substrate, and a heat dissipating member is laid above the semiconductor element and the package thereby sealing the semiconductor element. Resin is filled into the space defined by the semiconductor element, the package substrate, and the heat dissipating member such that there are no gaps.

Abstract: An electronic component is mounted on the surface of a printed wiring board. A heat conductive member is received on the surface of the electronic component. A joint material is interposed between the electronic component and the heat conductive member. The joint material is made of material containing Ag in a range exceeding 3 wt % and In. The inventors have demonstrated that voids decrease at the boundary between the joint material and the electronic component as well as at the boundary between the joint material and the heat conductive member as the content of Ag increases in the overall weight of the joint material. The joint material is allowed to enjoy a higher heat conductivity as compared with a conventional solder material. The joint material allows the heat conductive member to efficiently receive heat from the electronic component.

Abstract: A method and an apparatus are provided for mounting and removing electronic components using solder bumps while constraining thermal stresses to a substrate. The method and apparatus for mounting and removing an electronic component (bear chip 32) to be soldered onto the substrate with solder bumps 114 is configured to move the electronic component to detect contact of the solder bumps with the substrate or contact of a tool (chuck unit 38) with the electronic component, to define the contact as an original point for raising a heating temperature of the electronic component and the substrate from the heating temperature to a maximum heating temperature HTm as well as move the electronic component in conformity with the temperature rising, and to move the electronic component from a position where the maximum heating temperature is achieved to a mounting height of the substrate.

Abstract: A method and an apparatus are provided for mounting and removing electronic components using solder bumps while constraining thermal stresses to a substrate. The method and apparatus for mounting and removing an electronic component (bear chip 32) to be soldered onto the substrate with solder bumps 114 is configured to move the electronic component to detect contact of the solder bumps with the substrate or contact of a tool (chuck unit 38) with the electronic component, to define the contact as an original point for raising a heating temperature of the electronic component and the substrate from the heating temperature to a maximum heating temperature HTm as well as move the electronic component in conformity with the temperature rising, and to move the electronic component from a position where the maximum heating temperature is achieved to a mounting height of the substrate.

Abstract: The separable optical fiber ribbon in accordance with the present invention is an optical fiber ribbon in which a plurality of colored optical fibers arranged in parallel are coated with a collective coating resin so as to be integrated into an optical fiber ribbon, and a plurality of such optical fiber ribbons are arranged in parallel and coated with a binding resin; wherein the binding resin is obtained by curing a UV-curable resin composition satisfying the condition represented by the following expression (1): 1.0×10?4?(W·N/100MW)?4.0×10?4??(1) where W is the compounding ratio [wt %] of a urethane acrylate compound contained in the resin composition, N is the number of urethane groups in one molecule of the urethane acrylate compound, and MW is the average molecular weight of the urethane acrylate compound.