Patents by Inventor Toshihisa Sudo

Toshihisa Sudo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4097266
    Abstract: A microsphere of solder having a metallic core, in which the thickness of the solder coating of the microsphere is more than 20 microns, can be produced by a process comprising preparing a sheet having a plurality of hollows provided all over the sheet, placing a spherical grain of a metal together with at least one grain of solder in each of said hollows, the metallic grain having wettability for solder, then heating the grains in the hollow in the presence of a flux to coat the metallic grain with the solder, and recovering a spherical solder bead having a metallic core.
    Type: Grant
    Filed: December 30, 1975
    Date of Patent: June 27, 1978
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Eikichi Takahashi, Toshihiko Taguchi, Kazuo Fujikura, Toshihisa Sudo