Patents by Inventor Toshihisa Yamada

Toshihisa Yamada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240146494
    Abstract: [Object] Transmission efficiency is improved while transmission latency is minimized as possible. [Solving Means] A communication apparatus includes a communication section configured to count an interval allocated in a TDD (Time Division Duplex) mode as one TDD time slot, with a plurality of the TDD time slots counted as one period, the communication section further transmitting periodically, to a communication partner apparatus, multiple application packets corresponding to multiple serial signals generated by multiple applications, and a transmission control section configured to provide, from among the multiple TDD time slots, at least one specific TDD time slot for transmitting a limited portion of the application packets corresponding to at least two of the multiple applications, the transmission control section further shifting, in each period, priorities of the limited portion of the application packets to be transmitted in the specific TDD time slot.
    Type: Application
    Filed: February 18, 2022
    Publication date: May 2, 2024
    Inventors: Toshihisa Hyakudai, Satoshi Ota, Junya Yamada
  • Patent number: 11971842
    Abstract: A communication device includes a communication unit configured to transmit a serial signal group conforming to a serial peripheral interface (SPI) and transmitted from a master in synchronization with a clock to a communication partner device as a batch of data blocks within one frame period of a predetermined communication protocol, or transmit the serial signal group to the communication partner device as a plurality of data blocks divided according to a plurality of frame periods.
    Type: Grant
    Filed: August 18, 2021
    Date of Patent: April 30, 2024
    Assignee: Sony Semiconductor Solutions Corporation
    Inventors: Toshihisa Hyakudai, Junya Yamada, Satoshi Ota
  • Patent number: 11960434
    Abstract: A communication device includes: a communication unit that adds, to a set of data blocks including a serial signal group conforming to SPI transmitted from a master in synchronization with a clock, identification information for identifying the data blocks, and transmits the data blocks to a communication partner device within one frame period of a predetermined communication protocol, or adds, to data blocks each including a part of the serial signal group, identification information for identifying each of the data blocks, and transmits the data blocks to the communication partner device in a plurality of frame periods; and a storage unit that sequentially stores a predetermined number of data blocks transmitted from the master and outputs a data block transmitted from the communication partner device in response to the predetermined number of data blocks from the master and stored, to transmit the data block to the master.
    Type: Grant
    Filed: April 5, 2022
    Date of Patent: April 16, 2024
    Assignee: Sony Semiconductor Solutions Corporation
    Inventors: Toshihisa Hyakudai, Junya Yamada, Satoshi Ota
  • Publication number: 20240105565
    Abstract: A semiconductor device includes: an oscillator including external terminals disposed on a first face with a specific distance along a first direction; an integrated circuit including a first region formed with first electrode pads along one side, and a second region formed with second electrode pads on two opposing sides of the first region; a lead frame that includes terminals at a peripheral portion, and on which the oscillator and the integrated circuit are mounted such that the external terminals, the first and second electrode pads face in a substantially same direction and such that one side of the integrated circuit is substantially parallel to the first direction; a first bonding wire that connects one external terminal to one first electrode pad; a second bonding wire that connects one terminal of one lead frame to one second electrode pad; and a sealing member that seals all of the components.
    Type: Application
    Filed: December 11, 2023
    Publication date: March 28, 2024
    Applicant: LAPIS Semiconductor Co., Ltd.
    Inventors: Toshihisa SONE, Kazuya YAMADA, Akihiro TAKEI, Yuichi YOSHIDA, Kengo TAKEMASA
  • Publication number: 20240089074
    Abstract: Communication apparatus with correct audio signal regeneration are disclosed. In one example, a communication apparatus includes a counter that counts the number of a predetermined reference clock included in one cycle of a divided signal of an audio master clock with a frequency that is equal to a product of a frequency of a sampling clock for sampling of an audio signal and a multiplier on the basis of the audio master clock, a ratio of division of the divided signal and the predetermined reference clock. A packet generator generates a packet including the counted number counted, a bit width of SD (Serial Data) conforming to an I2S standard, the frequency of the sampling clock, the ratio of division of the divided signal to the audio master clock, a frequency ratio of the frequency of the audio master clock to the frequency of the sampling clock, and the SD.
    Type: Application
    Filed: February 3, 2022
    Publication date: March 14, 2024
    Inventors: Toshihisa Hyakudai, Junya Yamada, Satoshi Ota
  • Publication number: 20240078210
    Abstract: [Object] To perform serial communication at high speed by combining different communication methods with each other. [Solving Means] A communication apparatus includes a communicating unit configured to add identification information identifying a data block to one set of the data block including a serial signal group, the serial signal group being transmitted from a master in synchronism with a clock and complying with SPI (Serial Peripheral Interface), and transmit the one set of the data block to a communication partner apparatus within one frame period of a predetermined communication protocol, or add identification information identifying each of multiple data blocks to the multiple data blocks each including a part of the serial signal group and transmit the multiple data blocks to the communication partner apparatus in multiple frame periods.
    Type: Application
    Filed: February 3, 2022
    Publication date: March 7, 2024
    Inventors: Toshihisa Hyakudai, Junya Yamada, Satoshi Ota
  • Publication number: 20240012013
    Abstract: The present disclosure provides an apparatus (200) for checking stirring quality of a chemical analyzer (100). The apparatus includes a stirrer (202) configured to generate agitation of a test liquid (210) in a first cuvette (212). The apparatus includes a convection generator (208) configured to generate thermal convection of the test liquid. The thermal convection is generated due to temperature difference caused by providing different temperature to the first cuvette. The apparatus includes a photometric device (204) configured to radiate light through the test liquid and continuously generate an output signal upon receipt of the radiated light through the test liquid. Further, the apparatus includes a determination module (206) configured to determine photometric data associated with absorbance values of the test liquid. The determination module is configured to determine at least one metric representing the stirring quality of the test liquid based on the photometric data.
    Type: Application
    Filed: July 10, 2023
    Publication date: January 11, 2024
    Applicant: FURUNO ELECTRIC CO., LTD.
    Inventors: Yoshiki KAMIMOTO, Toshihisa YAMADA
  • Patent number: 5488770
    Abstract: A vehicle such as a railroad car is constructed by connecting together side and roof blocks, each equipped with interior components, in a manner to improve the outer appearance of the connections between the side and roof blocks. Longitudinal beams of the side blocks are in contact with the under surfaces of gutters formed by the outer plate of the roof block. The side and roof blocks, equipped with the interior components, are connected together at the gutter portions by a welding which can be conducted solely outside the vehicle. Inside the vehicle, the longitudinal beams and joints secured to the side blocks are connected to lateral beams of the roof block by rivets. Thereafter, a third interior plate is provided between interior plates of the side and roof blocks. Since the connections are formed at the gutter portions, the connecting operations can easily be conducted outside the vehicle and in a manner to assure a good outer appearance.
    Type: Grant
    Filed: June 1, 1994
    Date of Patent: February 6, 1996
    Assignee: Hitachi, Ltd.
    Inventors: Toshihisa Yamada, Toshiharu Miyamoto, Kazuo Hayashi, Ryoichi Takayama, Shinji Kobayashi, Keizi Ohmura
  • Patent number: 5333554
    Abstract: A vehicle such as a railroad car is constructed by connecting together side and roof blocks, each equipped with interior components, in a manner to improve the outer appearance of the connections between the side and roof blocks. Longitudinal beams of the side blocks are in contact with the under surfaces of gutters formed by the outer plate of the roof block. The side and roof blocks, equipped with the interior components, are connected together at the gutter portions by a welding which can be conducted solely from an exterior side of the vehicle. In the interior of the vehicle, the longitudinal beams and joints secured to the side blocks are connected to lateral beams of the roof block by rivets. Thereafter, a third interior plate is provided between interior plates of the side and roof blocks. Since the connections are formed at the gutter portions, the connecting operations can easily be conducted outside the vehicle and in a manner to assure a good from an exterior of appearance.
    Type: Grant
    Filed: April 24, 1992
    Date of Patent: August 2, 1994
    Assignee: Hitachi, Ltd.
    Inventors: Toshihisa Yamada, Toshiharu Miyamoto, Kazuo Hayashi, Ryoichi Takayama, Shinji Kobayashi, Keizi Ohmura