Abstract: An electric driver device provides a partial redundancy system that is at least partially redundant, or a full redundancy system. The electric driver device has a plurality of circuit systems. The electric driver device includes, in at least a part of the electric circuit, a common circuit extending over at least two of a plurality of circuit systems. The common circuit includes a power supply and/or a connection line that complements signals. At least one of the power supply circuit, an interface circuit, a power supply cutoff circuit, and a connector is not separated and independent from each other for each redundant circuit system.

Abstract: An electric driver device provides a partial redundancy system that is at least partially redundant, or a full redundancy system. The electric driver device has a plurality of circuit systems. The electric driver device includes, in at least a part of the electric circuit, a common circuit extending over at least two of a plurality of circuit systems. The common circuit includes a power supply and/or a connection line that complements signals. At least one of the power supply circuit, an interface circuit, a power supply cutoff circuit, and a connector is not separated and independent from each other for each redundant circuit system.

Abstract: An electronic apparatus includes a wiring board. The wiring board includes a wiring and a through-hole and is provided by dividing a multi-board providing board into the wiring board. The electronic apparatus further includes a circuit component having a surface mounting structure, mounted to the wiring board, and electrically connected to the wiring. A side wall of the wiring board has a cut portion that is provided when cutting and dividing the multi-board providing board. In the wiring board, the through-hole is formed adjacent to the cut portion without arranging the circuit component between the cut portion and the through-hole.

Abstract: An electric driver device provides a partial redundancy system that is at least partially redundant, or a full redundancy system. The electric driver device has a plurality of circuit systems. The electric driver device includes, in at least a part of the electric circuit, a common circuit extending over at least two of a plurality of circuit systems. The common circuit includes a power supply and/or a connection line that complements signals. At least one of the power supply circuit, an interface circuit, a power supply cutoff circuit, and a connector is not separated and independent from each other for each redundant circuit system.

Abstract: An electronic apparatus includes a wiring board. The wiring board includes a wiring and a through-hole and is provided by dividing a multi-board providing board into the wiring board. The electronic apparatus further includes a circuit component having a surface mounting structure, mounted to the wiring board, and electrically connected to the wiring. A side wall of the wiring board has a cut portion that is provided when cutting and dividing the multi-board providing board. In the wiring board, the through-hole is formed adjacent to the cut portion without arranging the circuit component between the cut portion and the through-hole.

Abstract: An electronic device includes a heat sink, where heat dissipating gel is interposed between the heat sink and a side of an electronic component, which is mounted on a substrate, opposite from the substrate. The electronic component includes an electrical conductor electrically connected to a chip, and an insulator portion that molds the chip with the electrical conductor. The heat sink includes a non-abutting surface that faces the electrical conductor of the electronic component, the heat dissipating gel interposed between the non-abutting surface and the electrical conductor, and an abutting surface that is positioned closer toward the substrate than the non-abutting surface is and abuttable with the insulator portion. Accordingly, when the abutting surface of the heat sink abuts the insulator portion of the electronic component, the non-abutting surface of the heat sink is prevented from abutting the electrical conductor of the electronic component.

Abstract: An electronic unit includes a heat sink, a substrate, a heating component, a temperature sensor, a first interconnection, and a second interconnection. The heat sink includes a strut. The substrate is fixed to the strut of the heat sink. The heating component is mounted on the substrate to generate heat upon energization of the heating component. The temperature sensor is mounted on the substrate to detect temperature. The first interconnection is provided in a high-temperature region in which the heating component is mounted on the substrate, and is connected to the strut of the heat sink. The second interconnection is provided in a detection region in which the temperature sensor is mounted on the substrate, and is provided separately from the first interconnection. The second interconnection is connected to the strut of the heat sink and the temperature sensor.

Abstract: A motor controller includes, in a microcomputer, a voltage fall determiner determining whether a reference voltage falls from a normal value based on an Analog-to-Digital (A/D) conversion value of a second voltage from an A/D converter, and a corrector (i) calculating a correction coefficient based on the A/D conversion value of the second voltage from the A/D converter and (ii) correcting an A/D conversion value of an input voltage that is output from the A/D converter. A core of the microcomputer generates a control signal based on an input voltage A/D conversion value, when the voltage fall determiner determines that the reference voltage is equal to or higher than a normal reference value. The motor controller keeps its motor control accuracy in such manner, even when a fall of an A/D conversion reference voltage is observed.

Abstract: An electronic element surface-mounted on a substrate has a leg part that protrudes from a back surface of the electronic element toward a heat sink along a peripheral portion of a back electrode. As such, if the substrate warps, the protruding leg part abuts a heat reception surface of the heat sink, thereby preserving an insulation gap between the back electrode and the heat sink. As a result, short-circuiting is prevented.

Abstract: A power source system provides: an electrical generator including a rectifying circuit configured by one or more rectifying diodes for allowing electric conduction from a ground side to a battery side; a fuse arranged between the electrical generator and a battery; and a driving apparatus including a circuit configured by one or more semiconductor elements having one or more parasitic diodes for allowing electrical conduction from the ground side to the battery side, and a load. The number of parasitic diodes to be connected in series between a ground and the fuse in the driving apparatus is larger than the number of rectifying diodes to be connected in series between the ground and the battery side in the electrical generator. In addition, the circuit switches electrical conduction in the load.

Abstract: An imaging apparatus for performing efficient signal processing depending on the operational mode. In the finder mode, a CCD interface 21a decimates horizontal components of image data supplied from an image generating unit 10 to one-third and moreover processes the decimated image data with data conversion and resolution conversion to produce Y, Cb and Cr image data which are routed to and written in an image memory 32 over a memory controller 22. In the recording mode, the CCD interface 21a causes the image data from the image generating unit 10 to be written in the image memory 32 via memory controller 22 after decimation and gamma correction etc. The camera DSP 21c reads out the image data via memory controller 22 from the image memory 32 to effect data conversion for writing the resulting data via memory controller 22 in the image memory 32.

Abstract: A heat radiation structure for an electric device includes: at least one multi-layer substrate including a plurality of base parts made of insulation material and a conductor pattern, which are stacked in a multi-layer structure so that the conductor pattern is electrically coupled with an interlayer connection portion in the base parts; the electric device having at least one of a first electric element built in the at least one multi-layer substrate and a second electric element, which is not built in the multi-layer substrate; and a low heat resistance element opposed to the electric device. The low heat resistance element has a heat resistance lower than the insulation material.

Abstract: A motor controller includes, in a microcomputer, a voltage fall determiner determining whether a reference voltage falls from a normal value based on an Analog-to-Digital (A/D) conversion value of a second voltage from an A/D converter, and a corrector (i) calculating a correction coefficient based on the A/D conversion value of the second voltage from the A/D converter and (ii) correcting an A/D conversion value of an input voltage that is output from the A/D converter. A core of the microcomputer generates a control signal based on an input voltage A/D conversion value, when the voltage fall determiner determines that the reference voltage is equal to or higher than a normal reference value. The motor controller keeps its motor control accuracy in such manner, even when a fall of an A/D conversion reference voltage is observed.

Abstract: An electronic unit includes a heat sink, a substrate, a heating component, a temperature sensor, a first interconnection, and a second interconnection. The heat sink includes a strut. The substrate is fixed to the strut of the heat sink. The heating component is mounted on the substrate to generate heat upon energization of the heating component. The temperature sensor is mounted on the substrate to detect temperature. The first interconnection is provided in a high-temperature region in which the heating component is mounted on the substrate, and is connected to the strut of the heat sink. The second interconnection is provided in a detection region in which the temperature sensor is mounted on the substrate, and is provided separately from the first interconnection. The second interconnection is connected to the strut of the heat sink and the temperature sensor.

Abstract: An electronic control unit is equipped with a semiconductor module having a semiconductor chip electrically connected to the first circuit pattern and the second circuit pattern. A resin body is wrapped around the semiconductor chip. A first metal plate has a side connected to the semiconductor chip and an other side connected to the first circuit pattern. A radiator projects toward and is connected to the first circuit pattern by a first heat conductor. As a result, heat generated by the semiconductor chip is transmitted to the radiator through the first metal plate, the first circuit pattern, and the first heat conductor during operation of the semiconductor module.

Abstract: In a control unit, a control part is operated by electric power from an ignition power supply, and controls operations of relays and inverters. A first end of a boosting part is electrically connected between at least one relay and a corresponding inverter. A second end of the boosting part is electrically connected to the control part. The boosting part boosts a voltage at the first end, and outputs the voltage boosted from the second end. An abnormality detecting portion detects an abnormality of the boosting part. When the abnormality detecting portion detects an abnormality of the boosting part, the control part controls the at least one relay to which the first end of the boosting part is connected to shut off a flow of electric power from a main power supply to the boosting part and to the inverter corresponding to the at least one relay.

Abstract: A power source system provides: an electrical generator including a rectifying circuit configured by one or more rectifying diodes for allowing electric conduction from a ground side to a battery side; a fuse arranged between the electrical generator and a battery; and a driving apparatus including a circuit configured by one or more semiconductor elements having one or more parasitic diodes for allowing electrical conduction from the ground side to the battery side, and a load. The number of parasitic diodes to be connected in series between a ground and the fuse in the driving apparatus is larger than the number of rectifying diodes to be connected in series between the ground and the battery side in the electrical generator. In addition, the circuit switches electrical conduction in the load.

Abstract: An imaging apparatus for performing efficient signal processing depending on the operational mode. In the finder mode, a CCD interface 21a decimates horizontal components of image data supplied from an image generating unit 10 to one-third and moreover processes the decimated image data with data conversion and resolution conversion to produce Y, Cb and Cr image data which are routed to and written in an image memory 32 over a memory controller 22. In the recording mode, the CCD interface 21a causes the image data from the image generating unit 10 to be written in the image memory 32 via memory controller 22 after decimation and gamma correction etc. The camera DSP 21c reads out the image data via memory controller 22 from the image memory 32 to effect data conversion for writing the resulting data via memory controller 22 in the image memory 32.

Abstract: An electronic device includes a heat sink, where heat dissipating gel is interposed between the heat sink and a side of an electronic component, which is mounted on a substrate, opposite from the substrate. The electronic component includes an electrical conductor electrically connected to a chip, and an insulator portion that molds the chip with the electrical conductor. The heat sink includes a non-abutting surface that faces the electrical conductor of the electronic component, the heat dissipating gel interposed between the non-abutting surface and the electrical conductor, and an abutting surface that is positioned closer toward the substrate than the non-abutting surface is and abuttable with the insulator portion. Accordingly, when the abutting surface of the heat sink abuts the insulator portion of the electronic component, the non-abutting surface of the heat sink is prevented from abutting the electrical conductor of the electronic component.

Abstract: An imaging apparatus for performing efficient signal processing depending on the operational mode. In the finder mode, a CCD interface 21a decimates horizontal components of image data supplied from an image generating unit 10 to one-third and moreover processes the decimated image data with data conversion and resolution conversion to produce Y, Cb and Cr image data which are routed to and written in an image memory 32 over a memory controller 22. In the recording mode, the CCD interface 21a causes the image data from the image generating unit 10 to be written in the image memory 32 via memory controller 22 after decimation and gamma correction etc. The camera DSP 21c reads out the image data via memory controller 22 from the image memory 32 to effect data conversion for writing the resulting data via memory controller 22 in the image memory 32.