Patents by Inventor Toshihumi Kojima

Toshihumi Kojima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Paste for filling throughhole and printed wiring board using same
    Patent number: 6706975
    Abstract: A paste for filling a throughhole, comprises: an epoxy resin; a curing agent; and a metal filler, wherein the metal filler is a powder comprising a base metal, and the curing agent is an imidazole compound represented by the following formula (1): wherein R1 represents a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, a hydroxyalkyl group having 1 to 10 carbon atoms or an alkyloxy group having 1 to 10 carbon atoms.
    Type: Grant
    Filed: July 13, 2001
    Date of Patent: March 16, 2004
    Assignee: NGK Spark Plug Co., Ltd.
    Inventors: Hiroshi Sumi, Toshihumi Kojima
  • Paste for filling throughhole and printed wiring board using same
    Publication number: 20020033275
    Abstract: A paste for filling a throughhole, comprises: an epoxy resin; a curing agent; and a metal filler, wherein the metal filler is a powder comprising a base metal, and the curing agent is an imidazole compound represented by the following formula (1): 1
    Type: Application
    Filed: July 13, 2001
    Publication date: March 21, 2002
    Applicant: NGK SPARK PLUG CO., LTD.
    Inventors: Hiroshi Sumi, Toshihumi Kojima