Patents by Inventor Toshiichi SAWAGUCHI

Toshiichi SAWAGUCHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11825632
    Abstract: The present invention provides a thermally conductive insulating sheet having appropriate fluidity upon being heated and pressurized, and free from of the possibility of a material leaking to the outside beyond the original size of the sheet. The thermally conductive insulating sheet according to the present invention contains an uncured material and/or a semi-cured material of a binder resin (R) which is a thermosetting resin. In the present invention, a complex viscosity in a temperature range of 100-200° C. is 10,000-150,000 Pa·s, a ratio (?/?) of the maximum value (?) to the minimum value (?) of the complex viscosity in said temperature range is 1.0-4.0, and the flow value is 90-100%. Flow value(%)=W2/W1×100.
    Type: Grant
    Filed: September 14, 2018
    Date of Patent: November 21, 2023
    Assignees: TOYO INK SC HOLDINGS CO., LTD., TOYOCHEM CO., LTD.
    Inventors: Toshiichi Sawaguchi, Naohiro Tanaka, Kaori Sakaguchi, Kenji Andou, Hidenobu Kobayashi
  • Patent number: 11407201
    Abstract: A composite member (1) satisfies the following expressions. X/(E×|CTE(B)?CTE(A)|)?50, X/(E×|CTE(B)?CTE(C)|)?50, Y/|CTE(B)?CTE(A)|×L(BA)?50, and Y/|CTE(B)?CTE(C)|×L(BC)?50. X: shear bond strength (MPa) between the heat dissipating base substrate and heat generating member, Y: fracture elongation of the thermoconductive insulating adhesive film, E: modulus of elasticity (MPa) of the thermoconductive insulating adhesive film, CTE(A): linear expansion coefficient (° C.?1) of the heat dissipating base substrate, CTE(B): linear expansion coefficient (° C.?1) of the thermoconductive insulating adhesive film, CTE(C): linear expansion coefficient (° C.
    Type: Grant
    Filed: August 13, 2018
    Date of Patent: August 9, 2022
    Assignees: TOYO INK SC HOLDINGS CO., LTD., TOYOCHEM CO., LTD.
    Inventors: Toshiichi Sawaguchi, Naohiro Tanaka, Kaori Sakaguchi, Kenji Andou, Hidenobu Kobayashi
  • Publication number: 20210129489
    Abstract: A composite member (1) satisfies the following expressions. X/(E×|CTE(B)?CTE(A)|)?50, X/(E×|CTE(B)?CTE(C)|)?50, Y/|CTE(B)?CTE(A)|×L(BA)?50, and Y/|CTE(B)?CTE(C)|×L(BC)?50. X: shear bond strength (MPa) between the heat dissipating base substrate and heat generating member, Y: fracture elongation of the thermoconductive insulating adhesive film, E: modulus of elasticity (MPa) of the thermoconductive insulating adhesive film, CTE(A): linear expansion coefficient (° C.?1) of the heat dissipating base substrate, CTE(B): linear expansion coefficient (° C.?1) of the thermoconductive insulating adhesive film, CTE(C): linear expansion coefficient (° C.
    Type: Application
    Filed: August 13, 2018
    Publication date: May 6, 2021
    Applicants: TOYO INK SC HOLDINGS CO., LTD., TOYOCHEM CO., LTD.
    Inventors: Toshiichi SAWAGUCHI, Naohiro TANAKA, Kaori SAKAGUCHI, Kenji ANDOU, Hidenobu KOBAYASHI
  • Patent number: 10759151
    Abstract: The purpose of the present invention is to provide a thermal conductive insulating sheet which has achieved a good balance between insulating properties and thermal conductivity higher than ever before. A thermal conductive insulating sheet according to the present invention contains a thermal conductive spherical filler (excluding boron nitride), a boron nitride filler and a binder resin, and has a plurality of layers (A) that mainly contain the thermal conductive spherical filler (excluding boron nitride) and one or more layers (B) that mainly contain the boron nitride filler, with the layers (A) and the layers (B) being alternately laminated so that layers (A) form the outermost layers.
    Type: Grant
    Filed: March 8, 2017
    Date of Patent: September 1, 2020
    Assignee: TOYO INK SC HOLDINGS CO., LTD.
    Inventors: Toshiichi Sawaguchi, Gaku Kashiwamura, Go Miyazawa
  • Publication number: 20200275581
    Abstract: The present invention provides a thermally conductive insulating sheet having appropriate fluidity upon being heated and pressurized, and free from of the possibility of a material leaking to the outside beyond the original size of the sheet. The thermally conductive insulating sheet according to the present invention contains an uncured material and/or a semi-cured material of a binder resin (R) which is a thermosetting resin. In the present invention, a complex viscosity in a temperature range of 100-200° C. is 10,000-150,000 Pa·s, a ratio (?/?) of the maximum value (?) to the minimum value (?) of the complex viscosity in said temperature range is 1.0-4.0, and the flow value is 90-100%. Flow value(%)=W2/W1×100.
    Type: Application
    Filed: September 14, 2018
    Publication date: August 27, 2020
    Applicants: TOYO INK SC HOLDINGS CO., LTD., TOYOCHEM CO., LTD.
    Inventors: Toshiichi SAWAGUCHI, Naohiro TANAKA, Kaori SAKAGUCHI, Kenji ANDOU, Hidenobu KOBAYASHI
  • Publication number: 20190077133
    Abstract: The purpose of the present invention is to provide a thermal conductive insulating sheet which has achieved a good balance between insulating properties and thermal conductivity higher than ever before. A thermal conductive insulating sheet according to the present invention contains a thermal conductive spherical filler (excluding boron nitride), a boron nitride filler and a binder resin, and has a plurality of layers (A) that mainly contain the thermal conductive spherical filler (excluding boron nitride) and one or more layers (B) that mainly contain the boron nitride filler, with the layers (A) and the layers (B) being alternately laminated so that layers (A) form the outermost layers.
    Type: Application
    Filed: March 8, 2017
    Publication date: March 14, 2019
    Applicant: TOYO INK SC HOLDINGS CO., LTD.
    Inventors: Toshiichi SAWAGUCHI, Gaku KASHIWAMURA, Go MIYAZAWA