Patents by Inventor Toshikaga Taguchi

Toshikaga Taguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10022897
    Abstract: A die structure has a first die, a second die that comes in contact with and separate from the first die, a heating unit provided in at least one of the first and second dies, and a transfer member provided in at least one of the first and second dies that brings a resin sheet supplied between the first and second dies into contact with a transfer surface and carrying out transfer molding, and a recess site formed on the transfer member near the transfer surface.
    Type: Grant
    Filed: February 8, 2013
    Date of Patent: July 17, 2018
    Assignee: OMRON Corporation
    Inventors: Isao Makuta, Koichi Takemura, Tomofusa Shibata, Yoshihisa Yamanaka, Norikazu Kitamura, Masayuki Shinohara, Kazuhide Hirota, Toshikaga Taguchi, Masayuki Kojima, Yukihiro Takahashi
  • Publication number: 20150251341
    Abstract: A die structure has a first die, a second die that comes in contact with and separate from the first die, a heating unit provided in at least one of the first and second dies, and a transfer member provided in at least one of the first and second dies that brings a resin sheet supplied between the first and second dies into contact with a transfer surface and carrying out transfer molding, and a recess site formed on the transfer member near the transfer surface.
    Type: Application
    Filed: February 8, 2013
    Publication date: September 10, 2015
    Applicant: OMRON CORPORATION
    Inventors: Isao Makuta, Koichi Takemura, Tomofusa Shibata, Yoshihisa Yamanaka, Norikazu Kitamura, Masayuki Shinohara, Kazuhide Hirota, Toshikaga Taguchi, Masayuki Kojima, Yukihiro Takahashi