Patents by Inventor Toshikatsu Ohitsu

Toshikatsu Ohitsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10707810
    Abstract: A piezoelectric oscillation device includes a piezoelectric vibration element, a heating element that heats the piezoelectric vibration element, an electronic component that is electrically connected to the piezoelectric vibration element, a substrate on which the piezoelectric vibrator, the heating element, and the electronic component are mounted, and a base member to which the substrate is attached with a prescribed spacing therebetween via a substrate holding member. The substrate holding member includes a conductive part. The conductive part has a lower thermal conductivity than metal.
    Type: Grant
    Filed: June 14, 2018
    Date of Patent: July 7, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Takuya Yamazaki, Toshikatsu Ohitsu, Hiroaki Kaida
  • Publication number: 20180302033
    Abstract: A piezoelectric oscillation device includes a piezoelectric vibration element, a heating element that heats the piezoelectric vibration element, an electronic component that is electrically connected to the piezoelectric vibration element, a substrate on which the piezoelectric vibrator, the heating element, and the electronic component are mounted, and a base member to which the substrate is attached with a prescribed spacing therebetween via a substrate holding member. The substrate holding member includes a conductive part. The conductive part has a lower thermal conductivity than metal.
    Type: Application
    Filed: June 14, 2018
    Publication date: October 18, 2018
    Inventors: TAKUYA YAMAZAKI, Toshikatsu Ohitsu, Hiroaki Kaida