Patents by Inventor Toshikatsu Sudo

Toshikatsu Sudo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11512386
    Abstract: A deposition apparatus for cutting tools with a coating film capable of depositing the coating film in an appropriate temperature condition is provided. The deposition apparatus includes: a deposition chamber in which a coating film is formed on the cutting tools; a pre-treatment chamber and post-treatment chamber, each of which is connected to the deposition chamber through a vacuum valve; and a conveying line that conveys the cutting tools from the pre-treatment chamber to the post-treatment chamber going through the deposition chamber, the in-line deposition apparatus using a conveyed carrier on which rods supporting cutting tools are provided in a standing state along a conveying direction. The deposition chamber includes: a deposition region; a conveying apparatus; a heating region; and a carrier-waiting region.
    Type: Grant
    Filed: August 13, 2020
    Date of Patent: November 29, 2022
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Masao Kawamura, Toshikatsu Sudo, Atsushi Shinboya
  • Publication number: 20200370166
    Abstract: A deposition apparatus for cutting tools with a coating film capable of depositing the coating film in an appropriate temperature condition is provided. The deposition apparatus includes: a deposition chamber in which a coating film is formed on the cutting tools; a pre-treatment chamber and post-treatment chamber, each of which is connected to the deposition chamber through a vacuum valve; and a conveying line that conveys the cutting tools from the pre-treatment chamber to the post-treatment chamber going through the deposition chamber, the in-line deposition apparatus using a conveyed carrier on which rods supporting cutting tools are provided in a standing state along a conveying direction. The deposition chamber includes: a deposition region; a conveying apparatus; a heating region; and a carrier-waiting region.
    Type: Application
    Filed: August 13, 2020
    Publication date: November 26, 2020
    Inventors: Masao Kawamura, Toshikatsu Sudo, Atsushi Shinboya
  • Patent number: 10781514
    Abstract: A deposition apparatus for cutting tools with a coating film capable of depositing the coating film in an appropriate temperature condition is provided. The deposition apparatus includes: a deposition chamber in which a coating film is formed on the cutting tools; a pre-treatment chamber and post-treatment chamber, each of which is connected to the deposition chamber through a vacuum valve; and a conveying line that conveys the cutting tools from the pre-treatment chamber to the post-treatment chamber going through the deposition chamber, the in-line deposition apparatus using a conveyed carrier on which rods supporting cutting tools are provided in a standing state along a conveying direction. The deposition chamber includes: a deposition region; a conveying apparatus; a heating region; and a carrier-waiting region.
    Type: Grant
    Filed: June 26, 2014
    Date of Patent: September 22, 2020
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Masao Kawamura, Toshikatsu Sudo, Atsushi Shinboya
  • Publication number: 20180016674
    Abstract: This deposition apparatus includes a deposition chamber which includes a deposition region for forming a coating film on an object to be coated, a conveying device which conveys a conveyed carrier supporting the object, and a bias power source which applies a bias voltage to the object via the conveyed carrier, in which a plurality of rods which support the object and rotate around axes are disposed in the conveyed carrier along a carrier conveying direction in an upright posture, a protrusion member protruding to the outside in a radial direction is provided on an outer peripheral surface of the rod, an interference member which catches the protrusion member of the conveyed carrier moving in the deposition chamber and rotates the rod around the axis is provided on a wall surface of the deposition chamber, and the interference member and the bias power source are electrically connected to each other.
    Type: Application
    Filed: January 30, 2015
    Publication date: January 18, 2018
    Inventors: Tomoyuki Masuno, Atsushi Shinboya, Toshikatsu Sudo, Masao Kawamura
  • Publication number: 20170137931
    Abstract: A deposition apparatus for cutting tools with a coating film capable of depositing the coating film in an appropriate temperature condition is provided. The deposition apparatus includes: a deposition chamber in which a coating film is formed on the cutting tools; a pre-treatment chamber and post-treatment chamber, each of which is connected to the deposition chamber through a vacuum valve; and a conveying line that conveys the cutting tools from the pre-treatment chamber to the post-treatment chamber going through the deposition chamber, the in-line deposition apparatus using a conveyed carrier on which rods supporting cutting tools are provided in a standing state along a conveying direction. The deposition chamber includes: a deposition region; a conveying apparatus; a heating region; and a carrier-waiting region.
    Type: Application
    Filed: June 26, 2014
    Publication date: May 18, 2017
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Masao Kawamura, Toshikatsu Sudo, Atsushi Shinboya
  • Patent number: 5576093
    Abstract: The present invention concerns a tungsten carbide base cutting tools formed on sintered hard alloy substrate material. Multiple hard coatings are deposited on the Co-enriched surface layers of the substrate material, and a maximum value of the Co concentration in a layer occurs within a distance of 50 .mu.m of the external surface of the substrate material, and this surface layer region is referred to as the denuded zone because the surface region is substantially free of carbides, carbonitrides and nitrides of Ti, Ta, and Nb containing W. The multilayer coating consists of a primary coating of TiCN, a secondary coating of Al.sub.2 O.sub.3 and the surface coating consisting of at least one of TiCN and TiN. The interface between the substrate material and the primary coating is provided with a first intermediate coating consisting of TiN. The interface between the primary coating and the secondary coating is provided with a second intermediate coating consisting of at least one layer of TiC, TiCO and TiCNO.
    Type: Grant
    Filed: September 7, 1994
    Date of Patent: November 19, 1996
    Assignee: Mitsubishi Materials Corporation
    Inventors: Hironori Yoshimura, Tetsuya Tanaka, Akira Osada, Toshikatsu Sudo
  • Patent number: 5372873
    Abstract: The present invention concerns a tungsten carbide base cutting tools formed on sintered hard alloy substrate material. Multiple hard coatings are deposited on the Co-enriched surface layers of the substrate material, and a maximum value of the Co concentration in a layer occurs within a distance of 50 .mu.m of the external surface of the substrate material, and this surface layer region is referred to as the denuded zone because the surface region is substantially free of carbides, carbonitrides and nitrides of Ti, Ta, and Nb containing W. The multilayer coating consists of a primary coating of TiCN, a secondary coating of Al.sub.2 O.sub.3 and the surface coating consisting of at least one of TiCN and TiN. The interface between the substrate material and the primary coating is provided with a first intermediate coating consisting of TiN. The interface between the primary coating and the secondary coating is provided with a second intermediate coating consisting of at least one layer of TiC, TiCO and TiCNO.
    Type: Grant
    Filed: October 22, 1992
    Date of Patent: December 13, 1994
    Assignee: Mitsubishi Materials Corporation
    Inventors: Hironori Yoshimura, Tetsuya Tanaka, Akira Osada, Toshikatsu Sudo