Patents by Inventor Toshikatsu Takada

Toshikatsu Takada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multilayer ceramic substrate for mounting of semiconductor device
    Patent number: 5196089
    Abstract: In a method of fabricating a multilayered interconnection for integrated circuit package, a coating of a metallized conductive pattern is formed on an upper surface of the substrate. A plurality of vertical copper studs are formed on the substrate for an interconnection with the metallized conductive pattern. A polyimide slurry is provided on the surface of the substrate to cover each top surface of the conductive studs. An upper surface of the polyimide slurry is polished to expose each top surface of the copper studs. A masking film is provided on each top surface of the copper studs prior to supplying an intermediate derivative of a polyimide polymer.
    Type: Grant
    Filed: August 28, 1991
    Date of Patent: March 23, 1993
    Assignee: Ngk Spark Plug Co., Ltd.
    Inventors: Toshikatsu Takada, Ryuji Imai, Rokuro Kambe