Abstract: Provided is a composition for a glass fiber which has a high elastic modulus and satisfactory productivity, and can facilitate the production of a fine-count glass fiber. The composition for a glass fiber of the present invention includes, as a glass composition expressed as a mass percent in terms of oxide, 50% to 70% of SiO2, 15% to 25% of Al2O3, 3% to 13% of MgO, 3% to 15% of CaO, and 0.5% to 5% of B2O3.

Abstract: A highly thermally conductive printed circuit board prevents electrochemical migration by inhibiting elution of copper ions. The printed circuit board is a metal-base printed circuit board including a metal base plate having an insulating resin layer and a copper foil layer stacked thereon in this order. In the printed circuit board, the insulating resin layer contains a first inorganic filler made of inorganic particles having particle diameters of 0.1 nm to 600 nm with an average particle diameter (D50) of 1 nm to 300 nm, and a second inorganic filler made of inorganic particles having particle diameters of 100 nm to 100 ?m with an average particle diameter (D50) of 500 nm to 20 ?m, and the first inorganic filler and the second inorganic filler are uniformly dispersed in the insulating resin layer.

Abstract: Provided is a composition for a glass fiber which has a high elastic modulus and satisfactory productivity, and can facilitate the production of a fine-count glass fiber. The composition for a glass fiber of the present invention includes, as a glass composition expressed as a mass percent in terms of oxide, 50% to 70% of SiO2, 15% to 25% of Al2O3, 3% to 13% of MgO, 3% to 15% of CaO, and 0.5% to 5% of B2O3.

Abstract: A highly thermally conductive printed circuit board prevents electrochemical migration by inhibiting elution of copper ions. The printed circuit board is a metal-base printed circuit board including a metal base plate having an insulating resin layer and a copper foil layer stacked thereon in this order. In the printed circuit board, the insulating resin layer contains a first inorganic filler made of inorganic particles having particle diameters of 0.1 nm to 600 nm with an average particle diameter (D50) of 1 nm to 300 nm, and a second inorganic filler made of inorganic particles having particle diameters of 100 nm to 100 ?m with an average particle diameter (D50) of 500 nm to 20 ?m, and the first inorganic filler and the second inorganic filler are uniformly dispersed in the insulating resin layer.

Abstract: A highly thermally conductive printed circuit board prevents electrochemical migration by inhibiting elution of copper ions. The printed circuit board is a metal-base printed circuit board including a metal base plate having an insulating resin layer and a copper foil layer stacked thereon in this order. In the printed circuit board, the insulating resin layer contains a first inorganic filler made of inorganic particles having particle diameters of 0.1 nm to 600 nm with an average particle diameter (D50) of 1 nm to 300 nm, and a second inorganic filler made of inorganic particles having particle diameters of 100 nm to 100 ?m with an average particle diameter (D50) of 500 nm to 20 ?m, and the first inorganic filler and the second inorganic filler are uniformly dispersed in the insulating resin layer.

Abstract: A highly thermally conductive printed circuit board prevents electrochemical migration by inhibiting elution of copper ions. The printed circuit board is a metal-base printed circuit board including a metal base plate having an insulating resin layer and a copper foil layer stacked thereon in this order. In the printed circuit board, the insulating resin layer contains a first inorganic filler made of inorganic particles having particle diameters of 0.1 nm to 600 nm with an average particle diameter (D50) of 1 nm to 300 nm, and a second inorganic filler made of inorganic particles having particle diameters of 100 nm to 100 ?m with an average particle diameter (D50) of 500 nm to 20 ?m, and the first inorganic filler and the second inorganic filler are uniformly dispersed in the insulating resin layer.

Abstract: A glass composition for a glass fiber includes, in terms of oxides by mass %, 45 to 65% of SiO2, 10 to 20% of Al2O3, 13 to 25% of B2O3, 5.5 to 9% of MgO, 0 to 10% of CaO, 0 to 1% of Li2O+Na2O+K2O, SrO, and BaO.

Abstract: A glass composition for a glass fiber includes, in terms of oxides by mass %, 45 to 65% of SiO2, 10 to 20% of Al2O3, 13 to 25% of B2O3, 5.5 to 9% of MgO, 0 to 10% of CaO, 0 to 1% of Li2O+Na2O+K2O, SrO, and BaO.

Abstract: A glass composition for glass fiber comprises, by mass percentage in terms of oxide, 60 to 75% SiO2, 0 to 10% Al2O3, 0 to 20% B2O3, 5 to 15% Li2O+Na2O+K2O, 0 to 10% MgO+CaO+SrO+BaO+ZnO, 0 to 10% TiO2 and 0 to 10% Zr02. A glass fiber consists of the above glass composition for glass fiber. A process for producing a glass fiber comprises the steps of melting the above glass composition in a heat-resistant vessel and continuously drawing out the molten glass through a heat-resistant nozzle so as to form a glass fiber; coating the surface thereof with a chemical; and continuously reeling the coated glass fiber. A composite material is obtained by compositing the glass fiber with an organic resin.

Abstract: The glass fiber of the present invention is formed of the glass composition including 50 to 60% SiO2, 0.1 to 10% Al2O3, 20 to 45% MgO+CaO+SrO+BaO, 0.5 to 20% TiO2, 0.1 to 10% ZrO2, and 0 to 2% Li2O+Na2O+K2O in terms of mol %, in which a BaO/CaO mol ratio is from 0.3 to 1.6.

Abstract: The glass fiber of the present invention is formed of the glass composition including 50 to 60% SiO2, 0.1 to 10% Al2O3, 20 to 45% MgO+CaO+SrO+BaO, 0.5 to 20% TiO2, 0.1 to 10% ZrO2, and 0 to 2% Li2O+Na2O+K20 in terms of mol %, in which a BaO/CaO mol ratio is from 0.3 to 1.6.