Patents by Inventor Toshikatu Takada

Toshikatu Takada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Filling material, multilayer wiring board, and process of producing multilayer wiring board
    Patent number: 7438969
    Abstract: A solvent-free filling material comprising a filler, a thermosetting resin, a curing agent, and a curing catalyst, wherein the thermosetting resin is an epoxy resin, and the curing agent is a dicyandiamide curing agent; a multilayer printed wiring board comprising a substrate, a through-hole, the filling material filling the through-hole, and a conductor layer formed on an exposed surface of the filling material in the through-hole; and a process for producing the multilayer printed wiring board.
    Type: Grant
    Filed: July 9, 2003
    Date of Patent: October 21, 2008
    Assignee: NGK Spark Plug Co., Ltd.
    Inventors: Toshifumi Kojima, Makoto Wakazono, Toshikatu Takada
  • Filling material, multilayer wiring board, and process of producing multilayer wiring board
    Publication number: 20040009335
    Abstract: A solvent-free filling material comprising a filler, a thermosetting resin, a curing agent, and a curing catalyst, wherein the thermosetting resin is an epoxy resin, and the curing agent is a dicyandiamide curing agent; a multilayer printed wiring board comprising a substrate, a through-hole, the filling material filling the through-hole, and a conductor layer formed on an exposed surface of the filling material in the through-hole; and a process for producing the multilayer printed wiring board.
    Type: Application
    Filed: July 9, 2003
    Publication date: January 15, 2004
    Applicant: NGK SPARK PLUG CO., LTD.
    Inventors: Toshifumi Kojima, Makoto Wakazono, Toshikatu Takada