Abstract: There is provided an adhesive composition for use in a flexible printed circuit board, comprising:(a) an epoxy resin having substantially at least two epoxy groups per molecule;(b) at least one selected from carboxyl group-containing nitrile rubber and carboxyl group-containing hydrogenated nitrile rubber; and(c) a curing agent which comprises aromatic amine having substantially at least two primary amino groups per molecule (c1) and dicyandiamide (c2), the molar ratio of the aromatic amine (c1) to the dicyandiamide (c2) being 35/65.ltoreq.(c1)/(c2).ltoreq.99/1.

Abstract: A laminated damping material comprises a layer of a thermosetting resin having vibration-damping properties as a core layer and two heat resistant films adhesive to the core layer, the core layer being sandwiched between these two heat resistant films. The damping material can be used for preparing a fiber-reinforced composite material which comprises at least one basic layer structure, outer layer/intermediate layer/core layer/intermediate layer/outer layer, the intermediate layer being formed from a heat resistant film having good adhesive properties to both outer and core layers and the core layer being formed from a thermosetting resin. The fiber-reinforced composite material exhibits high vibration-damping properties and accordingly can suitably be used, as a structural material, for the production of not only cars and equipments for leisure time amusement but also space structures such as artificial satellites and air planes.

Abstract: An adhesive composition for a vinyl halide resin is disclosed. This adhesive composition is formed by incorporating an aliphatic polyamine having a plurality or ether bonds, an alicyclic polyamine or an alkylene diamine into a blend of an epoxy resin and a vinyl chloride copolymer resin. This adhesive composition is effectively used in the solvent-free state for a molded body of a vinyl halide type resin such as a vinyl chloride resin or a vinylidene halide resin.

Abstract: Disclosed are a magnetic ribbon on at least one surface of which fine particles formed of a nonmagnetic inorganic substance having insulating properties are attached and a magnetic core around which this magnetic ribbon is wound or on which it is laminated. The fine particles serve as a spacer to form a layer of air between adjacent layers of the magnetic ribbon.

Abstract: An adhesive composition containing: (a) a nitrogen atom-free epoxy compound, (b) a poly N-glycidyl type epoxy resin, (c) a nitrile rubber having a carboxyl group, and optionally (d) a finely divided silica, a clay substance treated with an onium compound, or a mixture thereof. The compounding ratio by weight of the components (a), (b), (c) and (d) is as follows:0.05.ltoreq.(b)/(a).ltoreq.190.05.ltoreq.[(a)+(b)]/(c).ltoreq.1.750.0125.ltoreq.(d)/(c).ltoreq.0.75This adhesive composition has excellent adhesion strength, soldering heat resistance, flexibility, and chemical resistance, and has a small resin flow property.

Abstract: Novel tetrakis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionyloxymethyl)methane having a novel crystal structure characterized by the fact that its X-ray diffraction pattern obtained by X-ray analysis using Cu-K.sub..alpha. rays shown a sharp peak at a diffraction angle 2.theta.=10.90.degree.. The above compound can be prepared by (a) transesterifying methyl or ethyl 3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate with pentaerythritol in the presence of a compound of the formula ##STR1## wherein R.sub.1 and R.sub.2 each represent an alkyl group having 1 to 6 carbon atoms,(b) treating the resulting tetrakis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionyloxymethyl)methane with a lower alkanol capable of forming a molecular adduct compound therewith to convert it into the corresponding molecular adduct compound, and (c) recrystallizing the molecular adduct compound from ethanol as a solvent.